KR-20260065898-A - Substrate processing device and substrate processing method

KR20260065898AKR 20260065898 AKR20260065898 AKR 20260065898AKR-20260065898-A

Abstract

The substrate processing device is equipped with a processing liquid nozzle (30) that discharges a processing liquid downward toward the upper surface of the substrate. The outer surface (30s) of the processing liquid nozzle (30) includes a water-repellent surface (72).

Inventors

와키타 아스카

Assignees

가부시키가이샤 스크린 홀딩스

Dates

Publication Date: 20260511
Application Date: 20240827
Priority Date: 20230922

Claims (10)

A substrate holder that keeps the substrate horizontal, and A processing liquid nozzle is provided to discharge the processing liquid downward toward the upper surface of the substrate maintained in the substrate holder, and A substrate processing device wherein the outer surface of the above-mentioned processing liquid nozzle includes a water-repellent surface.
In claim 1, A substrate processing device comprising a water-repellent surface including a concave portion, at least a portion of which is filled with air, and a convex portion within the concave portion that is in contact with the air and is in contact with the water.
In claim 2, The above-mentioned uneven surface is a substrate processing device made of fluoropolymer.
In any one of claims 1 to 3, A substrate processing device wherein the outer surface of the above-mentioned processing liquid nozzle includes the above-mentioned water-repellent surface and the above-mentioned mirror surface.
In claim 4, The above-mentioned treatment liquid nozzle includes an arm portion extending horizontally and a nozzle portion extending downward from the arm portion and discharging the treatment liquid downward. The above mirror surface is a substrate processing device formed in the above nozzle portion.
In claim 5, The above-mentioned water-repellent surface is a substrate processing device formed in the above-mentioned arm portion.
In claim 4, A substrate processing device in which the contact angle of water with respect to the mirror surface exceeds 90 degrees.
In any one of claims 1 to 3, A spin motor that rotates the substrate held in the substrate holder around a vertical rotation axis passing through the center of the substrate, and A horizontal actuator that generates power to move the processing liquid nozzle horizontally between a processing position that overlaps when viewed from a plane on the substrate where the processing liquid nozzle is maintained in the substrate holder, and a standby position that does not overlap when viewed from a plane on the substrate where the processing liquid nozzle is maintained in the substrate holder; A substrate processing device further comprising a control device that, after supplying the processing liquid to the upper surface of the substrate held in the substrate holder by the processing liquid nozzle located at the processing position, dries the substrate by rotating the substrate by the spin motor, and moves the processing liquid nozzle from the processing position to the standby position by the horizontal actuator.
In any one of claims 1 to 3, A horizontal actuator that generates power to move the processing liquid nozzle horizontally between a processing position that overlaps when viewed from a plane on the substrate where the processing liquid nozzle is maintained in the substrate holder, and a standby position that does not overlap when viewed from a plane on the substrate where the processing liquid nozzle is maintained in the substrate holder; A cleaning nozzle that discharges a cleaning liquid toward the outer surface of the processing liquid nozzle located at the above standby position, and A substrate processing apparatus further comprising a drying nozzle that discharges drying gas toward the outer surface of the processing liquid nozzle located at the above standby position.
A step of discharging a processing liquid downward from a processing liquid nozzle toward the upper surface of a substrate that is horizontally maintained by a substrate holder, and A substrate treatment method comprising the step of contacting mist and droplets generated when the treatment liquid nozzle is discharging the treatment liquid with a water-repellent surface formed on the outer surface of the treatment liquid nozzle.

Description

Substrate processing device and substrate processing method This application claims priority based on Japanese Patent Application No. 2023-159046 filed on September 22, 2023, and the entire contents of this application are incorporated herein by reference. The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate. Substrates include, for example, semiconductor wafers, substrates for Flat Panel Displays (FPDs) such as liquid crystal displays or organic EL (electroluminescence) displays, substrates for optical discs, substrates for magnetic discs, substrates for magneto-optical discs, substrates for photomasks, ceramic substrates, substrates for solar cells, etc. Patent Document 1 discloses discharging a processing liquid from an upper surface processing liquid nozzle located at a processing position toward the upper surface of a substrate rotating in a horizontal position, and cleaning and drying the upper surface processing liquid nozzle located at a standby position with a cleaning liquid. FIG. 1a is a schematic plan view showing the layout of a substrate processing apparatus according to one embodiment of the present invention. FIG. 1b is a schematic side view of a substrate processing device. FIG. 2 is a schematic diagram of the interior of a processing unit equipped in a substrate processing device, viewed horizontally. Figure 3 is a schematic plan view showing the interior of the processing unit. Figure 4 is a schematic diagram of the processing liquid nozzle viewed in a horizontal direction perpendicular to the centerline of the arm portion. Figure 5 is a block diagram showing the electrical configuration of a substrate processing device. Figure 6 is a process diagram for explaining an example of substrate processing performed by a substrate processing device. FIG. 7 is a schematic plan view showing a processing liquid nozzle, a cleaning nozzle, a first drying nozzle, and a second drying nozzle. FIG. 8 is a schematic diagram of the treatment liquid nozzle, cleaning nozzle, first drying nozzle, and second drying nozzle viewed horizontally. FIG. 9 is a schematic diagram showing an example of a water-repellent surface and a mirror surface formed on the outer surface of a treatment liquid nozzle. FIG. 10 is a schematic cross-sectional view showing an example of a droplet in contact with a smooth surface. FIG. 11 is a schematic cross-sectional view showing an example of a droplet in contact with a rough surface in a Wenzel state. FIG. 12 is a schematic cross-sectional view showing an example of a droplet in contact with a rough surface in a Cassie-Baxter state. FIG. 13 is a schematic diagram for explaining the mist and droplets generated when the treatment liquid nozzle is discharging the treatment liquid. FIG. 14 is a schematic diagram showing the state of moving the processing liquid nozzle from the processing position to the standby position while drying the substrate. FIG. 15 is a schematic diagram of a treatment liquid nozzle viewed horizontally according to another embodiment of the present invention. FIG. 1a is a schematic plan view showing the layout of a substrate processing apparatus (1) according to one embodiment of the present invention. FIG. 1b is a schematic side view of the substrate processing apparatus (1). The substrate processing device (1) is a single-wafer type device that processes substrates (W) in the shape of a wafer, such as a semiconductor wafer, one by one. The substrate processing device (1) is equipped with a load port (LP) that maintains a carrier (CA) that receives the substrate (W), a plurality of processing units (2) that process the substrate (W) returned from the carrier (CA) on the load port (LP) with a processing fluid such as a processing liquid or a processing gas, a transport system (TS) that returns the substrate (W) between the carrier (CA) on the load port (LP) and the plurality of processing units (2), and a control device (3) that controls the substrate processing device (1). A plurality of processing units (2) form a plurality of towers (TW). FIG. 1a shows an example in which four towers (TW) are formed. As shown in FIG. 1b, a plurality of processing units (2) included in one tower (TW) are stacked vertically. As shown in FIG. 1a, the plurality of towers (TW) form two rows extending in the inner longitudinal direction of the substrate processing device (1) when viewed from a planar view. When viewed from a planar view, the two rows face each other with a conveyor path (TP) in between. The conveying system (TS) includes an indexer robot (IR) that conveys a substrate (W) between a carrier (CA) on a load port (LP) and a plurality of processing units (2), and a center robot (CR) that conveys the substrate (W) between the indexer robot (IR) and the plurality of processing units (2). The indexer robot (IR) is positioned between the load port (LP) and the center robot (CR) when viewed from a planar