KR-20260065823-A - Pipe heating

KR20260065823AKR 20260065823 AKR20260065823 AKR 20260065823AKR-20260065823-A

Abstract

The present invention provides a temperature control device for controlling the temperature of a pipe. The device comprises a plurality of electrically connected constant temperature coefficient heating elements arranged in thermal contact with a substrate layer. The substrate layer has a thermal conductivity of approximately 150 Wm⁻¹ K⁻¹ or greater and is configured to be in thermal contact with at least a portion of the pipe during use. The device further comprises an electrical connector for connecting the constant temperature coefficient heating elements to a power source during use.

Inventors

폴크너 버드 에드워드

Assignees

에드워즈 배큠 엘엘시

Dates

Publication Date: 20260511
Application Date: 20240716
Priority Date: 20230907

Claims (15)

In a temperature control device for controlling the temperature of a pipe, A plurality of electrically connected constant temperature coefficient heating elements arranged to make thermal contact with a substrate layer, and A substrate layer having a thermal conductivity of approximately 150 Wm⁻¹ K⁻¹ or greater and configured to be in thermal contact with at least a portion of the pipe during use, and Includes an electrical connector for connecting the above constant temperature coefficient heating element to a power source when in use. Temperature control device.
In Article 1, The above constant temperature coefficient heating elements are electrically connected in parallel Temperature control device.
In Article 1 or Article 2, Includes about 2 to about 200 constant temperature coefficient heating elements Temperature control device.
In any one of paragraphs 1 to 3, The above constant temperature coefficient heating element is a PTC pad heater, a PTC rope heater, and/or a ceramic PTC heater. Temperature control device.
In any one of paragraphs 1 to 4, It further includes at least one switch configured to limit current flow, preferably said switch arranged between a constant temperature coefficient heating element closest to the electrical connector and the next closest constant temperature coefficient heating element. Temperature control device.
In Article 5, It includes a plurality of switches, preferably each switch corresponding to a constant temperature coefficient heating element. Temperature control device.
In any one of paragraphs 1 to 6, One or more constant temperature coefficient heating elements having a first Curie temperature, and one or more additional constant temperature coefficient heating elements having a second Curie temperature Temperature control device.
In any one of paragraphs 1 to 7, It further includes a bracket configured to connect at least one constant temperature coefficient heating element to the substrate layer, preferably each constant temperature coefficient heating element is connected to the substrate layer through the bracket. Temperature control device.
In Article 8, The bracket includes a first part coupled to a second part, and the constant temperature coefficient heating element and the substrate layer are arranged between the first and second parts. Temperature control device.
In any one of paragraphs 1 through 9, The substrate layer comprises a metal foil or graphene, and preferably, the substrate layer comprises a copper foil stock or an aluminum foil stock. Temperature control device.
In any one of Articles 1 to 10, The protective layer is further included, and the constant temperature coefficient heating element is arranged between the substrate layer and the protective layer, and preferably the protective layer comprises a metal foil or graphene. Temperature control device.
In a method for controlling the temperature of a pipe, a) a step of providing a temperature control device described in any one of claims 1 to 11, and b) a step of connecting the temperature control device to the pipe so that the substrate layer contacts the pipe, and c) a step of connecting the above temperature control device to a power source method.
In Article 12, The method further includes the step of restricting current flow to one or more constant temperature coefficient heating elements through one or more switches upon startup. method.
In Article 12 or Article 13, The temperature control is automatic. method.
Use of a temperature control device described in any one of claims 1 to 11 for controlling the temperature of piping within a semiconductor wafer processing apparatus, preferably a pore line or exhaust line of semiconductor processing equipment.

Description

Pipe heating The present invention relates to a temperature control device for controlling the temperature of a pipe. The present invention also relates to a method for controlling the temperature of a pipe using a temperature control device. The present invention also relates to the use of a temperature control device. Process piping is used in many industries to transport liquids and/or gases. In some applications, piping may require heating. For example, piping may be heated to reduce the possibility of condensation or solidification of the material being transported through it. In some current systems, for example, the piping may be heated by NiCr wires embedded in or sewn into a substrate, by etched metal foil embedded in an electrically insulating substrate, or by induction heating methods. Each of these technologies may require design customization to meet specific voltage and power requirements. Additionally, a temperature sensor must be included in the system to regulate the heat supplied to the piping. Temperature sensors typically measure the temperature at a single point on the piping, which may also be used to regulate the temperature of a large area of the piping. In some applications, this may be unsuitable and may cause various problems. In some cases, the treatment piping may be arranged so that two or more pipes are connected side by side and/or in contact with each other. Due to their proximity, the areas closest to or in contact with the pipes may become hotter than other areas of each pipe. This may result in uneven heating of the pipe contents. In such cases, for ease of mounting and access, the temperature sensor(s) may be positioned away from the point of contact of the pipes. Because the temperature sensor(s) are positioned away from the hot spot, they may not be able to register the uneven temperature profile within the pipes. Current systems can also be negatively affected by environmental conditions. When piping is arranged externally, wind may blow on one side of the pipe, while the other side is shielded from the wind. Consequently, the shielded side may become hotter than the side exposed to the wind. In such systems, the placement of temperature sensor(s) is critical. If the temperature sensor(s) are misplaced and measure temperature only on one side of the pipe, this may result in uneven heating of the pipe contents. Overall, different sections of the piping may need to be heated at different rates depending on operating conditions during use. With currently available heating systems, providing a system capable of accommodating variable heating requirements may be overly complex and costly. Conventional processing piping may exhibit inconsistent heating, which leads to inconsistent thermal profiles of the pipe contents and, consequently, potentially unsafe operating conditions. There is a need for an improved thermostat to control the temperature of the piping. The present invention aims to solve these and other problems related to the prior art at least partially. The present invention is limited to the appended claims. In a first embodiment, the present invention provides a temperature control device for controlling the temperature of a pipe. The device comprises a plurality of electrically connected positive temperature coefficient (PTC) heating elements arranged to make thermal contact with a substrate layer. The substrate layer has a thermal conductivity greater than about 150 Wm⁻¹K⁻¹ . The substrate layer is configured to make thermal contact with at least a portion of the pipe during use. The device further comprises an electrical connector for connecting the positive temperature coefficient heating elements to a power source during use. [00011] The device may be used in virtually any application where temperature control of the piping and its contents is required. Generally, the piping may transport liquids and/or gases in use. For example, the piping may be intended to transport chemicals or exhaust flows, and in particular, the piping may be part of a semiconductor manufacturing process. [00012] A positive temperature coefficient (PTC) heating element may be a thermal device having a relatively high positive temperature coefficient of resistance when above a temperature (i.e., the Curie or transition temperature). When a constant voltage is applied, the electrical resistance of the PTC heating element remains substantially unchanged when the temperature of the positive temperature coefficient heating element is below the Curie temperature. Over time, the temperature of the PTC heating element increases as a result of resistance heating. When the temperature of the positive temperature coefficient heating element increases and becomes greater than the Curie temperature, the resistance of the PTC heating element may increase at a faster rate. Consequently, the current flow through the PTC heating element may decrease, and the PTC heating element may generate less hea