KR-20260065786-A - METHOD OF CLEANING A BOTTOM PLATE

Abstract

A method for cleaning a base plate comprises the steps of: providing at least one welding sheet on an adhesive base plate; filling a liquid material between the adhesive base plate and the welding sheet so that the liquid material coats the material to be cleaned on the adhesive base plate; placing the adhesive base plate containing the liquid material in a chamber; controlling the chamber temperature to 25 to 200°C; performing oscillating pressure increase/decrease and/or oscillating exhaust of the gas in the chamber using a pressure increase/decrease device and/or a vacuum generator; causing a change in the liquid material using a pressure difference change of the gas, wherein the pressure difference change includes a pressure difference change under vacuum, a pressure difference change from high pressure to 1 atmosphere, or a pressure difference change from high pressure to vacuum; and separating the material to be cleaned attached to the adhesive base plate from the adhesive base plate by causing the liquid material to scrub through friction of the pressure difference change using the pressure difference change of the gas.

Inventors

• 양, 쳉-엔

Assignees

• 에이블프린트 테크놀로지 코포레이션 리미티드

Dates

Publication Date

20260511

Application Date

20260427

Priority Date

20230809

Claims (3)

1. As a method for cleaning the base plate, (a) Welding sheet welding: A step of welding at least one welding sheet onto an adhesive base plate; (b) Liquid material coating: A step of coating a material to be cleaned on the adhesive base plate by filling a liquid material between the adhesive base plate and at least one welding sheet; (c) Placement in chamber: A step of placing the adhesive base plate containing the liquid material in the chamber; (d) Chamber temperature control: controlling the chamber to at least one predetermined temperature, wherein the predetermined temperature must be in combination with the viscosity of the liquid material and be between 25 and 200°C; (e) Cleaning with excitation pressure difference fluctuation: A method for cleaning a base plate characterized by including the step of performing excitation low-pressure control on the gas in the chamber using a vacuum generator so that gas molecules in the chamber generate a pressure difference fluctuation airflow, which is a pressure difference fluctuation under low pressure, and performing excitation pressure difference fluctuation within a range of a maximum value of 1 atmosphere to a minimum value of 10⁻⁵ atmospheres, and causing fluctuation of the liquid material by using low-pressure fluctuation of gas vacuum suction force and discharge force so that the liquid material in contact with the material to be cleaned is scrubbed through friction of the pressure difference fluctuation, thereby separating the material to be cleaned attached to the adhesive base plate from the adhesive base plate and the liquid material.
2. In paragraph 1, A method for cleaning a base plate, characterized in that the substance to be cleaned may be flux, flux residue, oil ester, photoresist, or a product of the manufacturing process.
3. In paragraph 1, A method for cleaning a base plate, wherein the above liquid material may be a primer, the primer may contain hard particles, and the hard particles increase friction and scrubbing effects through the hard particles according to rolling caused by fluctuation of the primer.

Description

Method of Cleaning a Bottom Plate The present invention relates to the field of base plate cleaning technology, and in particular, technically provides a base plate cleaning method that improves the residue cleaning effect by achieving a scrubbing or stirring effect of the liquid material by combining a liquid material with fluctuations in the pressure difference of an airflow that increases or decreases pressure in a technical manner. Bonding between materials used in the manufacture of advanced semiconductor devices often requires adhesives; particularly when bonding metals, some adhesives are typically high in acid and corrosive to remove the tight oxide layer formed on the bonding surface. However, the corrosiveness of these adhesives inherently has a severe impact on the performance of microelectronic devices. Therefore, an additional cleaning step must be performed to remove the adhesive or residues of the reaction between the adhesive and metal oxides remaining on the bonding surface. Furthermore, some adhesives leave behind some organic matter and a layer of oil ester on the bonding surface after use; to prevent subsequent reliability issues in the semiconductor device, these oil esters must also undergo an additional cleaning step. However, cleaning these residues becomes increasingly difficult as the circuits on the bonding base plate become denser, the protrusions on the bonding base plate used for bonding become smaller, or the bonding gap between the bonding base plate and the weld sheet becomes narrower. If corrosive adhesives remaining on the bonding base plate or the bonding site are not completely removed, the reliability of the device is significantly degraded. Additionally, if these residues are cleaned using current conventional methods involving cleaning solvents, improper treatment can have an impact on the environment. Therefore, regarding the aforementioned cleaning problems in the manufacturing of existing advanced semiconductor devices, developing a base plate cleaning method that is more ideal, practical, and economically beneficial is something consumers are eagerly awaiting, and it is also a goal and direction that industry stakeholders must strive to overcome through diligent research and development. With this in mind, the inventor possesses many years of experience in the manufacturing, development, and design of related products, and has finally obtained the present invention, which is practical, through detailed design and careful evaluation based on the above purpose. FIG. 1 is a method flowchart according to one embodiment of the present invention. FIG. 2 is a method flowchart according to another embodiment of the present invention. FIG. 3 is a method flowchart according to another embodiment of the present invention. FIG. 4 is a method flowchart according to another embodiment of the present invention. The present invention provides a method for cleaning a base plate. In order to enable the examiner to better understand the purpose, features, and effects of the present invention, the embodiments and drawings will be described in detail below. As illustrated in FIG. 1, the present invention provides a method for cleaning a base plate comprising the following steps. (a) Welding sheet welding (10a): at least one welding sheet is welded onto an adhesive base plate; (b) Liquid material coating (20a): A liquid material is filled between the adhesive base plate and at least one welding sheet to cover the material to be cleaned on the adhesive base plate; (c) Placement in chamber (30a): Place the adhesive base plate containing the liquid material in the chamber; (d) Chamber temperature control (40a): The chamber is controlled to at least one predetermined temperature, wherein the predetermined temperature is combined with the viscosity of the liquid material to increase the fluidity of the liquid material and is between 25 and 200°C; (e) Cleaning of excitation-type pressure difference fluctuations (50a): Excitation-type low-pressure control is performed on the gas in the chamber using a vacuum generator to cause gas molecules in the chamber to generate a pressure difference fluctuation airflow, which is a pressure difference fluctuation under low pressure, and excitation-type pressure difference fluctuation is performed within a range of a maximum value of 1 atmosphere to a minimum value of 10⁻⁵ atmospheres, and the fluctuation of the liquid material is caused by utilizing the gas fluctuation generated by the vacuum generator performing excitation-type vacuum suction and discharge on the low-pressure gas in the chamber, and additionally, since the liquid material exists between at least one welding sheet and the adhesive base plate, the problem of overflowing does not occur even when a larger fluctuation of the liquid material is generated due to the mutual capillary action force and the surface tension of the liquid material, so that the liquid material in contact with the mat