KR-20260065944-A - Composition and the cured body thereof

Abstract

The present disclosure provides a method for obtaining a cured body comprising an epoxy compound and a resin having aromatic vinyl groups as functional groups, an epoxy resin-based composition with improved low dielectric performance and the cured body thereof, and an electrical insulating material, etc. The present disclosure provides a composition comprising an epoxy compound, a resin having aromatic vinyl groups as functional groups, and an active vinyl compound, the cured body thereof, and an electrical insulating material. Preferably, the resin having aromatic vinyl groups as functional groups is an olefin-aromatic vinyl compound-aromatic polyene copolymer. Preferably, the active vinyl compound is one or more compounds selected from the group consisting of maleimide compounds and cyanate compounds.

Inventors

• 아라이 토루

Assignees

• 덴카 주식회사

Dates

Publication Date

20260511

Application Date

20241002

Priority Date

20231006

Claims (9)

1. A composition comprising an epoxy compound, a resin having an aromatic vinyl group as a functional group, and an active vinyl compound.
2. A composition according to claim 1, wherein the resin having the aromatic vinyl group as a functional group is an olefin-aromatic vinyl compound-aromatic polyene copolymer.
3. A composition according to claim 1, wherein the active vinyl compound is one or more compounds selected from the group consisting of maleimide compounds and cyanate compounds.
4. A composition according to claim 1, further comprising a compound having one or more functional groups selected from the group consisting of amino groups, phenolic hydroxyl groups, carboxyl groups, and carboxylic acid anhydrides.
5. A composition according to claim 2 in which the olefin-aromatic vinyl compound-aromatic polyene copolymer satisfies all of the following conditions (1) to (4). (1) The number average molecular weight of the copolymer is 500 or more and less than 30,000. (2) The above aromatic vinyl compound monomer is an aromatic vinyl compound having 8 to 20 carbon atoms, and the content of the above aromatic vinyl compound monomer unit is 0 to 98 mass%. (3) The above aromatic polyene monomer is one or more selected from polyenes having 5 to 20 carbon atoms having multiple vinyl groups and/or vinylene groups in the molecule, and the content of vinyl groups and/or vinylene groups derived from the above aromatic polyene monomer unit is 2 to 30 per number average molecular weight. (4) A single or multiple units selected from olefin monomer units with 2 to 20 carbon atoms may be included, and when the aromatic vinyl compound monomer unit and the aromatic polyene monomer unit are present, the total amount of the olefin monomer unit is 100 mass%.
6. A cured body obtained from the composition described in claim 1.
7. In claim 6, a hardened body which is an electrical insulating material.
8. A CCL substrate, FCCL substrate, interlayer insulating material, or coverlay comprising the cured body described in claim 6.
9. A CCL substrate, FCCL substrate, interlayer insulating material, or coverlay comprising the cured body described in claim 7.

Description

Composition and the cured body thereof The present invention relates to an epoxy compound, a resin having an aromatic vinyl group as a functional group, a composition comprising an active vinyl compound and a cured body thereof, and an electrical insulating material, etc. As communication frequencies transition to the gigahertz band and, in particular, to the millimeter wave band of 30 gigahertz or higher, the low dielectric properties required for insulating materials used in multilayer substrates, transmission lines, antennas, etc., made of CCL or FCCL, are becoming an increasingly demanding requirement. Fluorine-based resins such as perfluoroethylene possess excellent low dielectric constant, low dielectric loss, and heat resistance, but their application to multilayer substrates is difficult due to difficulties in moldability and film formation, as well as challenges regarding adhesion to copper foil in wiring. On the other hand, substrates and insulating materials using post-curing resins such as epoxy resin, unsaturated polyester resin, polyimide resin, and phenolic resin are widely used due to their heat resistance and ease of handling; however, improvements are desired for high-frequency insulating materials because their dielectric constant and dielectric loss are relatively high. Therefore, attention is being focused on hydrocarbon resins that inherently possess low dielectric properties. In order to convert hydrocarbon resins, which are originally thermoplastic resins, into curable resins, it is necessary to introduce functional groups. However, since functional groups that crosslink with radicals or heat generally have polarity, introducing these functional groups into hydrocarbon resins degrades dielectric properties. If one intends to introduce functional groups composed solely of hydrocarbons, such as aromatic vinyl groups, it often involves intermolecular reactions between expensive hydrocarbon monomers (Patent Document 1), which is often not economical. Curable bodies have been proposed that consist of ethylene-olefin (aromatic vinyl compound)-aromatic polyene copolymers and non-polar vinyl compound copolymers, which are obtained from specific coordination polymerization catalysts and have specific compositions and formulations. In this copolymer, only one of the two aromatic vinyl groups of the aromatic polyene (divinylbenzene) unit is selectively copolymerized while the remaining aromatic vinyl group is preserved, making it easy to obtain a crosslinkable hydrocarbon copolymer macromonomer having the functional group of the aromatic vinyl group. The cured body obtained from the composition of this olefin-aromatic vinyl compound-aromatic polyene copolymer and auxiliary materials has the characteristics of low dielectric constant and low dielectric loss tangent (Patent Documents 2, 3, 4). Furthermore, a dendrite copolymer having the aromatic vinyl group as a functional group, obtained by copolymerizing a styrene-based monomer with an aromatic polyene (divinylbenzene) by cationic polymerization, has also been proposed (Patent Document 5). However, although these copolymers have excellent low dielectric properties, they do not react with the epoxy resin widely used in this insulating material, so it has been considered difficult to use them as additives to epoxy resins. Embodiments of the present invention will be described in detail below. However, the following embodiments are examples for explaining the present invention, and the present invention is not limited thereto. That is, the present invention may be implemented with arbitrary modifications within the scope without departing from the gist thereof. The compositions according to the present embodiment are described in more detail below. In this specification, the term "sheet" is understood to include the concept of a film. Furthermore, even if a term is described as "film" in this specification, it is understood to include the concept of a sheet. In this specification, the term "composition" is understood to include varnish. That is, a composition that is particularly liquid is described as varnish. In this specification, the term "interlayer insulating material" includes the concept of a bonding sheet or an interlayer adhesive. The term "epoxy compound" refers to a compound having a single or multiple epoxy groups within its molecule; it may be called an epoxy prepolymer or simply an epoxy resin, and there is no limit on its molecular weight, and it also includes polymer compounds. Furthermore, the term "active vinyl compound" refers to a compound having a single or multiple active vinyl groups within its molecule; there is no limit on its molecular weight, and it also includes polymer compounds. In this specification, numerical ranges are defined to include their lower and upper limits unless otherwise specified. For example, the notation of a numerical range as “1 to 100” includes both the lower limit “1” and the upper limit “100”.