KR-20260065401-A - Method for inspecting ejector head and ejector head

KR20260065401AKR 20260065401 AKR20260065401 AKR 20260065401AKR-20260065401-A

Abstract

The present invention relates to an ejector head inspection method and an ejector head that enables the inspection of the mounting direction and the coordinates of the center point of a replaced ejector head using a vision device, and may include: (a) a step of replacing an ejector head of a die ejecting device; (b) a step of verifying the mounting direction of the replaced ejector head if verification of the mounting direction is required; (c) a step of photographing the ejector head using a vision device and calculating the coordinates of the center point of the ejector head by recognizing the outer arc line of the ejector head in the photographed image; and (d) a step of aligning the ejector head within the reference range or correcting the position information of the ejector head if the calculated coordinates of the center point and the normal coordinates deviate from a reference range.

Inventors

김창진
김낙호

Assignees

세메스 주식회사

Dates

Publication Date: 20260508
Application Date: 20241101

Claims (10)

(a) A step of replacing the ejector head of the die ejecting device; (b) a step of verifying the mounting direction of the replaced ejector head if verification of the mounting direction of the ejector head is required; (c) a step of photographing the ejector head using a vision device, and recognizing the outer arc line of the ejector head in the photographed image to calculate the coordinates of the center point of the ejector head; and (d) If the calculated coordinates of the center point and the normal coordinates fall outside the reference range, align the ejector head within the reference range or correct the position information of the ejector head; An ejector head inspection method including
In Article 1, The above step (b) is, (b-1) A step of checking whether the replaced ejector head is a pin type or an air type; (b-2) In the case of a pin type, a step of image recognition of an identification mark (Fiducial Mark) in an image of the ejector head captured using the vision device; and (b-3) A step of outputting a normal signal when the identification mark in the captured image is positioned at a normal angle, and outputting an abnormal signal to enable replacement when it is not at a normal angle; An ejector head inspection method including
In Article 2, In the above (b-2) step, The above identification mark is an angle indicator dot marked on the upper edge portion of the ejector head in any one of the directions of front (0 degrees), right (90 degrees), rear (180 degrees) and left (270 degrees), in an ejector head inspection method.
In Article 1, The above step (c) is, (c-1) A step of photographing the upper surface of the ejector head using the vision device; (c-2) identifying at least a portion of the outer arc line of the ejector head in the captured image; and (c-3) A step of calculating the coordinates of a center point having the same radius as at least three points of the outer arc line using the curvature of the identified outer arc line; An ejector head inspection method including
In Article 4, In the above (c-2) step, An ejector head inspection method in which the outer arc line is the outermost line of the ejector head or an arc-shaped groove line formed on the upper surface of the ejector head.
In Article 4, In the above (c-2) step, An ejector head inspection method in which the length of the outer arc line of the photographed ejector head is at least 1/8 arc length and no more than 1/2 arc length based on the entire arc.
In Article 1, (e) A step of identifying and registering images of the aligned ejector heads by type using the vision device; An ejector head inspection method further comprising
In Article 7, (f) a step of performing horizontal alignment (tilt alignment) and height alignment of the inspected ejector head; An ejector head inspection method further comprising
In Article 8, (g) A step of performing a die ejecting operation using the aligned ejector head; An ejector head inspection method further comprising
An ejector head body formed to be replaceable on the ejector body; and It includes an identification mark (Fiducial Mark) formed on the upper surface of the ejector head body so that it can be recognized as an image by a vision device, and The above identification mark is an ejector head, the above identification mark being an angle indicator dot marked on the upper edge portion of the ejector head in any one of the directions of front (0 degrees), right (90 degrees), rear (180 degrees), and left (270 degrees).

Description

Method for inspecting ejector head and ejector head The present invention relates to an ejector head inspection method and an ejector head, and more specifically, to an ejector head inspection method and an ejector head that enables the mounting direction and center point coordinates of a replaced ejector head to be inspected using a vision device. Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the wafer can be divided into a plurality of dies through a dicing process, and the dies can be bonded onto the substrate through a bonding process. The device for performing the above die bonding process may include a pickup module for picking up the dies from a dicing tape and a bonding module for bonding the picked-up dies onto a substrate. At this time, the dies may be selectively separated from the dicing tape by a die ejecting device. Generally, the die ejecting device may comprise an ejector that pushes the die upward to separate the die from the dicing tape, an ejector head that is replaceable depending on the type of wafer or die package, and an ejector body including a drive unit for raising and lowering the ejector head or a housing that accommodates the same. Conventional die ejecting devices establish an unmanned tool change system by automatically replacing collets or ejector heads through an auto tool change process; however, there were problems in that it was very difficult to inspect and verify cases where, for instance, the replaced ejector head was replaced abnormally due to a misaligned mounting direction or where the center point of the ejector head deviated from its correct position. FIG. 1 is a schematic diagram showing a die ejecting device of a die bonding device according to some embodiments of the present invention. FIG. 2 is a cross-sectional view schematically showing the stage of the die ejecting device of FIG. 1. FIG. 3 is a cross-sectional view schematically showing the ejector of the die ejecting device of FIG. 1. FIG. 4 is a side view showing the ejector head and ejector body of the die ejecting device of FIG. 1. FIG. 5 is a plan view showing a pin-type ejector head that can be applied to the die ejecting device of FIG. 4. FIG. 6 is a plan view showing an air-type ejector head that can be applied to the die ejecting device of FIG. 4. FIG. 7 is a flowchart illustrating an ejector head inspection method according to some embodiments of the present invention. Figure 8 is a flowchart showing step (b) of the ejector head inspection method of Figure 7 in more detail. FIG. 9 is a flowchart showing step (c) of the ejector head inspection method of FIG. 7 in more detail. FIG. 10 is a flowchart illustrating an ejector head inspection method according to some other embodiments of the present invention. Hereinafter, several preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The embodiments of the present invention are provided to more fully explain the invention to those skilled in the art, and the following embodiments may be modified in various different forms, and the scope of the invention is not limited to the following embodiments. Rather, these embodiments are provided to make the disclosure more faithful and complete and to fully convey the spirit of the invention to those skilled in the art. In addition, the thickness or size of each layer in the drawings is exaggerated for convenience and clarity of explanation. The terms used herein are for describing specific embodiments and are not intended to limit the invention. As used herein, the singular form may include the plural form unless the context clearly indicates otherwise. Additionally, as used herein, "comprise" and/or "comprising" specify the presence of the mentioned features, numbers, steps, actions, parts, elements, and/or groups thereof, and do not exclude the presence or addition of one or more other features, numbers, actions, parts, elements, and/or groups. Hereinafter, embodiments of the present invention are described with reference to drawings that schematically illustrate ideal embodiments of the present invention. In the drawings, variations of the illustrated shapes may be expected, for example, depending on manufacturing techniques and/or tolerances. Accordingly, embodiments of the inventive concept should not be interpreted as being limited to specific shapes of the areas illustrated herein, but should include, for example, variations in shape resulting from manufacturing. FIG. 1 is a schematic diagram showing a die ejecting device (100) of a die bonding device (1) according to some embodiments of the present invention, FIG. 2 is a schematic cross-sectional view showing a stage (40) of the die ejecting device (100) of FIG. 1, and FIG. 3 is a schematic cross-sectional view showing an ejector head replacement device (200) of the die eject