KR-20260065205-A - Optical Module with Maximized Heat Dissipation Efficiency

KR20260065205AKR 20260065205 AKR20260065205 AKR 20260065205AKR-20260065205-A

Abstract

A light module with maximized heat dissipation efficiency is disclosed. According to one aspect of the present embodiment, an optical module for transmitting and receiving optical signals of various different wavelengths to and from an optical fiber comprises: a first lens block that receives light incident on the optical fiber and adjusts its path to parallel light or receives light incident from the optical fiber and focuses it to an optical element; a thin film filter disposed on one surface of the first lens block and filters wavelength bands other than a preset wavelength band; a second lens block that focuses light passing through the first lens block to the optical fiber or receives light incident from the optical fiber and adjusts its path to parallel light; a receptacle that contacts the second lens block and enables light to be transmitted and received to an optical fiber within a connector to be coupled to one surface thereof; a flexible substrate that controls the operation of the optical element; and a lower housing and an upper housing that are coupled to each other and form a space between which the first lens block, the thin film filter, the second lens block, and the receptacle can be disposed and fixed, wherein the upper housing is in contact with the flexible substrate.

Inventors

송근한
이종호

Assignees

옵티시스 주식회사

Dates

Publication Date: 20260508
Application Date: 20241101

Claims (10)

In an optical module that transmits and receives optical signals of various different wavelengths with an optical fiber, A first lens block that receives light incident on the optical fiber and adjusts its path to parallel light, or receives light incident on the optical fiber and focuses it into a light element; A thin film filter disposed on one surface of the first lens block above, which filters wavelength bands other than a preset wavelength band; A second lens block that focuses light passing through the first lens block into the optical fiber, or receives light irradiated from the optical fiber and adjusts its path into parallel light; A receptacle that contacts the second lens block and enables light to be transmitted and received through an optical fiber within a connector to be coupled to one side thereof; A flexible substrate for controlling the operation of the above-mentioned optical element; and It includes a lower housing and an upper housing that are combined with each other to form a space between which the first lens block, the thin film filter, the second lens block, and the receptacle can be disposed and fixed. An optical module characterized in that the upper housing is in contact with the flexible substrate.
In paragraph 1, The above flexible substrate is, An optical module characterized by being implemented with an FPCB.
In paragraph 1, The upper housing above is, An optical module characterized by including a structure protruding toward the flexible substrate at the end where the flexible substrate is located.
In paragraph 3, The above-mentioned protruding structure is, An optical module characterized by being protruded in the form of the above-mentioned flexible substrate.
In paragraph 4, The upper housing above is, An optical module characterized by contacting the flexible substrate with a protruding structure.
In paragraph 1, An optical module characterized by further including a buffer material in contact with the flexible substrate.
In paragraph 6, The above cushioning material is, An optical module characterized by being implemented with a component having a thermal conductivity greater than or equal to a preset standard value.
In Paragraph 7, The above cushioning material is, An optical module characterized by being implemented in metal.
In paragraph 6, The above cushioning material is, An optical module characterized by dissipating heat generated on the above-mentioned flexible substrate.
In paragraph 6, The above cushioning material is, An optical module characterized by cushioning the shock transmitted to the flexible substrate.

Description

Optical Module with Maximized Heat Dissipation Efficiency This embodiment relates to an optical module that maximizes heat release efficiency. The content described in this section merely provides background information regarding the present embodiment and does not constitute prior art. Wavelength Division Multiplexing (WDM) and Demultiplexing are optical communication technologies designed to transmit and receive a larger number of signals using a single optical fiber. By utilizing WDM technology, the capacity of optical transmission devices can be increased by the number of wavelengths used. Consequently, this enables cost reduction in signal transmission systems and the construction of efficient networks. Much research has been conducted on the multiplexing and demultiplexing of optical signals in fields such as optical communication and optical integrated circuits. With the recent increase in data communication usage, the need for research and development of wavelength division multiplexers is on the rise. However, conventional optical modules that perform wavelength division multiplexing and demultiplexing have the disadvantage of being structurally difficult to dissipate heat. In particular, when an FPCB is included in the optical module, the FPCB is exposed to high temperatures for a long time, causing deformation in the FPCB. As a result, conventional optical modules could not avoid deformation of the FPCB, and consequently, problems such as misalignment of the optical axis have frequently occurred. FIG. 1 is a diagram illustrating the configuration of an optical module according to one embodiment of the present invention. FIG. 2 is a drawing illustrating a cross-section and operation example of an optical module according to one embodiment of the present invention. FIG. 3 is an enlarged view of a base and lens block according to one embodiment of the present invention. FIG. 4 is a diagram illustrating the configuration of a receptacle according to one embodiment of the present invention. FIG. 5 is a drawing illustrating the configuration of a lower housing according to one embodiment of the present invention. FIG. 6 is a drawing illustrating the configuration of an upper housing according to one embodiment of the present invention. The present invention is susceptible to various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Similar reference numerals have been used for similar components in the description of each drawing. Terms such as first, second, A, B, etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and/or" includes a combination of a plurality of related described items or any of a plurality of related described items. When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" should be understood as not precluding the existence or addition of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification. Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which this invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application. In addition, each component, process, procedure, or method included in each embodiment of the present invention may be shared within a scope that is not technically contradictory to one another. FIG. 1 is a diagram illustrating the configuration