KR-20260065754-A - SUBSTRATE PROCESSING APPARATUS AND APPARATUS CLEANING METHOD

KR20260065754AKR 20260065754 AKR20260065754 AKR 20260065754AKR-20260065754-A

Abstract

The present disclosure provides a technology capable of suppressing clogging of a drainage line in a substrate processing apparatus that performs batch processing. The substrate processing apparatus according to the present disclosure comprises a processing tank, a liquid receiving section, a liquid receiving section discharge pipe, a storage section, a first liquid supply pipe, a second liquid supply pipe, a discharge pipe, a first liquid flow rate adjustment section, and a second liquid flow rate adjustment section. The liquid receiving section receives the processing liquid overflowing from the processing tank. The liquid receiving section discharge pipe discharges the processing liquid from the liquid receiving section. The first liquid supply pipe supplies a first liquid, which is a cleaning liquid containing a first liquid and a second liquid and removing precipitates from the processing liquid. The second liquid supply pipe supplies the second liquid. The discharge pipe is connected to the first liquid supply pipe and the second liquid supply pipe and discharges the cleaning liquid, the first liquid, or the second liquid toward the liquid receiving section. The first liquid flow rate adjustment section is provided in the first liquid supply pipe and adjusts the flow rate of the first liquid flowing through the first liquid supply pipe. The second liquid flow rate adjustment unit is provided in the second liquid supply pipe and adjusts the flow rate of the second liquid flowing through the second liquid supply pipe.

Inventors

아라타케 히데마사
구로다 오사무
가나가와 코우조우

Assignees

도쿄엘렉트론가부시키가이샤

Dates

Publication Date: 20260511
Application Date: 20260407
Priority Date: 20191017

Claims (9)

A processing tank having an inner tank capable of accommodating multiple substrates and storing a processing liquid, and an outer tank disposed around the upper part of the inner tank, and A liquid receiving section that receives the processing liquid overflowing from the inner or outer tank, and A liquid receiving discharge pipe for discharging the processing liquid from the liquid receiving part, and A storage unit connected to the liquid receiving unit via the liquid receiving unit discharge pipe and storing the treatment liquid discharged from the liquid receiving unit, and A first liquid supply pipe containing a first liquid and a second liquid, and supplying the first liquid of a cleaning liquid that removes precipitates from the treatment liquid, and A second liquid supply pipe supplying the second liquid mentioned above, and A discharge pipe connected to the first liquid supply pipe and the second liquid supply pipe, for discharging the cleaning liquid, the first liquid, or the second liquid toward the liquid receiving portion, and A first liquid flow rate adjusting unit provided in the first liquid supply pipe and adjusting the flow rate of the first liquid flowing through the first liquid supply pipe, and A second liquid flow rate adjusting unit provided in the second liquid supply pipe, for adjusting the flow rate of the second liquid flowing through the second liquid supply pipe. Equipped with, The above liquid receiving part is, A first liquid receiving section positioned below the above-mentioned treatment tank, and A second liquid receiving part accommodating the above-mentioned treatment tank and the above-mentioned first liquid receiving part Includes, The above liquid receiving part discharge pipe is, A first discharge pipe connected to the first liquid receiving part and discharging the processing liquid from the first liquid receiving part, and It includes a second discharge pipe connected to the second liquid receiving part and discharging the processing liquid from the second liquid receiving part, The above-mentioned first liquid receiving part is, A substrate processing device having a bottom surface that slopes downward toward the first discharge pipe.
In Article 1, The above first liquid is pure, and The above second liquid is hydrogen fluoride, and The above-mentioned processing solution is a substrate processing device containing phosphoric acid and a dissolved silicon-containing compound.
In Article 1 or Article 2, A control unit that controls the first liquid flow rate adjustment unit and the second liquid flow rate adjustment unit. Further equipped with, The above control unit is, A substrate processing device that adjusts the concentration of the cleaning solution by controlling the first liquid flow rate adjustment unit and the second liquid flow rate adjustment unit.
In Article 1, The above discharge pipe is, A discharge portion having a plurality of discharge ports arranged along the width direction of the bottom surface. A substrate processing device having
In Article 1, The above discharge pipe is, A discharge part having a plurality of discharge ports arranged along the inclined direction of the bottom surface. A substrate processing device having
A method for cleaning a device for cleaning a substrate processing device described in claim 1, A process of supplying the cleaning liquid, the first liquid, or the second liquid from the discharge pipe to the liquid receiving portion, and A process for adjusting the flow rates of the first liquid and the second liquid using the first liquid flow rate adjusting unit and the second liquid flow rate adjusting unit. A device cleaning method comprising
In Article 6, The above first liquid is pure, and The above second liquid is hydrogen fluoride, and The above-mentioned supply process is, A method for cleaning a device, wherein the cleaning solution adjusted to a first concentration by the above adjusting process is supplied to the liquid receiving portion, and then the cleaning solution adjusted to a second concentration lower than the first concentration by the above adjusting process is supplied to the liquid receiving portion.
In Article 6 or Article 7, The above-mentioned supply process is, A cleaning method for a device, wherein the cleaning solution is supplied intermittently to the above-mentioned liquid receiving portion.
In Article 6, The above-mentioned supply process is, A device cleaning method comprising repeating the supply of the first liquid supplied from the first liquid supply pipe to the liquid receiving portion and the supply of the second liquid supplied from the second liquid supply pipe to the liquid receiving portion.

Description

Substrate Processing Apparatus and Apparatus Cleaning Method The present disclosure relates to a substrate processing apparatus and a method for cleaning the apparatus. Conventionally, a batch processing method is known in which a lot of substrates is processed collectively by immersing a lot formed of multiple substrates in a processing tank that holds a processing solution. FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment. FIG. 2 is a block diagram showing the configuration of a treatment tank for etching according to an embodiment. Figure 3 is a figure showing the configuration of an etching processing device according to an embodiment. FIG. 4 is a flowchart showing the sequence of cleaning treatment according to an embodiment. FIG. 5 is a flowchart showing the sequence of cleaning treatment according to the first modified example. FIG. 6 is a flowchart showing the sequence of cleaning treatment according to the second modified example. FIG. 7 is a flowchart showing the sequence of cleaning treatment according to the third modified example. FIG. 8 is a diagram showing the configuration of a cleaning unit according to the fourth modified example. FIG. 9 is a figure showing the configuration of a cleaning unit according to the fifth modified example. Hereinafter, embodiments for implementing the substrate processing apparatus and apparatus cleaning method according to the present disclosure (hereinafter referred to as "embodiments") will be described in detail with reference to the drawings. Furthermore, the substrate processing apparatus and apparatus cleaning method according to the present disclosure are not limited by these embodiments. Additionally, each embodiment may be appropriately combined within a range that does not contradict the processing content. Furthermore, in each of the following embodiments, the same reference numerals are assigned to identical parts, and redundant descriptions are omitted. Additionally, in each drawing referenced below, for the sake of ease of understanding, mutually orthogonal X-axis, Y-axis, and Z-axis directions are defined, and an orthogonal coordinate system is shown with the Z-axis direction being the vertically upward direction. <Configuration of the substrate processing device> First, the configuration of a substrate processing device according to an embodiment will be explained with reference to FIG. 1. FIG. 1 is a plan view of a substrate processing device (1) according to an embodiment. As shown in FIG. 1, a substrate processing device (1) according to an embodiment comprises a carrier receiving/releasing unit (2), a lot forming unit (3), a lot placement unit (4), a lot conveying unit (5), a lot processing unit (6), and a control unit (7). The carrier receiving/exporting unit (2) is equipped with a carrier stage (20), a carrier return mechanism (21), a carrier stock (22, 23), and a carrier placement stand (24). The carrier stage (20) arranges a plurality of carriers (9) that are transported from the outside. The carrier (9) is a container that accommodates a plurality (e.g., 25 wafers) of wafers (W) arranged vertically in a horizontal position. The carrier transport mechanism (21) transports the carriers (9) between the carrier stage (20), the carrier stock (22, 23), and the carrier placement table (24). From the carrier (9) placed on the carrier placement table (24), a plurality of wafers (W) before processing are transferred to the lot processing unit (6) by the substrate transport mechanism (30) described later. In addition, a plurality of processed wafers (W) are brought into the carrier (9) placed on the carrier placement table (24) from the lot processing unit (6) by the substrate transport mechanism (30). The lot forming unit (3) has a substrate transport mechanism (30) and forms a lot. The lot consists of a plurality of wafers (W) (e.g., 50 wafers) that are processed simultaneously by combining wafers (W) received in one or more carriers (9). The plurality of wafers (W) forming one lot are arranged at a constant interval with their plate surfaces facing each other. The substrate transport mechanism (30) transports a plurality of wafers (W) between a carrier (9) placed on a carrier placement table (24) and a lot placement section (4). The lot placement unit (4) has a lot transport unit (40) and temporarily places (waits) lots that are transported between the lot forming unit (3) and the lot processing unit (6) by the lot transport unit (5). The lot transport unit (40) has an incoming lot placement unit (41) for placing lots formed in the lot forming unit (3) before processing, and an outgoing lot placement unit (42) for placing lots processed in the lot processing unit (6). On the incoming lot placement unit (41) and the outgoing lot placement unit (42), a plurality of wafers (W) of one lot are arranged in an upright position in the front and back directions. The lot conveying unit (5) has a lot conveying mechanism