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KR-20260065828-A - Organopolysiloxane, organopolysiloxane composition and cured product thereof, organopolysiloxane for near-infrared optical waveguide, organopolysiloxane composition for near-infrared optical waveguide, cured product for near-infrared optical waveguide, and near-infrared optical waveguide and near-infrared optical transmission member, method for manufacturing a near-infrared optical waveguide

KR20260065828AKR 20260065828 AKR20260065828 AKR 20260065828AKR-20260065828-A

Abstract

The present invention provides an organopolysiloxane having a specific structure, an organic group including a polymerizable alkenyl group and a Q unit silicon (SiO 4/2 ), or a non-linear organopolysiloxane having a specific structure, an organic group including a polymerizable alkenyl group, and not having an aromatic structure.

Inventors

  • 고스게 다카히로
  • 안도 나오키
  • 사이토 다카히로
  • 후지모리 나오미

Assignees

  • 미쯔비시 케미컬 주식회사

Dates

Publication Date
20260511
Application Date
20240906
Priority Date
20230907

Claims (20)

  1. Organopolysiloxane represented by the following general formula [1]. (R 1 R 2 R 3 SiO 1/2 ) M1 (R 4 R 5 R 6 SiO 1/2 ) M2 (R 7 R 8 SiO 2/2 ) D1 (R 9 R 6 SiO 2/2 ) D2 (R 10 SiO 3/2 ) T1 (R 6 SiO 3/2 ) T2 (SiO 4/2 ) Q (O 1/2 R 11 ) Y1 (O 1/2 R 6 ) Y2 ···[1] [In the above formula [1], R1 to R5 and R7 to R11 are each independently one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms. R1 ~ R3 , R7 , R8 , R10 and R11 do not contain polymerizable alkenyl groups. R6 is one or more organic groups containing a polymerizable alkenyl group, and may be identical or different from each other, and 0≤M1, D1, T1, Y1, Y2, 0<Q, 0<M2+D2+T2≤0.25, 0.05<Y1, M1+M2+D1+D2+T1+T2+Q=1.
  2. A non-linear organopolysiloxane represented by the following general formula [21] and not having an aromatic structure. (R 2-1 R 2-2 R 2-3 SiO 1/2 ) M1 (R 2-4 R 2-5 R 2-6 SiO 1/2 ) M2 (R 2-7 R 2-8 SiO 2/2 ) D1 (R 2-9 R 2-6 SiO 2/2 ) D2 (R 2-10 SiO 3/2 ) T1 (R 2-6 SiO 3/2 ) T2 (SiO 4/2 ) Q (O 1/2 R 2-11 ) Y1 (O 1/2 R 2-6 ) Y2 ···[21] [In the above formula [21], R 2-1 to R 2-5 and R 2-7 to R 2-11 are each independently one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms. R 2-1 to R 2-3 , R 2-7 , R 2-8 , R 2-10 and R 2-11 do not contain polymerizable alkenyl groups. R 2-6 is one or more organic groups containing a polymerizable alkenyl group, and may be identical or different from each other, and 0≤M1, D1, T1, Y1, Y2, 0<M2+D2+T2≤0.25, 0.05<Y1, M1+M2+D1+D2+T1+T2+Q=1.
  3. An organopolysiloxane according to claim 1 or 2, wherein 0.12 < M2 + D2 + T2 ≤ 0.25 in the above formula [1] or formula [21].
  4. In claim 1 or 2, an organopolysiloxane in which Y1≤0.25 in the above formula [1] or formula [21].
  5. In paragraph 2, an organopolysiloxane in which 0<Q in the above formula [21].
  6. An organopolysiloxane according to claim 1 or 5, wherein 0.04≤Q in the above formula [1] or formula [21].
  7. In claim 1 or 2, an organopolysiloxane in which M1+M2<0.50 in the above formula [1] or formula [21].
  8. In claim 1, an organopolysiloxane that does not have an aromatic structure.
  9. An organopolysiloxane according to claim 1 or 2, wherein in the formula [1] or formula [21], the R6 or R2-6 has one or more functional groups selected from the group represented by the following formulas [2] to [5] in one molecule. [Painting 1] (In the above formula, X is a divalent organic group and may include a branched structure and/or a cyclic structure. When X is bonded to a silicon atom, the terminal atom of X and the atom directly connected to the silicon is a carbon atom. When X is bonded to an oxygen atom directly connected to the silicon, the terminal atom of X and the atom directly connected to the oxygen atom is a carbon atom. * indicates a bond loss.)
  10. The organopolysiloxane of claim 1 or 2, wherein R 6 or R 2-6 is a (meth)acryloyloxypropyl group.
  11. An organopolysiloxane composition comprising the organopolysiloxane described in claim 1 or 2 and at least a polymerization initiator.
  12. A cured product formed by curing the organopolysiloxane composition described in paragraph 11.
  13. A near-infrared waveguide manufactured using the organopolysiloxane composition described in paragraph 11.
  14. A near-infrared optical waveguide having a core and a clad, wherein the core and the clad are manufactured using the organopolysiloxane composition described in claim 11.
  15. A near-infrared light transmission member having at least the near-infrared optical waveguide described in paragraph 13.
  16. A near-infrared light transmission member having at least the near-infrared optical waveguide described in claim 14.
  17. A process (i-1) of applying a first curable polymer composition to a substrate surface to form a first polymer layer, A process (i-2) for producing a partially exposed layer having at least one exposed region and at least one non-exposed region by irradiating an active energy line with a wavelength of 150 to 800 nm to at least one selected region of the first polymer layer, A process (i-3) of removing the non-exposed region of the partially exposed layer using a solvent to form a patterned core Provide in this order, A method for manufacturing a near-infrared waveguide, wherein the first curable polymer composition is the organopolysiloxane composition described in claim 11.
  18. In claim 17, a process (i-4) of coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer, A process (i-5) of curing the second polymer layer to form an upper clad A method for manufacturing a near-infrared optical waveguide, further comprising
  19. A method for manufacturing a near-infrared waveguide, wherein, in claim 18, the second curable polymer composition is the organopolysiloxane composition described in claim 11.
  20. A process (ii-1) of applying a third curable polymer composition to a substrate surface to form a third polymer layer, A process (ii-2) for producing a partially exposed layer having at least one exposed region and at least one non-exposed region by irradiating an active energy line with a wavelength of 150 to 800 nm to at least one selected region of the third polymer layer, A process (ii-3) of removing the non-exposed region of the partially exposed layer using a solvent to form a patterned core, A process (ii-4) of forming a fourth polymer layer by coating the substrate surface and the core with a fourth curable polymer composition, A process (ii-5) of curing the above-mentioned fourth polymer layer to form an upper clad Provide in this order, A method for manufacturing a near-infrared waveguide, wherein at least one of the above-mentioned third curable polymer composition and the above-mentioned fourth curable polymer composition is an organopolysiloxane composition as described in claim 11.

Description

Organopolysiloxane, organopolysiloxane composition and cured product thereof, organopolysiloxane for near-infrared optical waveguide, organopolysiloxane composition for near-infrared optical waveguide, cured product for near-infrared optical waveguide, and near-infrared optical waveguide and near-infrared optical transmission member, method for manufacturing a near-infrared optical waveguide The present invention relates to an organopolysiloxane, an organopolysiloxane composition and a cured product thereof, an organopolysiloxane for a near-infrared optical waveguide, an organopolysiloxane composition for a near-infrared optical waveguide, a cured product for a near-infrared optical waveguide, and a near-infrared optical waveguide and a near-infrared optical transmission member, and a method for manufacturing a near-infrared optical waveguide. Recently, with the increasing demand for high speeds, high capacity, and low power consumption in communication and signal transmission, technologies that perform signal transmission using light instead of conventional electricity in device wiring are attracting attention. Such short-distance optical communication technologies are called optical interconnects, and their components involve replacing a portion of the copper electrical wiring on a printed circuit board with optical wiring using optical fibers or optical waveguides. The development of optoelectronic composite substrates as described above is actively underway, and in particular, for data center equipment, there is a demand for optical waveguides capable of connecting to near-infrared single-mode quartz-based optical fibers. In addition to microprocessability by photolithography, heat resistance capable of withstanding the reflow process during mounting, and low transmission loss at near-infrared wavelengths of 700 to 2500 nm, the material used for fabricating this optical waveguide is required to have a refractive index of approximately 1.4 to 1.5 at near-infrared wavelengths, which is equivalent to the core forming material of the near-infrared single-mode quartz-based optical fiber after curing, in order to reduce connection loss caused by reflection at the quartz-based optical fiber/optic waveguide interface. In addition, for single-mode waveguides, the difference in refractive index between the core material and the clad material constituting the optical waveguide is about 0.01 to 0.02, and the clad material used around the aforementioned core material is also required to have a refractive index of about 1.4 to 1.5 at near-infrared wavelengths, which is equivalent to the core forming material of the near-infrared single-mode quartz-based optical fiber. Organopolysiloxanes having reactive groups can be cited as candidate materials that satisfy these requirements, but it is difficult to achieve both heat resistance after curing and a refractive index of about 1.4 to 1.5 at near-infrared wavelengths. For example, Patent Document 1 discloses an organopolysiloxane having an aromatic ring structure, and the resin after curing has excellent heat resistance. However, the organopolysiloxane disclosed in Patent Document 1 adjusts the refractive index by adjusting the ratio of aliphatic hydrocarbon groups to aromatic hydrocarbon groups, and by having an aromatic ring structure, the resin after curing exhibits excellent heat resistance. However, it was not possible to obtain a refractive index less than 1.5 while maintaining heat resistance. In addition, Patent Document 2 discloses an organopolysiloxane having fluorine atoms, and it is thought that by adjusting the amount of fluorine atoms introduced, it is possible to set the refractive index after curing to 1.463 to 1.467. However, there is a concern that the heat resistance will deteriorate, and furthermore, the adhesion to the substrate will deteriorate. Figure 1 is a schematic cross-sectional view of an optical waveguide with a core formed on a substrate. Figure 2 is a schematic cross-sectional view of an optical waveguide in which a core and an upper clad are formed on a substrate. Figure 3 is a schematic cross-sectional view of an optical waveguide having a lower clad and a core formed on a substrate. Figure 4 is a schematic cross-sectional view of an optical waveguide in which a lower clad, a core, and an upper clad are formed on a substrate. The present invention will be described in detail below. Furthermore, the following description is merely an example of an embodiment of the present invention, and the present invention is not limited thereto unless it exceeds the gist thereof. In addition, in the present invention, "(meth)acrylic" means "either one or both of acrylic and methacrylic." In the present invention, the numerical range indicated using “~” refers to a range that includes the values listed before and after “~” as lower and upper limits. [Organopolysiloxane] Hereinafter, the first and second embodiments of the organopolysiloxane of the prese