Search

KR-20260065888-A - Packaging bags and packaging methods for goods

KR20260065888AKR 20260065888 AKR20260065888 AKR 20260065888AKR-20260065888-A

Abstract

A packaging bag and a packaging method capable of suppressing the effect on stored goods under high temperature and high humidity environments are provided. As a packaging bag (30) for goods, it is formed from a film substrate having a water vapor permeability of 1.5 g/( m² ·24h) or less at a temperature of 40°C and a relative humidity of 90% RH, and contains a carrier tape (1), a cover tape (10), or a tape packaging body (20) together with a desiccant (40) that absorbs moisture from the air. As a method for packaging an article, the method comprises an article storage process in which a carrier tape (1), a cover tape (10), or a tape packaging body (20) is stored in a packaging bag (30), a desiccant storage process in which a desiccant (40) that absorbs moisture from the air is stored in the packaging bag (30), and a sealing process in which an opening of the packaging bag (30) is sealed. The packaging bag (30) is formed from a film substrate having a water vapor permeability of 1.5 g/( m² ·24h) or less for a temperature of 40°C and a relative humidity of 90% RH.

Inventors

  • 스기모토 시로
  • 나카다 유키

Assignees

  • 신에츠 폴리머 가부시키가이샤

Dates

Publication Date
20260511
Application Date
20240311
Priority Date
20231019

Claims (4)

  1. As a packaging bag for goods, It is formed with a film substrate having a water vapor permeability of 1.5 g/( m² ·24h) or less at a temperature of 40℃ and a relative humidity of 90% RH, and A packaging bag characterized by housing a carrier tape having a storage cavity, a cover tape used to seal the upper opening of the storage cavity of the carrier tape, together with a desiccant that absorbs moisture from the air, or a tape packaging body in which the storage cavity of the carrier tape housing the parts is sealed with a cover tape.
  2. In paragraph 1, A packaging bag characterized in that the above-mentioned desiccant is silica gel-based or clay-based.
  3. In paragraph 1 or 2, A packaging bag characterized by the above film substrate having an aluminum deposition layer or an aluminum foil layer.
  4. As a method of packaging goods, A carrier tape having a storage cavity, a cover tape used to seal the upper opening of the storage cavity of the carrier tape, or a process for storing an item in a packaging bag, wherein the storage cavity of the carrier tape containing the component is sealed with a cover tape, and a tape packaging body having the storage cavity of the carrier tape sealed with a cover tape. A desiccant storage process for storing a desiccant that absorbs moisture from the air in the above-mentioned packaging bag, and It includes a sealing process for sealing the opening of the above-mentioned packaging bag, and A packaging method characterized in that the above packaging bag is formed from a film substrate having a water vapor permeability of 1.5 g/( m² ·24h) or less at a temperature of 40℃ and a relative humidity of 90% RH.

Description

Packaging bags and packaging methods for goods The present invention relates to a packaging bag for packaging articles and a packaging method. A carrier tape having a storage recess is shipped (transported), stored, etc. as a tape package after electronic components or semiconductor components are inserted into the storage recess, the upper opening of the storage recess is sealed with a cover tape, and the tape is wound onto a winding reel (wound body). FIG. 1 is a perspective view showing a tape package wound on a winding reel. FIG. 2 is a flowchart illustrating a packaging method of an embodiment related to the present invention. FIG. 3 is an exploded view showing a packaging bag of an embodiment related to the present invention. Figure 4 is Table 1 showing the experimental results of Experimental Example A. Figure 5 is Table 2 showing the experimental results of Experimental Example B. Figure 6A is a schematic diagram showing a method for measuring bending. Figure 6B is a schematic diagram showing the method of measuring ripples. Hereinafter, embodiments related to the present invention will be described in detail with reference to the drawings. In addition, in the embodiments of this specification, the same reference numerals are used throughout for identical components. FIG. 1 is a perspective view showing a tape package (20) (carrier tape (1), cover tape (10)) wound on a winding reel (50). The tape packaging body (20) stores multiple component EPs, stores them, transports them, or smoothly supplies component EPs to a mounting machine that mounts component EPs on a substrate. This tape packaging body (20) is composed of a carrier tape (1) containing component EPs such as electronic components or precision components and a cover tape (10), and in this embodiment, it is wound on a winding reel (50). Additionally, the state in which the tape packaging body (20) is wound on the winding reel (50) is sometimes referred to as a wound body. The carrier tape (1) has a plurality of transfer holes (2) and storage recesses (3) for storing parts EP, each at a predetermined pitch, along the length direction (transport direction) of the resin sheet substrate. The transfer hole (2) is circular in shape when viewed in planar form, but the shape and spacing of the transfer hole (2) are formed to match a transfer mechanism such as a mounting machine. Meanwhile, the storage recess (3) is approximately rectangular in shape, but is formed to match the shape of the part EP, and a base may be formed on the bottom surface of the storage recess (3), or a bottom hole may be additionally formed for inspection or to ensure stability in inserting or removing the stored part. The width of the carrier tape (1) is not particularly limited and may be, for example, 4 mm, 8 mm, 12 mm, 16 mm, 24 mm, 32 mm, 44 mm, 56 mm, 72 mm, etc. Also, the thickness of the carrier tape (1) (or the sheet material before molding) is not particularly limited and may be, for example, 0.1 mm or more and 1.0 mm or less, and preferably 0.2 mm or more and 0.5 mm or less. And, the carrier tape (1) is formed from synthetic resins such as polyvinyl chloride (PVC), polystyrene (PS), amorphous polyethylene terephthalate (A-PET), polycarbonate (PC), polypropylene (PP), polyurethane (PU), polytetrafluoroethylene (PTFE), polyamide (PA), polylactic acid (PLA), acrylonitrile butadiene styrene, styrene acrylonitrile copolymer, acrylic (PMMA), etc., or from materials to which carbon is mixed to impart conductivity, or from materials to which a conductive coating is applied to the surface. In addition, the carrier tape (1) may also be formed from paper material. This carrier tape (1) is sealed with a cover tape (10) to cover the upper opening of the storage recess (3) after the component EP is stored in the storage recess (3) in the taping device. The cover tape (10) has a width according to the dimensions and shape of the carrier tape (1) and the storage recess (3) so as to cover at least the upper opening of the storage recess (3). Also, the thickness of the cover tape (10) may be, for example, about 0.02 mm or more and 0.2 mm or less. Also, the cover tape (10) is formed by attaching a uniaxial or biaxially stretched film, such as polypropylene (PP), polyethylene terephthalate (PET), polyamide (PA), polyethylene naphthalate (PEN), or polyethylene (PE), by dry laminate, sandwich laminate, or extrusion laminate. Additionally, the cover tape (10) may be formed by applying an antistatic treatment or a conductive treatment to these resin tapes (films). In addition, the carrier tape (1) and cover tape (10) of the present embodiment are sealed by an adhesive (layer) or a pressure-sensitive adhesive (layer) installed on the cover tape (10), but they are sealed by heat compression using a heat iron or ultrasonic waves. Examples of these adhesive/pressure-sensitive adhesive layers include polystyrene-based resin, polyester-based resin, vinyl acetate-based resin, acrylic-based resin