KR-20260065514-A - APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFER

Abstract

The present disclosure describes a cleaning system using a cleaning solution generated by a cooling system, wherein a second flow rate of a second liquid coolant is based on the temperature of a second die. The cleaning system comprises: a cooling system configured to generate a cleaning solution; a controller configured to control the temperature of the cleaning solution; a wafer holder configured to hold and rotate a wafer; a first nozzle located above the wafer and configured to spray the cleaning solution onto the upper surface of the wafer; and a second nozzle located below the wafer and configured to spray the cleaning solution onto the lower surface of the wafer.

Inventors

• 첸 옌-하오
• 리 펭-타오
• 수 융-룽
• 추앙 웬-퉁

Assignees

• 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드

Dates

Publication Date

20260508

Application Date

20251014

Priority Date

20250411

Claims (10)

1. As a device, A wafer holder configured to hold and rotate a wafer; A first nozzle positioned on the wafer and configured to spray a first cleaning solution onto the upper surface of the wafer—the first cleaning solution is generated by a cooling system and the first temperature of the first cleaning solution is below room temperature—; and A second nozzle located below the wafer and configured to spray a second cleaning solution onto the lower surface of the wafer—the second cleaning solution is generated by the cooling system and the second temperature of the second cleaning solution is below room temperature— A device including
2. In paragraph 1, A device further comprising a third nozzle configured to be located below the wafer and to spray the second cleaning solution onto the lower surface of the wafer, wherein the second nozzle and the third nozzle are located on opposite sides of the wafer holder.
3. In paragraph 1, A device further comprising a pipe connecting the first nozzle to the cooling system, wherein the pipe is configured to deliver the first cleaning liquid to the first nozzle.
4. In paragraph 3, A device further comprising a valve configured to control the flow rate of the first cleaning liquid that is on the pipe and delivered to the first nozzle.
5. In paragraph 1, A device further comprising a pipe connecting the second nozzle to the cooling system, wherein the pipe is configured to deliver the second cleaning liquid to the second nozzle.
6. In paragraph 1, A device wherein the first temperature and the second temperature are each in the range of 5 ℃ to 15 ℃.
7. In paragraph 1, A first temperature sensor disposed on the first nozzle and configured to measure the first temperature; and A second temperature sensor disposed on the second nozzle and configured to measure the second temperature A device that further includes
8. In paragraph 1, A device in which the difference between the first temperature and the second temperature is in the range of 0 ℃ to 5 ℃.
9. As a method, Step of loading a wafer into a cleaning device; A step of generating a cleaning solution having a temperature below room temperature using a cooling system; A step of delivering the cleaning solution to a first nozzle above the wafer and a second nozzle below the wafer; and A step of cleaning the upper surface of the wafer with the cleaning solution using the first nozzle and the lower surface of the wafer with the cleaning solution using the second nozzle. A method including
10. As a system, A cooling system configured to generate a cleaning solution; A controller configured to control the temperature of the above cleaning solution; A wafer holder configured to hold and rotate a wafer; A first nozzle configured to be positioned on the wafer and to spray the cleaning solution onto the upper surface of the wafer; and A second nozzle located below the wafer and configured to spray the cleaning solution onto the lower surface of the wafer. A system including

Description

Apparatus and Method for Cleaning Semiconductor Wafer [Cross-references related to this institution] The present application is incorporated herein by reference in its entirety and claims the benefit of U.S. provisional application 63/715,401, filed on November 1, 2024, with the title of the invention “Apparatus and Method for Cleaning Semiconductor Wafer”. The present invention relates to an apparatus and method for cleaning a semiconductor wafer. Advancements in semiconductor technology have led to increasing demands for greater storage capacity, faster processing systems, higher performance, and lower costs. To meet these demands, the semiconductor industry continues to scale down the dimensions of semiconductor devices, such as MOSFETs, fin field effect transistors (FinFETs), gate-all-around field effect transistors (GAAFETs), and nanostructured transistors. This scaling down has increased the complexity of the semiconductor manufacturing process and increased defects during production. The cleaning process is a critical step in the manufacturing process for cleaning semiconductor wafers (e.g., silicon wafers). The yield of silicon wafers is inversely proportional to the defect density (e.g., cleanliness and particle count) from wafer processing. The purpose of the wafer cleaning process is to remove chemical and particulate impurities without altering or damaging the wafer. The aspects of the present disclosure are best understood through the following detailed description when read together with the accompanying drawings. FIG. 1 illustrates a cross-sectional view of a cleaning system using a cleaning liquid generated by a cooling system according to some embodiments. FIGS. 2, 3, and 4 illustrate partial cross-sectional views of a cooling system according to some embodiments. FIG. 5 is a flow diagram of a method for cleaning a wafer using a cleaning system that uses a cleaning solution generated by a cooling system according to some embodiments. FIG. 6 is a flow diagram of a cleaning process for cleaning a wafer with a cleaning solution generated by a cooling system according to some embodiments. FIG. 7 illustrates an exemplary computer system in which a plurality of embodiments of the present disclosure can be implemented. Exemplary embodiments will now be described with reference to the accompanying drawings. In the drawings, similar reference numerals generally indicate identical, functionally similar, and/or structurally similar elements. The following description provides a number of different embodiments or examples for implementing different features of the provided subject matter. To simplify the disclosure, specific embodiments of components and arrangements are described below. These specific embodiments are, of course, merely illustrative and are not intended to be limiting. For example, in the following description, the formation of a first feature on a second feature may include an embodiment in which the first feature and the second feature are formed and in direct contact, or an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature do not come into direct contact. As used herein, forming a first feature on a second feature means that the first feature is formed in direct contact with the second feature. Additionally, the disclosure may repeat reference numbers and/or letters in a number of embodiments. Such repetition does not, in itself, indicate a relationship between the various embodiments and/or configurations discussed. Additionally, spatial terms such as "below," "under," "low," "high," and "upper" may be used herein for convenience of description to indicate the relationship of a feature to one element or another, as illustrated in the drawings. Spatial terms are intended to include different orientations of the device in use or operation in addition to the orientation illustrated in the drawings. The device may be oriented differently (rotated 90 degrees or other orientations), and accordingly, spatially relative descriptions used herein may be interpreted in the same way. References in the specification such as “one embodiment,” “an embodiment,” “an exemplary embodiment,” or “an embodiment” indicate that while the described embodiment may include specific features, structures, or characteristics, not all embodiments necessarily include specific features, structures, or characteristics. Furthermore, these phrases do not necessarily refer to the same embodiment. Additionally, when specific features, structures, or characteristics are described in relation to an embodiment, it would be within the knowledge of a person skilled in the art to achieve such features, structures, or characteristics in relation to other embodiments, regardless of whether they are explicitly described. In order for the terms or usage of this specification to be understood by a person skilled in the art with