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KR-20260065830-A - Organopolysiloxane, organopolysiloxane-containing resin composition and cured product thereof, organopolysiloxane for near-infrared optical waveguide, organopolysiloxane-containing resin composition for near-infrared optical waveguide, cured product for near-infrared optical waveguide, and near-infrared optical waveguide and near-infrared optical transmission member, method for manufacturing a near-infrared optical waveguide

KR20260065830AKR 20260065830 AKR20260065830 AKR 20260065830AKR-20260065830-A

Abstract

The present invention provides an organopolysiloxane for near-infrared optical waveguides having an organic group containing a polymerizable alkenyl group and a siloxane unit (D unit) represented by SiO 2/2 , wherein the ratio of aromatic groups in the total sum of all groups bonded to silicon atoms is 20 mol% or less, or a cured product comprising a crosslinked structure derived from an organic group containing a polymerizable alkenyl group and a siloxane unit (D unit) represented by SiO 2/2 , wherein the cured product has a refractive index of 1.400 or more and 1.500 or less at a wavelength of 1300 nm.

Inventors

  • 고스게 다카히로
  • 안도 나오키
  • 사이토 다카히로
  • 후지모리 나오미

Assignees

  • 미쯔비시 케미컬 주식회사

Dates

Publication Date
20260511
Application Date
20240906
Priority Date
20230907

Claims (20)

  1. Organopolysiloxane represented by the following general formula [1]. (R 1 R 2 R 3 SiO 1/2 ) M1 (R 4 R 5 R 6 SiO 1/2 ) M2 (R 7 R 8 SiO 2/2 ) + (R 9 R 6 SiO 2/2 ) D2 (R 10 SiO 3/2 ) T1 (R 6 SiO 3/2 ) T2 (SiO 4/2 ) Q (O 1/2 R 11 ) Y1 (O 1/2 R 6 ) Y2 ···[1] [In the above formula [1], R1 to R5 and R7 to R11 are each independently one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms. R1 ~ R3 , R7 , R8 , R10 and R11 do not contain polymerizable alkenyl groups. R6 is one or more organic groups containing a polymerizable alkenyl group, and may be identical or different from each other, and 0≤M1, 0≤Q, 0≤Y1, 0≤Y2, and 0<D1+D2, 0<M2+D2+T2, M1+M2+D1+D2+T1+T2+Q=1 and, The proportion of aromatic groups in the total sum of all groups bonded to silicon atoms is 20 mol% or less.
  2. In claim 1, an organopolysiloxane in which 0.1 < D1 + D2 in the above formula [1].
  3. In claim 1, an organopolysiloxane in which 0 < D1 is given in the above formula [1].
  4. In claim 1, an organopolysiloxane in which 0.02≤Y1≤0.25 in the above formula [1].
  5. In claim 1, an organopolysiloxane in which R7 to R9 in the above formula [1] do not include aromatic groups.
  6. In claim 1, an organopolysiloxane in which R1 to R11 in the above formula [1] do not include aromatic groups.
  7. In claim 1, the organopolysiloxane having one or more functional groups selected from the group represented by the following formulas [ 2 ] to [5] in the above formula [1]. [Painting 1] (In the above formula, X is a divalent organic group and may include a branched structure and/or a cyclic structure. If X is bonded to a silicon atom, the atom at the end of X that is directly bonded to silicon is a carbon atom. If X is bonded to an oxygen atom directly bonded to silicon, the atom at the end of X that is directly bonded to the oxygen atom is a carbon atom. * indicates a bond loss.)
  8. In claim 1, an organopolysiloxane in which, in the above formula [1], R6 is an acryloyloxypropyl group and/or a methacryloyloxypropyl group.
  9. In claim 1, an organopolysiloxane in which, in the above general formula [1], R7 and R8 are each independently alkyl groups having 1 to 20 carbon atoms.
  10. An organopolysiloxane-containing resin composition comprising an organopolysiloxane described in any one of claims 1 to 9 and a polymerization initiator.
  11. A cured product formed by curing the organosiloxane-containing resin composition described in paragraph 10.
  12. A near-infrared waveguide manufactured using the organosiloxane-containing resin composition described in paragraph 10.
  13. A near-infrared optical waveguide having a core portion and a clad portion, wherein both the core portion and the clad portion are manufactured using the organosiloxane-containing resin composition described in claim 10.
  14. A near-infrared light transmission member having at least the near-infrared optical waveguide described in paragraph 12.
  15. A near-infrared light transmission member having at least the near-infrared optical waveguide described in paragraph 13.
  16. A process (i-1) of forming a first polymer layer by applying a first curable polymer composition to a substrate surface, and A process (i-2) for producing a partially exposed layer having at least one exposed region and at least one non-exposed region by irradiating an active energy line with a wavelength of 150 to 800 nm to at least one selected region of the first polymer layer, and A process (i-3) of removing the non-exposed region of the partially exposed layer using a solvent to form a patterned core Provide in this order, A method for manufacturing a near-infrared waveguide, wherein the first curable polymer composition is the organopolysiloxane-containing resin composition described in claim 10.
  17. In claim 16, a process (i-4) of coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer, and A process (i-5) of curing the second polymer layer to form an upper clad A method for manufacturing a near-infrared optical waveguide, additionally comprising
  18. A method for manufacturing a near-infrared waveguide, wherein, in claim 17, the second curable polymer composition is the organopolysiloxane-containing resin composition described in claim 10.
  19. A process (ii-1) of applying a third curable polymer composition to a substrate surface to form a third polymer layer, and A process (ii-2) for producing a partially exposed layer having at least one exposed region and at least one non-exposed region by irradiating an active energy line with a wavelength of 150 to 800 nm to at least one selected region of the third polymer layer, and A process (ii-3) for forming a patterned core by removing the non-exposed region of the partially exposed layer using a solvent, and A process (ii-4) of forming a fourth polymer layer by coating the substrate surface and the core with a fourth curable polymer composition, and A process (ii-5) of curing the above-mentioned fourth polymer layer to form an upper clad Provide in this order, A method for manufacturing a near-infrared waveguide, wherein at least one of the above-mentioned third curable polymer composition and the above-mentioned fourth curable polymer composition is an organopolysiloxane-containing resin composition as described in claim 10.
  20. A method for manufacturing a near-infrared waveguide according to claim 19, wherein the third curable polymer composition and the fourth curable polymer composition are both the organopolysiloxane-containing resin compositions described in claim 10.

Description

Organopolysiloxane, organopolysiloxane-containing resin composition and cured product thereof, organopolysiloxane for near-infrared optical waveguide, organopolysiloxane-containing resin composition for near-infrared optical waveguide, cured product for near-infrared optical waveguide, and near-infrared optical waveguide and near-infrared optical transmission member, method for manufacturing a near-infrared optical waveguide The present invention relates to an organopolysiloxane, an organopolysiloxane composition and a cured product thereof, an organopolysiloxane for a near-infrared optical waveguide, a cured product for a near-infrared optical waveguide, a near-infrared optical waveguide and a near-infrared optical transmission member, and a method for manufacturing a near-infrared optical waveguide. Recently, with the increase in the speed and capacity of information and communication, optical interconnect technology that replaces electrical wiring with optical wiring is attracting attention. Conventionally, electrical wiring has been used for transmissions such as inter-device, intra-device, and inter-chip transmissions. However, as the volume of information increases and required transmission speeds rise, the use of electrical wiring is approaching its limits due to issues such as wiring density and increased power consumption. Optical interconnect technology is currently being developed as a replacement for electrical wiring. In optical interconnect technology, optical wiring is used for data transmission between devices and circuits. The advantages of optical wiring include low power consumption, high-density wiring, and the ability to achieve high-speed communication. As part of optical interconnect technology, development of optical waveguides that connect single-mode optical fibers with silicon photonics circuits is underway to accommodate the increase in data communication capacity. Among these, optical waveguides that use resist materials and do not require a reactive dry etching process are attracting attention due to their high productivity. In particular, for data center equipment requiring high-speed transmission, optical waveguides capable of connecting to near-infrared single-mode quartz-based optical fibers are required. From the perspective of efficiently forming fine optical waveguides, it is desired to form the optical waveguides as a cured product of a resin composition. Optical waveguides connected to optical fibers, like optical fibers, consist of a central core and a surrounding cladding, and propagate efficiently by total internal reflection. Therefore, in addition to the core constituting the waveguide having a higher refractive index than the cladding, it is required to appropriately balance the difference in refractive index between the core and the cladding. For example, Patent Document 1 discloses an organopolysiloxane having an aromatic hydrocarbon group as a material for an optical transmission member. Figure 1 is a schematic cross-sectional view of an optical waveguide with a core formed on a substrate. Figure 2 is a schematic cross-sectional view of an optical waveguide in which a core and an upper clad are formed on a substrate. Figure 3 is a schematic cross-sectional view of an optical waveguide having a lower clad and a core formed on a substrate. Figure 4 is a schematic cross-sectional view of an optical waveguide in which a lower clad, a core, and an upper clad are formed on a substrate. Hereinafter, embodiments of the present invention (which may also be referred to as the present embodiments) will be described in detail; however, the following description is merely an example of an embodiment, and the present invention is not limited thereto. [Organopolysiloxane] The organopolysiloxane of the first embodiment of the present invention (hereinafter referred to as the first embodiment) has an organic group including a polymerizable alkenyl group and a siloxane unit (D unit) represented by SiO₂ /2 . The organopolysiloxane of the present embodiment has a ratio of aromatic groups to the total of all groups bonded to silicon atoms of 20 mol% or less. Organopolysiloxanes having aromatic groups have been reported for use as optical waveguides with a large difference in refractive index between the core and clad sections for multimode applications. However, the inventors have discovered that the connection loss of a near-infrared optical waveguide obtained by using an organopolysiloxane in which the ratio of aromatic groups to the total of all groups bonded to silicon atoms is 20 mol% or less is reduced. Although not bound by any specific theory, the following is considered regarding the influence of aromatic groups. That is, if the aromatic groups of the organopolysiloxane are 20 mol% or less, the interaction between the aromatic rings is weakened, and the cured product obtained by curing the organopolysiloxane-containing resin composition becomes less likely to become soft,