KR-20260065755-A - PROBE UNIT AND CONTACT PROBE

KR20260065755AKR 20260065755 AKR20260065755 AKR 20260065755AKR-20260065755-A

Abstract

(Problem) To provide a probe unit and a contact probe capable of securing the strength of the contact probe while suppressing rotation relative to the probe holder. (Solution) A probe unit related to the present invention comprises a plurality of probe groups consisting of two contact probes and a probe holder for holding the contact probes, wherein the probe holder has a plurality of holder holes for holding the plurality of contact probes, and the contact probe has a tip portion that contacts one electrode of the contact target at the tip portion, and a flange portion that extends from the base side of the tip portion and has a maximum length in a direction perpendicular to the length axis of the contact probe that is greater than the maximum length of the tip portion, wherein a flat portion forming a planar shape is formed on a part of the side of the flange portion, and the holder hole has a wall surface that abuts the flat portion while having a stepped shape in which the flange portion is caught.

Inventors

소마 가즈야
이노하라 료헤이
니시와키 나루히코

Assignees

닛폰 하츠죠 가부시키가이샤

Dates

Publication Date: 20260511
Application Date: 20260407
Priority Date: 20240308

Claims (5)

A probe unit comprising a plurality of probe groups each consisting of two contact probes that contact one electrode of a contact target at one end side in the longitudinal direction, and a probe holder that holds the contact probes, wherein each contact probe contacts a different electrode of a substrate at the other end side, In the probe holder, a plurality of holder holes are formed to hold a plurality of the contact probes, and The above contact probe is, A tip portion that contacts one electrode of the contact target at the tip, and A flange portion extending from the base side of the tip portion and having a maximum length in a direction orthogonal to the longitudinal axis of the contact probe that is greater than the maximum length of the tip portion, In the above flange portion, a first planar portion forming a planar shape is formed on a part of the side, and A second planar portion is formed in the longitudinal direction on the aforementioned leading edge, and is formed to be flat with the first planar portion of the flange without any step difference. A probe unit characterized in that the holder hole has a stepped shape in which the flange portion engages, and has a wall surface that contacts the first planar portion.
In Article 1, A probe unit characterized by having two first planar sections formed on opposite sides with respect to the longitudinal axis in the flange portion.
In Article 1, A probe unit characterized by having one first planar portion formed in the flange portion.
In any one of paragraphs 1 to 3, A probe unit characterized in that a third planar portion is formed in the flange portion, which is at a different position from the first planar portion and faces the other contact probe when the contact probe is installed in the probe holder.
As a contact probe that contacts one electrode of a contact target at one end side in the longitudinal direction, A tip portion that contacts one electrode of the contact target at the tip, and A flange portion extending from the base side of the tip portion and having a maximum length in a direction orthogonal to the longitudinal axis of the contact probe that is greater than the maximum length of the tip portion, In the above flange portion, a first planar portion forming a planar shape is formed on a part of the side, and A contact probe characterized by having a second planar portion formed in the longitudinal direction at the tip portion, and being flush with the first planar portion of the flange portion without a step difference.

Description

Probe Unit and Contact Probe The present invention relates to a probe unit and a contact probe used for testing the conduction state or operational characteristics of a test target, such as a semiconductor integrated circuit or a liquid crystal panel. Conventionally, when performing a conductivity state test or an operation characteristic test of an object to be tested, such as a semiconductor integrated circuit or a liquid crystal display, a conductive contact probe is used to facilitate an electrical connection between the object to be tested and a signal processing device having a circuit board that outputs a test signal. As one of the methods for the conductivity state test or operation characteristic test described above, there is a four-terminal measurement method. As a probe unit using this four-terminal measurement method, a technique is disclosed in which the tips of each contact probe are brought into contact with the object to be tested by means of a set of contact probes (probe group) held in a probe holder to measure electrical characteristics (see, for example, Patent Document 1). FIG. 1 is a perspective view showing the configuration of a probe unit related to one embodiment of the present invention. FIG. 2 is a partial cross-sectional view showing the configuration of the main part of a probe unit related to one embodiment of the present invention. FIG. 3 is a partial cross-sectional view showing the configuration of the main part of a probe unit related to one embodiment of the present invention. Figure 4 is a diagram showing the configuration of the first plunger and probe holder viewed from the direction of arrow A in Figure 3. FIG. 5 is a drawing for explaining the configuration of a first plunger related to Variation Example 1 of the present invention. FIG. 6 is a drawing for explaining the configuration of a first plunger related to Variant Example 2 of the present invention. FIG. 7 is a perspective view (the first) for explaining the configuration of a probe related to Variant Example 3 of the present invention. FIG. 8 is a perspective view (the 2) for explaining the configuration of a probe related to Variant Example 3 of the present invention. Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. Furthermore, the present invention is not limited by the following embodiments. Also, each drawing referenced in the following description merely illustrates the shape, size, and positional relationship in a schematic manner sufficient to enable an understanding of the content of the present invention. That is, the present invention is not limited only to the shape, size, and positional relationship exemplified in each drawing. (Embodiment) FIG. 1 is a perspective view showing the configuration of a probe unit related to an embodiment of the present invention. The probe unit (1) shown in FIG. 1 is a device used when performing an electrical characteristic test of a semiconductor integrated circuit that is a test object, and is a device that electrically connects a connection electrode of a semiconductor package (100) that encloses the semiconductor integrated circuit and a circuit board (200) that outputs a test signal to the semiconductor integrated circuit. The connection electrode of the semiconductor package (100) is connected to the semiconductor integrated circuit as a lead (101) shown in FIG. 1. The probe unit (1) has a plurality of probe groups (2) consisting of two contact probes (2a) (hereinafter simply referred to as “probes (2a)”) that contact one connecting electrode (lead (101)) of a semiconductor package (100) to be contacted at one end side in the longitudinal direction and contact different electrodes of a circuit board (200) at the other end side, and a probe holder (3) that accommodates and maintains the plurality of probe groups (2) according to a predetermined pattern, and a holder member (4) formed around the probe holder (3) and suppresses the occurrence of misalignment of the position of the semiconductor package (100) that contacts the plurality of probe groups (2) during inspection. FIG. 2 is a partial cross-sectional view showing the configuration of the main part of a probe unit related to an embodiment of the present invention. FIG. 3 is a partial cross-sectional view showing the configuration of the main part of a probe unit related to an embodiment of the present invention. FIG. 4 is a drawing showing the configuration of the first plunger and probe holder viewed from the direction of arrow A in FIG. 3. FIG. 2 is a partial cross-sectional view showing the detailed configuration of a probe group (2) accommodated in a probe holder (3), with the cross-sectional plane being a plane parallel to the arrangement direction of the probe group (2). FIG. 3 is a partial cross-sectional view showing the detailed configuration of a probe group (2) accommodated in a probe holder (3), with the cross-section