KR-20260065549-A - LASER COMPRESSION BONDING DEVICE

KR20260065549AKR 20260065549 AKR20260065549 AKR 20260065549AKR-20260065549-A

Abstract

A laser compression bonding device comprises: a carrier for placing a substrate; a transparent compression head for holding and displacing an electronic component—the transparent compression head includes a central portion for pressing the electronic component against the substrate through the solder material when the electronic component is placed on the substrate through the solder material, and a peripheral portion surrounding the central portion—; a laser source for heating the solder material by emitting a laser beam toward the carrier through at least the central portion of the transparent compression head so that the electronic component is bonded onto the substrate through the solder material; and a heat spreader attached to the peripheral portion of the transparent compression head, wherein the heat spreader includes a liquid channel for receiving a liquid, and the liquid flows within the liquid channel to exchange heat with the transparent compression head.

Inventors

박, 종찬
민, 형석

Assignees

스태츠 칩팩 매니지먼트 피티이. 엘티디.

Dates

Publication Date: 20260508
Application Date: 20251029
Priority Date: 20241101

Claims (13)

As a laser compression bonding device, A carrier for placing a substrate; A transparent compression head for holding and displacing an electronic component - the transparent compression head comprises a central portion for pressing the electronic component against the substrate through the solder material when the electronic component is placed on the substrate through the solder material, and a peripheral portion surrounding the central portion -; A laser source that emits a laser beam toward the carrier through at least the central portion of the transparent compression head to heat the solder material so that the electronic component is bonded onto the substrate through the solder material; and A laser compression bonding device comprising a heat spreader attached to the peripheral portion of the transparent compression head, wherein the heat spreader comprises a liquid channel for receiving a liquid, and the liquid flows within the liquid channel to exchange heat with the transparent compression head.
In claim 1, the laser compression bonding device, wherein the heat spreader surrounds the central portion of the transparent compression head.
A laser compression bonding device according to claim 1, wherein the liquid is a cooling liquid for cooling the transparent compression head.
A laser compression bonding device according to claim 1, wherein the liquid comprises a cooling liquid for cooling the transparent compression head or a heating liquid for heating the transparent compression head.
In paragraph 1, A laser compression bonding device further comprising a liquid source fluidly coupled to the liquid channel to supply liquid to the liquid channel and discharge liquid from the liquid channel after heat exchange between the liquid in the liquid channel and the transparent compression head.
A laser compression bonding device according to claim 1, wherein the transparent compression head comprises a front surface facing the laser source and a rear surface opposite to the front surface, and the heat spreader is attached to the front surface or the rear surface of the transparent compression head.
A laser compression bonding device according to claim 1, wherein the transparent compression head comprises a front surface facing the laser source and a rear surface opposite to the front surface, and the heat spreader is attached to the front surface and the rear surface of the transparent compression head.
In claim 1, the heat spreader is a laser compression bonding device formed of an opaque material.
A laser compression bonding device according to claim 8, wherein the heat spreader is arranged to block the irradiation of a laser beam onto a peripheral area of the substrate where the solder material is not present.
In claim 1, the heat spreader is a laser compression bonding device formed of a transparent material.
A laser compression bonding device according to claim 1, wherein the transparent compression head further comprises at least one through hole passing through a central portion to apply vacuum pressure to the electronic component in order to hold the electronic component.
A laser compression bonding device according to claim 1, wherein the transparent compression head further comprises an air flow channel attached to the outer edge of the transparent compression head, and the air flow channel is configured to receive a cooling air flow for cooling the transparent compression head.
As a laser compression bonding method, Step of placing a substrate on a carrier; A step of placing electronic components on the substrate through solder material by means of a transparent compression head; A step of applying pressure to the electronic component against the substrate by the transparent compression head and irradiating a laser beam from a laser source onto the carrier through the central portion of the transparent compression head to bond the electronic component onto the substrate through the solder material; and A step of cooling the transparent compression head by injecting liquid into a heat spreader attached to a peripheral portion of the transparent compression head—wherein the peripheral portion surrounds the central portion and the heat spreader includes a liquid channel—; A laser compression bonding method comprising the step of discharging liquid from the liquid channel after heat exchange between the liquid and the transparent compression head.

Description

Laser Compression Bonding Device This application relates generally to semiconductor technology, and more specifically to a laser compression bonding device and a method of using the same. Laser compression bonding (LCB) or soldering processes have been used to replace conventional large-scale reflow processes in semiconductor package formation because they can reduce thermal stress within semiconductor packages during the laser compression soldering process. However, LCB tools are generally manufactured from transparent materials, such as bulk quartz, which have low thermal conductivity. Heat can accumulate in the LCB tools during the bonding process, which can undesirably increase the temperature of the LCB tools. Therefore, there is a need for a new laser compression bonding device. The object of the present application is to provide a laser compression bonding device with improved heat dissipation performance. According to an aspect of the present application, a laser compression bonding device is provided. The laser compression bonding device comprises: a carrier for placing a substrate; a transparent compression head for holding and displacing an electronic component—the transparent compression head comprises a central portion for pressing the electronic component against the substrate through the solder material when the electronic component is placed on the substrate through the solder material, and a peripheral portion surrounding the central portion—; a laser source for emitting a laser beam toward the carrier through at least the central portion of the transparent compression head to heat the solder material so that the electronic component is bonded onto the substrate through the solder material; and a heat spreader attached to the peripheral portion of the transparent compression head, wherein the heat spreader comprises a liquid channel for receiving a liquid, and the liquid flows within the liquid channel to exchange heat with the transparent compression head. According to another aspect of the present application, a laser compression bonding method is provided. The method comprises the steps of: placing a substrate on a carrier; placing an electronic component on the substrate through a solder material by a transparent compression head; pressing the electronic component against the substrate by the transparent compression head and irradiating a laser beam from a laser source onto the carrier through a central portion of the transparent compression head to bond the electronic component onto the substrate through the solder material; and cooling the transparent compression head by injecting a liquid into a heat spreader attached to a peripheral portion of the transparent compression head—wherein the peripheral portion surrounds the central portion and the heat spreader includes a liquid channel—; and discharging the liquid from the liquid channel after heat exchange between the liquid and the transparent compression head. It should be understood that the foregoing general description and the following detailed description are merely illustrative and descriptive and do not limit the invention. Additionally, the accompanying drawings, which are incorporated into and constitute a part of this specification, serve to illustrate embodiments of the invention and, together with the description, explain the principles of the invention. The drawings referenced in this specification form part of the specification. Unless expressly otherwise indicated in the detailed description, the features illustrated in the drawings illustrate only some embodiments of the present application and do not illustrate all embodiments of the present application, and the reader of the specification should not imply otherwise. Figure 1 illustrates the temperature change of an LCB tool and an electronic component maintained by the LCB tool under various conditions. FIGS. 2a and 2b illustrate a laser compression bonding device according to an embodiment of the present application. FIGS. 3a to 3c illustrate a laser compression bonding method according to an embodiment of the present application. The same reference number will be used throughout the drawing to refer to identical or similar parts. The following detailed description of exemplary embodiments of the present application refers to the accompanying drawings, which form part of the description. The drawings illustrate specific exemplary embodiments in which the present application may be practiced. The detailed description including the drawings is sufficiently detailed to enable a person skilled in the art to practice the present application. A person skilled in the art may further utilize other embodiments of the present application and may make logical, mechanical, and other modifications without departing from the spirit or scope of the present application. Accordingly, the reader of the following detailed description should not interpret the description in a limiti