KR-20260065822-A - Reduction device and reduction method for treating exhaust gas streams
Abstract
The present invention provides a reduction device for treating an exhaust gas stream from a manufacturing process tool. The reduction device comprises a treatment chamber including an inlet configured to allow an exhaust gas stream from a manufacturing process tool to enter a treatment chamber, at least partially enclosed by a first porous wall; a second porous wall largely surrounding the first porous wall and enclosed between a second chamber—the second chamber is porous to allow a gas flow to pass through; one or more heating elements arranged within the second chamber and configured to heat the gas flowing through it during use; a third porous wall largely surrounding the second chamber and enclosed between a third chamber—the third chamber comprises a relative insulating material and said third chamber is porous to allow a gas flow—and a gas inlet. Here, the device is configured such that, during use, a gas flow is transferred from the gas inlet through the third chamber and the second chamber to the treatment chamber to react with the exhaust gas stream.
Inventors
- 벤저벌 이안 데이비드
- 몰나르 발린트
Assignees
- 에드워즈 리미티드
Dates
- Publication Date
- 20260511
- Application Date
- 20240829
- Priority Date
- 20230905
Claims (15)
- In a reduction device for treating an exhaust gas stream from a manufacturing process tool, A processing chamber at least partially confined by a first porous wall — said processing chamber includes an inlet configured to allow an exhaust gas stream from said process tool to enter said processing chamber — and, A second porous wall that generally surrounds the first porous wall and defines a second chamber between them — the second chamber is porous to allow gas flow to pass through, and one or more heating elements are arranged within the second chamber and configured to heat the gas flowing through the second chamber during use — and, A third porous wall that generally surrounds the second chamber and defines the third chamber between them — said third chamber comprises a relative insulating material and said third chamber is porous to allow gas flow to pass through — and, Includes a gas inlet, The above reduction device is configured such that, when in use, a gas flow is transferred from the gas inlet through the third chamber and the second chamber to the treatment chamber to react with the exhaust gas stream. Reduction device.
- In Article 1, Further comprising an outer wall that generally surrounds the third porous wall and forms a plenum between them. Reduction device.
- In Article 1 or Article 2, A plurality of heating elements are arranged within the second chamber. Reduction device.
- In any one of paragraphs 1 to 3, Configured so that the exhaust gas does not enter the second chamber Reduction device.
- In any one of paragraphs 1 to 4, The above one or more heating elements are substantially uniformly spaced around the second chamber Reduction device.
- In any one of paragraphs 1 to 5, The above relative insulating material has a thermal conductivity of less than about 10 Wm⁻¹ K⁻¹ , preferably less than about 1 Wm⁻¹ K⁻¹ , and more preferably less than about 0.1 Wm⁻¹ K⁻¹. Reduction device.
- In any one of paragraphs 1 to 6, The relative insulating material contained in the third chamber above is a relative insulating particulate material. Reduction device.
- In Article 7, The relative insulating material included in the third chamber above is a packed layer of relative insulating particulate material. Reduction device.
- In Article 8, The above-mentioned relative insulating particulate material comprises pumice and/or micafil vermiculite. Reduction device.
- In any one of paragraphs 1 through 9, The above one or more heating elements are resistance heating elements and/or infrared heating elements. Reduction device.
- In any one of Articles 1 to 10, The above one or more heating elements are configured to be heated to a temperature of about 500°C to about 1200°C, preferably about 700°C to about 1000°C, more preferably about 900°C to about 1000°C, and most preferably about 950°C to about 980°C. Reduction device.
- In any one of paragraphs 1 to 11, The gas flow conveyed through the above gas inlet includes compressed dry air and/or nitrogen. Reduction device.
- In a method for reducing an exhaust gas stream from a manufacturing process tool, a) a step of providing a reduction device described in any one of claims 1 to 12, and b) a step of operating one or more of the above heating elements, and, c) a step of transferring a gas flow from the gas inlet to the processing chamber through the third chamber and the second chamber, and d) a step of reducing the exhaust gas stream with the gas flow in the processing chamber, and e) a step of transferring the reduced gas stream through the outlet of the processing chamber. method.
- In Article 13, (b) In step, the heating element is heated to a temperature of about 500°C to about 1200°C, preferably about 700°C to about 1000°C, more preferably about 900°C to about 1000°C, and most preferably about 950°C to about 980°C. method.
- In Article 13 or Article 14, The above gas flow includes compressed dry air and/or nitrogen. method.
Description
Reduction device and reduction method for treating exhaust gas streams The present invention relates to a reduction device for treating an exhaust gas stream from a manufacturing process tool. The present invention also relates to a method for reducing an exhaust gas stream from a manufacturing process tool. Abatement devices are known and are commonly used, for example, to treat exhaust gas streams from manufacturing process tools used in the semiconductor or flat panel display manufacturing industries. During the use of manufacturing process tools, residual perfluorinated compounds (PFCs) and other compounds may be present in the exhaust gas stream pumped from the tools. Since PFCs are known to be difficult to remove from exhaust gases and have relatively high greenhouse activity, their release into the environment is undesirable. Generally, abatement devices use combustion to remove PFCs and other compounds from the exhaust gas stream. There is a demand to improve the efficiency of the reduction process, and in particular, to reduce energy consumption during reduction. Heat loss within the system is undesirable because it not only makes heating of the reduction device housing dangerous but also increases the cost of operating the device. The present invention aims to solve these and other problems related to the prior art at least partially. In one embodiment, the present invention provides a reduction device for treating an exhaust gas stream from a manufacturing process tool. The reduction device comprises a treatment chamber that is at least partially defined by a first porous wall. The treatment chamber comprises an inlet configured to allow an exhaust gas stream from a manufacturing process tool to flow into the treatment chamber. The reduction device further comprises a second porous wall that largely surrounds the first porous wall and separates the second chamber. The second chamber is porous to allow a gas flow to pass through. One or more heating elements are arranged within the second chamber. One or more heating elements are configured to heat the gas flowing through the second chamber when the reduction device is in use. As will be described in further detail elsewhere in this specification, the heating of the gas by the heating elements may include both direct and indirect heating. The reduction device further includes a third porous wall that generally surrounds the second porous wall and defines the third chamber between them. The third chamber includes a relative insulating material. The third chamber is porous to allow gas flow to pass through. The reduction device further includes a gas inlet. When the device is in use, the gas flow is configured to be transferred from the gas inlet through the third chamber and the second chamber to the processing chamber to react with the exhaust gas stream. The manufacturing process tool may be, for example, a tool used in the semiconductor or flat panel display manufacturing industry. Those skilled in the art understand that the reduction device according to the present invention is not limited to the reduction of gases from a specific manufacturing process tool used in a specific industry. Rather, the reduction device may be selected according to the composition and/or characteristics (e.g., temperature, flow rate) of the exhaust gas stream. The composition and characteristics of the exhaust gas stream may vary depending on the manufacturing process tool to which the reduction device is connected during use. Furthermore, the composition and/or characteristics of said exhaust gas stream may vary depending on specific processing steps occurring in the manufacturing process tool. Generally, the exhaust gas stream may contain components that are toxic or damaging to the atmosphere due to high greenhouse activity. For example, residual perfluorinated compounds (PFCs) and other compounds may be present in the exhaust gas stream and must be removed by the reduction device. The treatment chamber may define a zone of a reduction device where the exhaust gas stream may react with the gas flow to treat the exhaust gas stream. The treatment chamber is provided with an inlet that may be fluidically coupled to a process tool. In use, the exhaust gas stream may flow into the treatment chamber through the inlet. In some embodiments, the treatment chamber may include a plurality of inlets, each of which is fluidly coupled to a process tool. The plurality of inlets may divide the flow as the exhaust gas stream enters the treatment chamber and provide improved dispersion therein. Alternatively, in some embodiments, each inlet may be fluidly coupled to a different process tool and configured to allow the exhaust gas stream from said process tool to enter the treatment chamber. The treatment chamber may further include an outlet through which the gas may exit the treatment chamber after treatment of the exhaust gas stream. The processing chamber is at least partially