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KR-20260065296-A - Wafer Cleaning Apparatus

KR20260065296AKR 20260065296 AKR20260065296 AKR 20260065296AKR-20260065296-A

Abstract

The present invention relates to a wafer cleaning device and achieves the effect of smoothly supplying the surfactant to the edge portion of the wafer by changing the discharge direction of the surfactant flowing into the water tank to the edge direction of the wafer.

Inventors

  • 김재일

Assignees

  • 에스케이실트론 주식회사

Dates

Publication Date
20260508
Application Date
20241101

Claims (12)

  1. A tank containing a cleaning solution and including at least one inlet on the bottom surface; A plurality of wafer mounting portions provided on the bottom surface of the above tank and reciprocating in the vertical direction; A supply pipe connected to the above inlet and supplying a surfactant to the water tank through the above inlet; and A diffusion unit provided in the above tank and diffusing the surfactant supplied from the above inlet toward the outside of the above tank; including, Wafer cleaning device.
  2. In paragraph 1, The above diffusion unit is, A supply nozzle formed to protrude upward from the above-mentioned inlet, with the upper part closed and a plurality of injection holes formed on the side; including, Wafer cleaning device.
  3. In paragraph 2, A plurality of vortex prevention members provided on the bottom surface and formed to extend outwardly from the side of the supply nozzle; including, Wafer cleaning device.
  4. In paragraph 3, The above plurality of vortex prevention members are, One end is connected to the outer wall of the above-mentioned tank and the other end is connected to the side of the above-mentioned supply nozzle, and is connected between the plurality of injection holes. Wafer cleaning device.
  5. In paragraph 1, The above diffusion unit is, A diffusion plate formed at a set distance from the above-mentioned inlet; and A support member formed protruding from the bottom surface and formed around the inlet, and spaced from the inlet by a set distance; including, Wafer cleaning device.
  6. In paragraph 5, A plurality of vortex prevention members provided on the bottom surface and formed to extend outwardly from the support member; including, Wafer cleaning device.
  7. In paragraph 1, The above diffusion unit is, A diffusion plate formed at a set distance from the above-mentioned inlet; and A support member provided longitudinally inside the spray nozzle, wherein at least a portion is exposed to the water tank and the diffusion plate is provided at one end; including, Wafer cleaning device.
  8. In Paragraph 7, A plurality of vortex prevention members provided on the bottom surface and extending outwardly from the diffusion plate; including, Wafer cleaning device.
  9. In paragraph 1, A plurality of vortex prevention members provided on the bottom surface and formed extending outward from the center of the inlet; including, Wafer cleaning device.
  10. In Paragraph 9, The above diffusion unit is, A diffusion plate provided on the upper part of the plurality of vortex prevention parts; including, Wafer cleaning device.
  11. In any one of paragraphs 5 through 10, The above diffusion plate is, A diameter equal to the inner diameter of the above inlet, Wafer cleaning device.
  12. In paragraph 1, The wafer mounting portion above is, The upper end is conical in shape, and a plurality of them are provided spaced apart in the circumferential direction around the inlet. Wafer cleaning device.

Description

Wafer Cleaning Apparatus The present invention relates to a wafer cleaning device. Wafers formed by slicing single-crystal silicon ingots undergo a mirror polishing process to be produced as mirror-surfaced wafers with high flatness. The mirror polishing process of wafers is typically performed by a CMP device, and chemical or particle contamination occurs on the wafer surface due to mechanical and chemical polishing. Such contaminants must be completely removed through a cleaning process. The wafer is placed in a water bath containing DIW (De-ionized Water), and a surfactant is supplied from the bottom to hydrophilize the wafer and remove residual particles. Conventionally, a surfactant is supplied vertically through an inlet formed on the bottom surface of a water tank and comes into contact with the surface of a wafer, and the surfactant in contact with the wafer is diffused to the edge portion of the wafer as its direction is changed horizontally by the wafer. This cleaning method has a problem in that the edge portion of the wafer is not cleaned well because the surfactant is supplied vertically and then gradually spreads to the edge portion of the wafer while hitting the bottom of the wafer. Therefore, measures to resolve the above-mentioned problem are currently required. The matters described above as background technology are intended only to enhance understanding of the background of the present invention and should not be construed as an acknowledgment that they constitute prior art already known to those skilled in the art. FIG. 1 is a drawing illustrating a wafer cleaning device according to a first embodiment of the present invention. FIG. 2 is a top view of a wafer cleaning device according to a first embodiment of the present invention. Figure 3 is a cross-sectional view of A-A in Figure 2. FIG. 4 is a drawing illustrating a wafer cleaning device according to a second embodiment of the present invention. FIG. 5 is a top view of a wafer cleaning device according to a second embodiment of the present invention. FIG. 6 is a drawing illustrating a wafer cleaning device according to a third embodiment of the present invention. FIG. 7 is a top view of a wafer cleaning device according to a third embodiment of the present invention. FIG. 8 is a drawing illustrating a wafer cleaning device according to a fourth embodiment of the present invention. FIG. 9 is a top view of a wafer cleaning device according to a fourth embodiment of the present invention. The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated and described in the drawings. However, this is not intended to limit the invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Terms including ordinal numbers, such as “first,” “second,” etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. The term “and/or” is used to include any combination of the multiple items in question. For example, “A and/or B” means including all three cases, such as “A,” “B,” and “A and B.” When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. In the description of the embodiments, the statement that each layer (film), region, pattern, or structure is formed "on" or "under" the substrate, each layer (film), region, pad, or pattern includes both direct formation and formation through another layer. The criteria for "on" or "under" are based on the appearance depicted in the drawings for convenience and are used merely to indicate the relative positional relationship between components for convenience; they should not be understood as limiting the actual positions of the components. For example, "on B" merely indicates that B is depicted on A in the drawings unless otherwise stated or if, due to the attributes of A or B, A must be positioned on B. In actual products, B may be positioned under A, or B and A may be arranged side by side. Additionally, the thickness or size of each layer (film), region, pattern, or structure in the drawings may be modified for clarity and convenience of explanation, so they do not fully reflect the actual size. The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearl