KR-20260065293-A - EDGE POLISHING DRUM OF WAFER, EDGE POLISHING EQUIPMENT INCLUDING THE SAME, AND METHOD FOR POLISHING EDGE OF WAFER

KR20260065293AKR 20260065293 AKR20260065293 AKR 20260065293AKR-20260065293-A

Abstract

The present invention provides an edge polishing drum for a wafer comprising: a plurality of first polishing units provided in a first body portion at the top; a plurality of second polishing units provided in a second body portion at the bottom; a driving unit for rotating the first body portion and the second body portion; and a plurality of third polishing units provided in at least one of the first body portion and the second body portion, wherein each of the first to third polishing units comprises a central axis, a weight connected to one side of the central axis, and a polishing portion connected to the other side of the central axis, and a control unit for adjusting the distance between the central axis and the weight.

Inventors

김보은
이형락

Assignees

에스케이실트론 주식회사

Dates

Publication Date: 20260508
Application Date: 20241101

Claims (15)

A plurality of first polishing units provided in the first body portion of the upper part; A plurality of second polishing units provided in the second body portion of the lower part; A driving unit for rotating the first body part and the second body part; and It includes a plurality of third polishing units provided in at least one of the first body part and the second body part, and The first to third polishing units above are, respectively, The central axis and, A weight connected to one side of the central axis, and It includes a polishing part connected to the other side of the above-mentioned center, and A wafer edge polishing drum equipped with a control unit for adjusting the distance between the central axis and the weight.
In Article 1, The above central axis is a servo motor, and The above servo motor and the above weight are connected by a screw to a wafer edge polishing drum.
In Article 1, The above central axis is an air cylinder, and A wafer edge polishing drum in which the distance between the weight and the air cylinder changes by the pressurization of the air cylinder.
In Article 1, In the first polishing unit above, The above central axis is fixed to the first body part, and The above weight is provided on the first body part, and The above polishing part is a wafer edge polishing drum provided below the first body part.
In Article 1, In the above second polishing unit, The above central axis is fixed to the above second body part, and The above weight is provided below the second body part, and The above polishing part is a wafer edge polishing drum provided on the second body part.
In Article 1, In the above third polishing unit, The above central axis is fixed to the first body part or the second body part, and The above weight is provided above the first body part or below the second body part, and The polishing part is an edge polishing drum for a wafer provided below the first body part or above the second body part.
In Article 1, The first polishing unit, the second polishing unit, and the third polishing unit are each provided with four units, and A wafer edge polishing drum having the first to third polishing units alternately provided one by one around the perimeter of the area between the first body part and the second body part.
In Article 1, A polishing pad is provided in each of the polishing portions of the first polishing unit and the second polishing unit, and The polishing surface of the above polishing pad is an edge polishing drum of a wafer that is inclined with respect to the axis connecting the first body part and the second body part.
In Article 1, The above-mentioned third polishing unit is equipped with a polishing pad, and The polishing surface of the polishing pad is an edge polishing drum of a wafer provided parallel to the axis connecting the first body part and the second body part.
In Article 1, The above plurality of first polishing units and second polishing units are, A wafer edge polishing drum provided symmetrically with respect to the center of the area to be polished between the first body part and the second body part.
An edge polishing drum for a wafer according to any one of claims 1 to 10; and A wafer edge polishing equipment comprising: a wafer support chuck spaced apart and facing the lower surface of the second body part of the wafer edge polishing drum.
In Article 11, The first body part and the second body part rotate around a first rotation axis connecting the first body part and the second body part, and The wafer support chuck rotates around a second rotation axis, and The above first rotation axis and second rotation axis are aligned wafer edge polishing equipment.
A step of receiving a target profile of the edge region of the wafer; A step of determining the amount of polishing on the upper, lower, and side surfaces of the edge region of the wafer according to the above profile; and The method includes the step of polishing the upper, lower, and side surfaces of the edge region of the wafer with different polishing pads, The above different polishing pads are each provided in a plurality of first to third polishing units, and A method for polishing the edge of a wafer in which the pressure applied from each polishing pad varies according to the rotation of the first to third polishing units.
In Article 13, The first to third polishing units above are, respectively, The central axis and, A weight connected to one side of the central axis, and It includes a polishing part connected to the other side of the above-mentioned center and equipped with the above-mentioned polishing pad, A method for polishing the edge of a wafer in which, in the first to third polishing units, the centrifugal force caused by the rotation of the weight changes when the distance between the central axis and the weight changes.
In Article 14, A method for polishing the edge of a wafer in which the pressure applied by the polishing pad changes when the centrifugal force caused by the rotation of the above weight changes.

Description

Edge polishing drum of wafer, edge polishing equipment including the same, and method for polishing the edge of wafer The present invention relates to a wafer edge polishing drum, a wafer edge polishing equipment including the same, and a wafer edge polishing method. More specifically, it relates to a wafer edge polishing drum that polishes the edge front bevel and the edge back bevel among the edge regions of a wafer, and a wafer edge polishing equipment including the same. A single crystal silicon wafer can be manufactured through a single crystal growing process, a slicing process to obtain a thin, disc-shaped wafer by slicing an ingot, an edge grinding process to process the outer edge of the wafer obtained by the slicing process to prevent breakage or distortion, a lapping process to improve the flatness of the wafer by removing mechanical damage remaining on the wafer, a polishing process to mirror-surface the wafer, and a cleaning process to remove abrasives or foreign substances attached to the polished wafer. After the edge grinding process described above, an edge polishing process is performed to mirror-finish the rough surface of the edge region of the wafer. When polishing the edge region of a wafer, the edge is polished using a device called an edge polishing drum. However, the shapes of the edges of the wafer that have undergone the edge grinding process may vary slightly, and therefore, even if edge polishing is performed with an edge polishing drum of a uniform shape, the shapes of the edge regions of the polished wafer may vary. The edge polishing drum is equipped with polishing units that polish the apex of the edge region of the wafer, as well as the front bevel and back bevel portions, respectively. Each of these polishing units is equipped with a polishing pad to independently polish the apex, front bevel, and back bevel portions of the wafer. However, the conventional wafer edge polishing drum described above has the following problems. Since each customer may have different needs regarding the profile of the wafer edge region, it may be necessary to vary the degree of polishing of the wafer edge region. Therefore, if the target profile of the wafer edge region changes, there is a problem in that the edge polishing drum must be replaced accordingly. FIG. 1 is a drawing showing a wafer edge polishing equipment according to one embodiment of the present invention, and FIGS. 2a to 2c are drawings showing the change in distance between the central axis and the weight according to the rotation of the first polishing unit equipped in the edge polishing equipment of the wafer of FIG. 1, and FIG. 3 is a drawing showing a third polishing unit equipped in the edge polishing equipment of the wafer of FIG. 1, and FIG. 4 is a diagram showing the arrangement of the first to third polishing units in a wafer edge polishing equipment, and FIGS. 5 and 6 are drawings showing the change in pressure applied to the edge region of a wafer on a polishing pad according to the change in the distance between the central axis and the weight of the first and second polishing units, and FIG. 7 is a flowchart of a method for polishing the edge of a wafer according to one embodiment of the present invention. Hereinafter, to specifically explain the present invention, examples of embodiments will be described, and to facilitate understanding of the invention, the invention will be described in detail with reference to the accompanying drawings. However, embodiments according to the present invention may be modified in various other forms, and the scope of the present invention should not be interpreted as being limited to the embodiments described below. The embodiments of the present invention are provided to more fully explain the present invention to those with average knowledge in the art. Additionally, relational terms such as "first" and "second," "upper" and "lower," etc., used below, may be used solely to distinguish one entity or element from another, without necessarily requiring or implying any physical or logical relationship or order between such entities or elements. The wafer edge polishing drum according to the present invention, the wafer edge polishing equipment including the same, and the wafer edge polishing method each include a first and third polishing unit, each comprising a central axis, a weight connected to one side of the central axis, and a polishing part connected to the other side of the central axis, and the distance between the central axis and the weight is adjusted according to the target profile of the wafer edge region, so that the pressure applied to the front bevel or back bevel of the wafer edge region by the first and third polishing pads is different, thereby allowing the wafer edge region to be polished according to the target profile. FIG. 1 is a drawing showing a wafer edge polishing equipment according to one embodiment of the present invention. A wafer edge polishing dev