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KR-20260065832-A - Circuit board equipped with resin particles and an insulating layer

KR20260065832AKR 20260065832 AKR20260065832 AKR 20260065832AKR-20260065832-A

Abstract

The present invention provides resin particles capable of exhibiting low thermal expansion and also low dielectric properties. The resin particles according to the present invention comprise a resin particle body and a plurality of silica particles, wherein the plurality of silica particles exist on the surface or inside the resin particle body, and the resin particle body is a polymer of a polymerizable component, and the polymerizable component comprises a polymerizable compound having one or more maleimide groups.

Inventors

  • 스기모토, 사토루
  • 나가이, 야스하루

Assignees

  • 세키스이가가쿠 고교가부시키가이샤

Dates

Publication Date
20260511
Application Date
20240906
Priority Date
20230913

Claims (13)

  1. It comprises a resin particle body and a plurality of silica particles, A plurality of the above silica particles exist on the surface or inside the resin particle body, and The above resin particle body is a polymer of a polymerizable component, and A resin particle comprising the above-mentioned polymerizable component, which is a polymerizable compound having one or more maleimide groups.
  2. In claim 1, the resin particles having a particle diameter of 0.5 μm or more.
  3. A resin particle according to claim 1 or 2, wherein the particle size of the silica particle is 1.0 μm or less.
  4. A resin particle according to any one of claims 1 to 3, wherein the ratio of the particle size of the silica particle to the particle size of the resin particle is 0.001 or more and 0.5 or less.
  5. A resin particle according to any one of claims 1 to 4, wherein the content of the silica particle is 0.1% by weight or more and 20% by weight or less of the resin particle 100% by weight.
  6. A resin particle according to any one of claims 1 to 5, wherein the content of a polymerizable compound having one or more maleimide groups is 10% by weight or more among 100% by weight of the polymerizable component.
  7. A resin particle according to any one of claims 1 to 6, wherein the polymerizable component comprises a crosslinkable monomer different from the polymerizable compound having one or more maleimide groups.
  8. In claim 7, the resin particle wherein the crosslinkable monomer is divinylbenzene or a polymerizable compound having two or more (meth)acryloyl groups.
  9. A resin particle according to claim 7 or 8, wherein the content of the crosslinkable monomer is 10% by weight or more of the 100% by weight of the polymerizable component.
  10. A resin particle according to any one of claims 1 to 9, wherein the thermal expansion coefficient of the resin particle at 50°C to 150°C is less than 150 ppm/°C.
  11. In any one of claims 1 to 10, the dielectric constant of the resin particles is 2.80 F/m or less, and A resin particle having a dielectric loss tangent of 0.01 or less.
  12. A resin particle according to any one of claims 1 to 11, wherein at least one of the plurality of silica particles has a portion of the silica particle present inside the resin particle body and a portion of the silica particle present on the surface of the resin particle body.
  13. circuit board and, The circuit board has an insulating layer disposed on the surface thereof, and A circuit board having an insulating layer, wherein the insulating layer comprises resin particles described in any one of claims 1 to 12.

Description

Circuit board equipped with resin particles and an insulating layer The present invention relates to resin particles comprising a polymer of a polymerizable compound having one or more maleimide groups, and a circuit board having an insulating layer using said resin particles. Bismaleimide resin is generally known to be a resin with low dielectric properties. Resin particles using bismaleimide resin are known. Patent Document 1 below discloses polybismaleimide cross-linked particles having specific repeating structural units. The polybismaleimide cross-linked particles are obtained by polymerizing a monomer having two maleimide groups alone or together with another monomer copolymerizable with it by a dispersion polymerization method. Patent Document 1 describes that the particle size of the polybismaleimide crosslinked particles can be 10 nm to 10 μm and that the polybismaleimide crosslinked particles have excellent monodispersity. In addition, Patent Document 1 describes that the polybismaleimide crosslinked particles can be used in resin compositions requiring high heat resistance, high insulation, and low dielectric properties. FIG. 1 is a cross-sectional view schematically illustrating resin particles according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view schematically illustrating resin particles according to a second embodiment of the present invention. FIG. 3 is a cross-sectional view schematically illustrating a multilayer printed circuit board using resin particles according to a first embodiment of the present invention. FIG. 4 is a cross-sectional view illustrating the location of silica particles included in the resin particles. The present invention will be described in detail below. Additionally, in this specification, for example, “(meth)acryloxy” means one or both of “acryloxy” and “methacryloxy,” and “(meth)acryl” means one or both of “acryl” and “methacryl.” (Resin particles) The resin particles according to the present invention comprise a resin particle body and a plurality of silica particles. In the resin particles according to the present invention, the plurality of silica particles exist on the surface or inside the resin particle body. In the resin particles according to the present invention, the resin particle body is a polymer of a polymerizable component, and the polymerizable component comprises a polymerizable compound having one or more maleimide groups. Since the resin particles according to the present invention are provided with the above-described configuration, they can exhibit low thermal expansion and also low dielectric properties. The resin particles according to the present invention can achieve both low thermal expansion and low dielectric properties. The resin particles according to the present invention are resistant to thermal expansion even when exposed to high temperatures, thereby increasing dimensional stability. In the resin particles according to the present invention, a plurality of silica particles may exist on the surface (outside) of the resin particle body, may exist inside the resin particle body, or may exist on both the surface (outside) and inside the resin particle body. In the resin particle, the entirety of any one silica particle may exist on the surface (outside) of the resin particle body, and a part of any one silica particle may exist (exposed) on the surface (outside) of the resin particle body. In the resin particle, the entirety of any one silica particle may exist inside the resin particle body, and a part of any one silica particle may exist inside the resin particle body. Any one silica particle may have a part existing inside the resin particle body (a part of one silica particle) and a part existing on the surface of the resin particle body (a part of one silica particle (the remaining part)). FIG. 4 is a cross-sectional view illustrating the location of silica particles included in the resin particles. For the silica particle X shown in FIG. 4, the entire silica particle X exists on the surface of the resin particle body. For the silica particle Y shown in FIG. 4, the entire silica particle Y exists inside the resin particle body. For the silica particle Z shown in FIG. 4, a part of the silica particle Z exists inside the resin particle body, and a part of the silica particle Z (the remaining part) exists on the surface of the resin particle body. The resin particle may contain silica particle X, may contain silica particle Y, or may contain silica particle Z. In the resin particles, all of the silica particles may exist on the surface (outside) of the resin particle body, and some (at least one) of the silica particles may exist on the surface (outside) of the resin particle body. In the resin particles, all of the silica particles may exist on the surface (outside) of the resin particle body, and at least one of the silica particles may exist on the surface (outside) of the resin particle bod