KR-20260065395-A - Micro light emitting display apparatus and method of manufacturing the same

KR20260065395AKR 20260065395 AKR20260065395 AKR 20260065395AKR-20260065395-A

Abstract

A micro-luminescent display device and a method for manufacturing the same are disclosed. The disclosed micro-emissive display device may include a first light-emitting part and a second light-emitting part spaced apart from each other on a backplane substrate, a bonding layer disposed between the backplane substrate and the first light-emitting part, and a first bonding pillar disposed between the backplane substrate and the second light-emitting part such that the second light-emitting part is located at a different height from the first light-emitting part.

Inventors

최준희
공기호
김낙현
김선일

Assignees

삼성전자주식회사

Dates

Publication Date: 20260508
Application Date: 20241101

Claims (20)

A backplane substrate including at least one driving element; A first light-emitting part and a second light-emitting part provided spaced apart from each other on the above-mentioned backplane substrate; A bonding layer disposed between the above-mentioned backplane substrate and the above-mentioned first light-emitting part; A micro-luminescent display device comprising: a first bonding pillar disposed between the backplane substrate and the second light-emitting part such that the second light-emitting part is located at a different height from the first light-emitting part.
In paragraph 1, A micro light-emitting display device wherein the first bonding column is disposed between the bonding layer and the second light-emitting part and has a shape protruding from the bonding layer toward the second light-emitting part.
In Article 1, A micro light-emitting display device in which the material of the first bonding pillar is a polymer-based material.
In Article 1, A micro light-emitting display device in which the material of the first bonding pillar is the same as the material of the bonding layer.
In paragraph 1, The first light-emitting unit comprises a first electrode, a first semiconductor layer, a first active layer emitting light of a first wavelength, a second semiconductor layer, and a second electrode, which are stacked in order in a direction perpendicular to the backplane substrate. The second light-emitting unit comprises a third electrode, a third semiconductor layer, a second active layer emitting light of a second wavelength different from the first wavelength, a fourth semiconductor layer, and a fourth electrode, which are stacked in order in a direction perpendicular to the backplane substrate. The first electrode has a width greater than that of the first semiconductor layer, includes a first open surface exposed from the first semiconductor layer, and is connected to the at least one driving element. A micro light-emitting display device, wherein the third electrode has a width greater than that of the third semiconductor layer and includes a second open surface exposed from the third semiconductor layer, and is connected to the at least one driving element.
In Article 5, A micro-luminescent display device in which the first bonding pillar has a width greater than the width of the second active layer of the second light-emitting part.
In Article 5, A micro-luminescent display device in which the first bonding pillar has a width equal to the width of the third electrode layer.
In Article 5, A micro light-emitting display device further comprising a first conductive layer configured such that at least one driving element is electrically connected to a first open surface and a second open surface corresponding to each of the above.
In paragraph 8, The apparatus further includes a flattening layer covering the first conductive layer, the first light-emitting part, and the second light-emitting part, and A micro light-emitting display device configured such that the planarization layer exposes the upper surface of the first light-emitting part and the upper surface of the second light-emitting part.
In Paragraph 9, A micro light-emitting display device further comprising a second conductive layer disposed to contact the upper surface of the first light-emitting part exposed through the planarization layer and the upper surface of the second light-emitting part.
In Paragraph 10, A first lens disposed on the first light-emitting part and having a convex shape at the top, and A micro light-emitting display device comprising a second lens disposed on the second light-emitting part and having a convex shape at the top.
In Article 9, The flattening layer includes a first hole that exposes the upper surface of the first light-emitting part, and A micro-luminescent display device further comprising a reflective layer disposed on the side of the first hole.
In Article 1, A micro light-emitting display device including an uneven surface on the upper surface of the first light-emitting part and the second light-emitting part.
In Article 1, A third light-emitting part spaced apart from the second light-emitting part on the backplane substrate; and A micro-luminescent display device further comprising: a second bonding pillar disposed between the backplane substrate and the third luminescent part such that the third luminescent part is located at a different height from the first luminescent part and the second luminescent stacked structure.
Step of placing a bonding layer on a backplane substrate; A step of placing a first light-emitting part on a portion of the upper surface of the bonding layer; A step of arranging a second bonding layer to cover the first light-emitting part and the bonding layer; A step of placing a second light-emitting part on a portion of the upper surface of the second bonding layer; and A method for manufacturing a micro light-emitting display device, comprising the step of etching the second bonding layer so that a first bonding pillar is formed at the lower part of the second light-emitting part.
In paragraph 15, The step of arranging the first light-emitting part is, A step of forming a first epitaxial structure by sequentially stacking a second semiconductor layer, a first active layer, a first semiconductor layer, and a first electrode on a first epitaxial substrate; A step of inverting the first epitaxial structure and placing it on the bonding layer; A step of removing the first epitaxial substrate of the first epitaxial structure; A step of forming a second electrode on the first epitaxial structure; and The method includes the step of etching the first epitaxial structure so that a first light-emitting part is disposed on a portion of the upper surface of the bonding layer; The step of arranging the second light-emitting part is, A step of forming a second epitaxial structure by sequentially stacking a fourth semiconductor layer, a second active layer, a third semiconductor layer, and a third electrode on a second epitaxial substrate; A step of inverting the second epitaxial structure and placing it on the second bonding layer; A step of removing the second epitaxial substrate of the second epitaxial structure; A step of forming a fourth electrode on the second epitaxial structure; and A method for manufacturing a micro-luminescent display device, comprising the step of etching the second epitaxial structure so that a second light-emitting part is disposed on a portion of the upper surface of the second bonding layer.
In Paragraph 16, It includes at least one driving element of the above-mentioned backplane, and The first light-emitting unit comprises a first electrode, a first semiconductor layer, a first active layer emitting light of a first wavelength, a second semiconductor layer, and a second electrode, which are sequentially stacked on a portion of the upper surface of the junction layer. The second light-emitting unit comprises a third electrode, a third semiconductor layer, a second active layer emitting light of a second wavelength different from the first wavelength, a fourth semiconductor layer, and a fourth electrode, which are sequentially stacked on a portion of the upper surface of the second junction layer. The first electrode has a width greater than that of the first semiconductor layer and includes a first open surface exposed from the first semiconductor layer, The third electrode has a width greater than that of the third semiconductor layer and includes a second open surface exposed from the third semiconductor layer, A method for manufacturing a micro-luminescent display device, further comprising the step of forming a first conductive layer that electrically connects at least one driving element to each of the first electrode and the second electrode.
In Paragraph 17, A step of forming a flattening layer covering the first conductive layer, the first light-emitting part, and the second light-emitting part, and patterning a first hole exposing the second electrode of the first light-emitting part and a second hole exposing the fourth electrode of the second light-emitting part in the flattening layer; and A method for manufacturing a micro-luminescent display device comprising the step of forming a second conductive layer positioned to contact a second electrode exposed through the first hole and a fourth electrode exposed through the second hole.
In Paragraph 18, A method for manufacturing a micro light-emitting display device, further comprising the step of forming a first lens having a convex shape at the top and filling the first hole, and a second lens having a convex shape at the top and filling the second hole.
In Paragraph 19, A method for manufacturing a micro-luminescent display device, further comprising the step of forming a reflective layer on the side of the first hole before forming the first lens.

Description

Micro light emitting display apparatus and method of manufacturing the same An exemplary embodiment relates to a micro-luminescent display device for displaying color images and a method for manufacturing the same. Liquid crystal displays (LCDs) and organic light emitting diodes (OLEDs) are widely used as display devices. In addition, technology for manufacturing high-resolution display devices using micro light emitting diodes (micro LEDs) has recently been gaining attention. Light emitting diodes (LEDs) have the advantages of low power consumption and being environmentally friendly. Due to these advantages, industrial demand is increasing. LED displays that utilize these micro LEDs as direct pixels are being developed, and commercialization is also underway. LED display pixels can be designed in various ways, and recently, various technologies involving the vertical stacking of red-emitting micro-LEDs (R-LEDs), green-emitting micro-LEDs (G-LEDs), and blue-emitting micro-LEDs (B-LEDs) have been introduced. However, satisfactory results regarding efficiency or bonding have not yet been achieved in the vertical stacking of micro-LEDs. FIG. 1 schematically illustrates an example of a micro light-emitting display device according to an embodiment. FIG. 2 is a schematic plan view illustrating an example of a micro light-emitting display device according to an embodiment. FIG. 3 schematically illustrates another example of a micro light-emitting display device according to an embodiment. FIG. 4 illustrates an example in which a third light-emitting part is further provided in the micro light-emitting display device illustrated in FIG. 1. Figure 5 is a simplified diagram illustrating the electrode connection structure of the micro light-emitting display device of Figure 4. FIG. 6 is a drawing illustrating another example of a micro light-emitting display device according to an embodiment. FIG. 7 is a drawing illustrating another example of a micro light-emitting display device according to an embodiment. FIG. 8 illustrates an example of a pixel structure of a micro-emissive display device according to an exemplary embodiment. FIG. 9 illustrates another example of a pixel structure of a micro-emissive display device according to an exemplary embodiment. FIG. 10 is a flowchart illustrating a method for manufacturing a micro-luminescent display device according to an exemplary embodiment. FIGS. 11a to 11g are schematic diagrams illustrating a method for manufacturing a micro-luminescent display device according to an embodiment. FIGS. 12a to 12d schematically illustrate the step of placing a first light-emitting part on a bonding layer. FIGS. 13a and FIGS. 13b are schematic diagrams illustrating the step of placing a second light-emitting part on a first bonding layer. FIGS. 14a and FIGS. 14b are schematic diagrams illustrating the step of placing a third light-emitting part on a second bonding layer. FIGS. 15a to 15h are drawings for explaining a method of forming an electrode connection structure of a micro light-emitting display device according to one embodiment. FIG. 16 is a block diagram of an electronic device including a display device according to an exemplary embodiment. FIG. 17 illustrates an example in which an electronic device according to an exemplary embodiment is applied to a mobile device. FIG. 18 illustrates an example in which a display device according to an exemplary embodiment is applied to a vehicle. FIG. 19 illustrates an example in which a display device according to an exemplary embodiment is applied to augmented reality glasses or virtual reality glasses. FIG. 20 illustrates an example in which a display device according to an exemplary embodiment is applied to a large signage. FIG. 21 illustrates an example in which a display device according to an exemplary embodiment is applied to a wearable display. Hereinafter, a micro-emissive display device and a method for manufacturing the same according to various embodiments will be described in detail with reference to the attached drawings. In the following drawings, the same reference numerals refer to the same components, and the size of each component in the drawings may be exaggerated for clarity and convenience of explanation. Terms such as "first," "second," etc., may be used to describe various components, but the components should not be limited by these terms. The terms are used solely for the purpose of distinguishing one component from another. A singular expression includes a plural expression unless the context clearly indicates otherwise. Furthermore, when a part is described as "comprising" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. Additionally, the size or thickness of each component in the drawings may be exaggerated for clarity of explanation. Furthermore, when a specific material layer is described as existing on a