KR-20260065663-A - Semiconductor wafer deicing device

Abstract

A semiconductor wafer dicing device according to one embodiment of the present disclosure may include: a chuck table on which a transferred semiconductor wafer is loaded; a flip driving unit that flips the chuck table to invert the position of the semiconductor wafer; a dicing device positioned opposite the inverted semiconductor wafer; and a cleaning device for removing particles generated during the operation of the dicing device.

Inventors

• 천승진
• 고준영
• 황선규

Assignees

• 삼성전자주식회사

Dates

Publication Date

20260511

Application Date

20241101

Claims (10)

1. As a semiconductor wafer dicing device, Chuck table on which a transferred semiconductor wafer is loaded; A flip driving unit that flips the chuck table to invert the position of the semiconductor wafer; A dicing device positioned opposite to the inverted semiconductor wafer; and A semiconductor wafer dicing device comprising: a cleaning device for removing particles generated during the operation of the above-mentioned dicing device.
2. In paragraph 1, The above chuck table is, A semiconductor wafer dicing device including a vacuum suction workbench for fixing the semiconductor wafer.
3. In paragraph 1, The above flip driving unit is, A rotating shaft supported on both sides of the above chuck table; and A semiconductor wafer dicing device comprising: a motor unit that drives the above-mentioned rotating shaft to flip the chuck table 180°.
4. In paragraph 1, The above dicing device is, A blade that cuts along the scribe line of the semiconductor wafer; and A semiconductor wafer dicing device comprising a blade receiving portion for moving and rotating the blade.
5. In paragraph 4, A semiconductor wafer dicing device in which a cleaning water molecular device for spraying deionized water is integrally provided in the blade receiving block above.
6. In paragraph 1, The above dicing device is a semiconductor wafer dicing device including a laser dicing device that irradiates a laser along the scribe line of the semiconductor wafer.
7. In paragraph 1, The above cleaning device is a semiconductor wafer dicing device including a cleaning water spraying device that sprays deionized water.
8. In paragraph 1, The above cleaning device is a semiconductor wafer dicing device comprising an air blower that blows high-pressure air.
9. A semiconductor wafer dicing device for dicing a semiconductor wafer chucked in a state facing the direction of gravity, A chuck table in which a semiconductor wafer is loaded so as to face the opposite direction of gravity and fixed by vacuum suction; A flip driving unit that flips the chuck table so that the semiconductor wafer faces the direction of gravity; A dicing device disposed on the lower portion of the semiconductor wafer facing the direction of gravity; and A semiconductor wafer dicing device comprising: a cleaning device for removing particles generated during the operation of the above-mentioned dicing device.
10. In Paragraph 9, The above dicing device is a semiconductor cleaning device that is at least one of a blade dicing device and a laser dicing device, which dices the semiconductor wafer fixed so as to face the direction of gravity along the scribe line of the semiconductor wafer.

Description

Semiconductor wafer deicing device The present disclosure relates to a semiconductor wafer dicing device, and in particular, to a semiconductor wafer dicing device that reduces the phenomenon of silicon debris adhering to a semiconductor wafer during a wafer singulation process. The manufacturing process of semiconductor products can be broadly divided into semiconductor wafer fabrication, package assembly, and testing. Wafer processing refers to a series of operations to create circuits or components on or the surface of a semiconductor wafer. Once this process is complete, a wafer singulation process is performed to dice the semiconductor wafer and separate the semiconductor dies on the wafer into individual semiconductor chips, and a package assembly process is performed to assemble each individual semiconductor chip into a package. Semiconductor wafer dicing devices used in the wafer singulation process are classified into methods using a laser for die sawing and methods using a blade. In the case of blade die sawing, silicon particles can adhere to and fuse to the surface of the semiconductor chip. When silicon particles adhere to and fuse to the surface of the semiconductor chip, there is a problem that they cannot be removed even by high-pressure cleaning. In addition, compared to blade sawing, laser sawing has a lower defect rate for semiconductor chips due to less chipping or cracking, but it is widely used for relatively thin wafers because productivity is low when the wafer thickness is 100㎛ or more. Dicing by laser sawing proceeds by irradiating the wafer's scribe lines with a high-energy laser to etch away silicon. However, the laser sawing method still suffers from the problem of cut silicon debris adhering to the surface of semiconductor chips as grooves are formed on the wafer surface. Recently, in the dicing of semiconductor packages, iBGA products such as CMOS image sensors (Complementary Metal Oxide Semiconductor Image Sensor; CIS) are also being commercialized. When silicon particles adhere to the surface of such iBGA semiconductor chips, image processing becomes virtually impossible. Since silicon particles are inevitably generated during the dicing process, there is a problem in that the yield of good finished package products, particularly for iBGA semiconductor chips, drops significantly. FIG. 1 is a schematic perspective view of a semiconductor wafer dicing device according to one embodiment of the present disclosure. Figure 2 is a schematic enlarged view of part A of Figure 1. FIG. 3 is a cross-sectional view of a semiconductor wafer provided to be diced on a chuck table of a semiconductor wafer dicing device according to one embodiment of the present disclosure. FIG. 4 is a cross-sectional view of a chuck table of a semiconductor wafer dicing device in a flipped state according to one embodiment of the present disclosure. FIG. 5 is a cross-sectional view at a position where dicing on a semiconductor wafer begins after the chuck table of a semiconductor wafer dicing device according to one embodiment of the present disclosure is flipped. FIG. 6 is a cross-sectional view of a semiconductor wafer dicing device according to one embodiment of the present disclosure in which dicing is performed on a semiconductor wafer after the chuck table is flipped. FIG. 7 is a cross-sectional view of a semiconductor wafer dicing device according to one embodiment of the present disclosure in a state in which a semiconductor wafer is laser-diced after the chuck table is flipped. Some of the drawings are included as schematics. The drawings are illustrated for illustrative purposes only and should not be considered as drawn to actual scale. Additionally, drawings as schematics are provided to aid understanding and may not include all aspects or information compared to realistic representations, and may include exaggerated information. Preferred embodiments of the present disclosure will be described below with reference to the attached drawings. The embodiments of the present disclosure may be modified in various different forms and are provided to more fully explain the concept to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clarity, and elements indicated by the same or similar reference numerals in the drawings refer to the same elements. In this disclosure, the term "connection" encompasses not only "directly connected" but also "indirectly connected" through other configurations. Additionally, depending on the case, it encompasses all "electrically connected" connections. In this disclosure, expressions such as "first," "second," etc., are used to distinguish one component from another and do not limit the order and/or importance of said components. Wherever possible, without departing from the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first comp