KR-20260065298-A - Wafer Polishing Apparatus

KR20260065298AKR 20260065298 AKR20260065298 AKR 20260065298AKR-20260065298-A

Abstract

The present invention relates to a device for polishing a wafer, and achieves the effect of preventing the slurry from being lost between the head parts due to centrifugal force during wafer polishing by supplying the slurry from the center of the head part.

Inventors

윤상균
강경인

Assignees

에스케이실트론 주식회사

Dates

Publication Date: 20260508
Application Date: 20241101

Claims (10)

A platen equipped with a plurality of actuators including a rotation axis; A plurality of head parts provided at the lower part of the above-mentioned upper plate and installed on the rotation axis; A plurality of carriers, each installed in the plurality of head sections and having a plurality of wafers attached to their lower surfaces; A lower plate provided at the bottom of the upper plate above; A polishing pad attached to the upper surface of the above-mentioned lower plate; and A supply nozzle that supplies a slurry to a plurality of wafers provided between the carrier and the polishing pad by penetrating the upper platen, the head portion, and the carrier; including, Wafer polishing device.
In paragraph 1, A first through hole formed in the above-mentioned upper plate; A second through hole formed in the head portion and communicating with the first through hole; and A third through hole formed in the carrier and communicating with the second through hole; including more, Wafer polishing device.
In paragraph 2, The above-mentioned first through hole is, A rotating shaft formed on the plurality of actuators, Wafer polishing device.
In paragraph 2, The above second through hole is, formed by penetrating the central axis of the head portion, Wafer polishing device.
In paragraph 2, The above third through hole is, formed by penetrating the central axis of the above carrier, Wafer polishing device.
In paragraph 5, The above carrier is, The above plurality of wafers are installed along the circumferential direction, and The above third through hole is, formed between the above plurality of wafers, Wafer polishing device.
In paragraph 6, The above plurality of wafers are, At least five are installed circumferentially on the above carrier, Wafer polishing device.
In paragraph 6, The above plurality of wafers are, When attached to and arranged in the circumferential direction on the above carrier, the spacing between the plurality of wafers is less than or equal to a set spacing, Wafer polishing device.
In paragraph 2, The above supply nozzle is, A structure formed extending to the first through hole, the second through hole, and the third through hole. Wafer polishing device.
In Paragraph 9, The above supply nozzle is, The end is positioned spaced upward from the lower end of the third through hole, Wafer polishing device.

Description

Wafer Polishing Apparatus The present invention relates to a device for polishing a wafer. Wafers used as materials for producing electronic components such as semiconductors are produced through steps such as a slicing process to cut an ingot into wafer units, a lapping process to improve flatness while polishing to a desired wafer thickness, an etching process to remove internal damage to the wafer, a polishing process to improve surface mirror finish and flatness, and a cleaning process to remove contaminants from the wafer surface. The wafer polishing device includes an upper platen and a lower platen. During the wafer polishing process, the slurry is supplied onto a polishing pad provided on the lower platen through a nozzle provided on the upper surface of the upper platen, and the slurry seeps into the space between the polishing pad and the wafer by the centrifugal force generated by the rotation of the upper platen and the carrier provided on the upper platen, thereby allowing the polishing of the wafer cross-section to proceed. In conventional wafer polishing devices, the slurry is supplied from the center of the upper platen, but in this case, the slurry is lost between the head portions provided on the upper platen, causing a problem of increased slurry usage. In addition, problems such as uneven processing flatness of the wafer occur as the slurry is not supplied uniformly. Therefore, there is a need for a new type of wafer polishing device to solve the aforementioned problems. The matters described above as background technology are intended only to enhance understanding of the background of the present invention and should not be construed as an acknowledgment that they constitute prior art already known to those skilled in the art. FIG. 1 is a drawing illustrating a wafer polishing device according to an embodiment of the present invention. FIG. 2 is a drawing showing the head unit and carrier installed on a second motor provided on an upper plate in a wafer polishing device according to an embodiment of the present invention. FIG. 3 is a bottom view showing a wafer installed on an upper plate in a wafer polishing device according to an embodiment of the present invention. FIG. 4 is a drawing showing the end of a slurry supply pipe positioned spaced apart from the lower surface of a carrier in a wafer polishing device according to an embodiment of the present invention. The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated and described in the drawings. However, this is not intended to limit the invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Terms including ordinal numbers, such as “first,” “second,” etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. The term “and/or” is used to include any combination of the multiple items in question. For example, “A and/or B” means including all three cases, such as “A,” “B,” and “A and B.” When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between. In the description of the embodiments, the statement that each layer (film), region, pattern, or structure is formed "on" or "under" the substrate, each layer (film), region, pad, or pattern includes both direct formation and formation through another layer. The criteria for "on" or "under" are based on the appearance depicted in the drawings for convenience and are used merely to indicate the relative positional relationship between components for convenience; they should not be understood as limiting the actual positions of the components. For example, "on B" merely indicates that B is depicted on A in the drawings unless otherwise stated or if, due to the attributes of A or B, A must be positioned on B. In actual products, B may be positioned under A, or B and A may be arranged side by side. Additionally, the thickness or size of each layer (film), region, pattern, or structure in the drawings may be modified for clarity and convenience of explanation, so they do not fully reflect the actual size. The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "h