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KR-20260065347-A - MULTILAYER ELECTRONIC COMPONENT

KR20260065347AKR 20260065347 AKR20260065347 AKR 20260065347AKR-20260065347-A

Abstract

A stacked electronic component according to one embodiment of the present invention comprises: a body including a dielectric layer and an internal electrode alternately arranged with the dielectric layer in a first direction, and a cover portion arranged on both ends of the first direction of the capacitance forming portion; and an external electrode arranged on the body; wherein the cover portion comprises titanium (Ti), gallium (Ga), and magnesium (Mg), and when the number of moles of gallium (Ga) per 100 moles of titanium (Ti) of the cover portion is denoted as CG and the number of moles of magnesium (Mg) per 100 moles of titanium (Ti) of the cover portion is denoted as CM, the condition 0.2 ≤ CG/CM < 1.00 can be satisfied.

Inventors

  • 심대진
  • 김재원
  • 박정진
  • 박정진
  • 이종호

Assignees

  • 삼성전기주식회사

Dates

Publication Date
20260508
Application Date
20241101

Claims (11)

  1. A body comprising a dielectric layer and an internal electrode alternately arranged with the dielectric layer in a first direction, a capacitance forming part, and a cover part arranged on both ends of the first direction of the capacitance forming part; and Includes an external electrode disposed on the above body; and The above cover portion comprises titanium (Ti), gallium (Ga), and magnesium (Mg), and when CG is the number of moles of gallium (Ga) per 100 moles of titanium (Ti) in the cover portion, and CM is the number of moles of magnesium (Mg) per 100 moles of titanium (Ti) in the cover portion, satisfying 0.2 ≤ CG/CM < 1.0 Stacked electronic components.
  2. In paragraph 1, The above CG satisfies 0.3 mol ≤ CG ≤ 1.0 mol Stacked electronic components.
  3. In paragraph 1, The above CM satisfies 1.0 mole ≤ CM ≤ 2.0 mole Stacked electronic components.
  4. In paragraph 1, The above cover portion has a composition different from the above dielectric layer. Stacked electronic components.
  5. In paragraph 1, The dielectric layer comprises titanium (Ti), and when DG is the number of moles of gallium (Ga) per 100 moles of titanium (Ti) in the dielectric layer, satisfying DG < CG Stacked electronic components.
  6. In paragraph 5, The above DG satisfies 0 mole ≤ DG < 0.1 mole Stacked electronic components.
  7. In paragraph 1, The above cover portion includes a plurality of dielectric crystal grains, and The average size of the plurality of dielectric crystal grains included in the above cover portion is 150 nm or more and 250 nm or less. Stacked electronic components.
  8. In paragraph 1, The above cover portion includes a plurality of dielectric crystal grains, and The size variation of the plurality of dielectric crystal grains included in the above cover portion is 80 nm or less. Stacked electronic components.
  9. In paragraph 1, The above cover portion includes a plurality of dielectric grains, grain boundaries disposed between the adjacent dielectric grains, and n-midpoints disposed at points where three or more grain boundaries meet. At least one of the above grain boundaries and n-midpoints comprises a secondary phase including at least one of gallium (Ga) and magnesium (Mg) and titanium (Ti). Stacked electronic components.
  10. In Paragraph 9, The above secondary phase has an atomic percentage of gallium (Ga) relative to 100 at% titanium (Ti) of 2 at% or more and 5 at% or less. Stacked electronic components.
  11. In Paragraph 9, The above secondary phase has an atomic percentage of magnesium (Mg) relative to 100 at% titanium (Ti) of 5 at% or more and 15 at% or less. Stacked electronic components.

Description

Multilayer Electronic Components The present invention relates to a stacked electronic component. A Multi-Layered Ceramic Capacitor (MLCC), a type of multilayer electronic component, is a chip-shaped capacitor mounted on the printed circuit boards of various electronic products—such as video devices like Liquid Crystal Displays (LCDs) and Plasma Display Panels (PDPs), computers, smartphones, and mobile phones—that serves to charge or discharge electricity. These multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being compact, guaranteeing high capacitance, and being easy to mount. As various electronic devices, such as computers and mobile devices, become smaller and more powerful, the demand for miniaturization and high capacitance in multilayer ceramic capacitors is increasing. As miniaturization and capacitance increase, the need to protect the capacitance-forming region is growing; this is being improved by adding a margin region surrounding the capacitance-forming area. However, as structural designs are continuously modified to achieve miniaturization and high capacitance, the capacitance-forming region expands while the margin region protecting it shrinks, raising concerns that the moisture resistance reliability and strength of multilayer ceramic capacitors may become compromised. To improve this, the grain size in the cover region is designed to be small and uniform; however, while reducing the grain size improves dielectric strength characteristics, it may lead to a side effect where reduced densification causes an increase in pores and consequently decreases reliability. FIG. 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. Figure 2 schematically illustrates an exploded view showing the stacked structure of the internal electrode. Figure 3 schematically illustrates a cross-sectional view along I-I' of Figure 1. Figure 4 schematically illustrates a cross-sectional view according to II-II' of Figure 1. FIG. 5 schematically illustrates a cross-sectional view according to II-II' of FIG. 1 according to another embodiment of the present invention. Figure 6a is a transmission electron microscope (TEM) image of a cross-section of the cover portion, Figure 6b is an image of the same cross-section of the cover portion mapped with magnesium (Mg) in TEM-EDS mode, and Figure 6c is an image of the same cross-section of the cover portion mapped with gallium (Ga) in TEM-EDS mode. FIG. 7a is an image of a pore observed in a cross-section of the cover portion of a comparative example, and FIG. 7b is an image of a pore observed in a cross-section of the cover portion of an example. FIG. 8a is a graph showing the number of pores (ea) observed in the cross-section of the cover portion of the comparative example and the example, and FIG. 8b is a graph showing the porosity (%) observed in the cross-section of the cover portion of the comparative example and the example. FIG. 9a is a transmission electron microscope (TEM) image of the cross-section of the cover portion of the comparative example before firing, and FIG. 9b is a transmission electron microscope (TEM) image of the cross-section of the cover portion of the example before firing. FIG. 10a is a transmission electron microscope (TEM) image of the cross-section of the cover portion and capacitance forming portion of the comparative example, and FIG. 10b is a transmission electron microscope (TEM) image of the cross-section of the cover portion and capacitance forming portion of the embodiment. FIG. 11a is a graph of the moisture resistance reliability evaluation of a comparative example, and FIG. 11b is a graph of the moisture resistance reliability evaluation of an example. FIG. 12a is an image showing the cross-section of the cover portion of the comparative example captured by a transmission electron microscope (TEM) and the observed dielectric grains separated by a program, and FIG. 12b is an image showing the cross-section of the cover portion of the example captured by a transmission electron microscope (TEM) and the observed dielectric grains separated by a program. Embodiments of the present invention will be described below with reference to specific embodiments and the attached drawings. However, embodiments of the present invention may be modified in various different forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements. Furthermore, in order to clearly explain the invention in the drawings, parts unrelated to the explanation are omitted, an