KR-20260066011-A - FORMING APPARATUS, FORMING METHOD, AND ARTICLE MANUFACTURING METHOD

KR20260066011AKR 20260066011 AKR20260066011 AKR 20260066011AKR-20260066011-A

Abstract

If it is determined that a forming process can be performed, the curable composition on the substrate is cured by the first curing unit while the member is in contact with the curable composition, the member is separated, and the curable composition is further cured by the second curing unit. If it is determined that a forming process cannot be performed, the curable composition is not cured by the first curing unit, and the curable composition is cured by the second curing unit while the curable composition is separated from the member. As a result, even when normal processing cannot be performed, the removal of the substrate coated with the uncured composition and contamination of the inside and outside of the device can be prevented.

Inventors

곤도 요우스케

Assignees

캐논 가부시끼가이샤

Dates

Publication Date: 20260512
Application Date: 20260417
Priority Date: 20220530

Claims (6)

A forming apparatus configured to cure a curable composition while a member is in contact with the curable composition on the substrate in order to form a layer on the substrate, and A coating unit configured to apply the above-mentioned curable composition to the substrate; A first curing unit configured to cure the curable composition on the substrate; A second curing unit configured to cure the curable composition on the substrate by heating; and A control unit configured to perform a forming process for forming the layer by controlling the first curing unit to cure the curable composition applied to the substrate by the application unit while the above member is in contact with the curable composition, and then controlling the second curing unit to further cure the curable composition separated from the above member. A forming apparatus, wherein the control unit is configured to control the second curing unit to cure the curable composition in a state where the member is not in contact with the curable composition, when it is determined that the member cannot come into contact with the curable composition within a predetermined time after the curable composition is applied to the substrate by the application unit.
In paragraph 1, A forming device configured such that, when it is determined that the curable composition by the first curing unit has not been sufficiently cured even when the member is in contact with the curable composition, the control unit controls the second curing unit to separate the member and then cure the curable composition.
In paragraph 1, A forming device configured such that the above control unit performs control to make the processing time as a heating condition of the second curing unit in a second case in which curing is performed by the second curing unit rather than the first curing unit shorter than the processing time as a heating condition of the second curing unit in a first case in which curing is additionally performed by the second curing unit after curing is performed by the first curing unit.
In paragraph 1, A forming device configured such that the first curing unit above cures the curable composition by light irradiation.
A forming method for curing a curable composition while a member is in contact with the curable composition on the substrate to form a layer on the substrate, and A step of applying the above curable composition to the substrate; A step of determining whether the member can come into contact with the curable composition within a predetermined time after the curable composition is applied to the substrate; If it is determined that the member can come into contact with the curable composition within the above-determined time, the step of curing the curable composition on the substrate while the member is in contact with the curable composition, separating the member, and further curing the curable composition by heating using a second curing unit; and A method for forming, comprising the step of performing curing by the second curing unit in a state where the member is not in contact with the curable composition when it is determined that the member cannot come into contact with the curable composition within the above-determined time.
It is a method of manufacturing an item, and A step of performing a process on the substrate using the forming device according to claim 1; and A method for manufacturing an article, comprising the step of manufacturing an article by performing processing on the substrate on which the above processing has been performed.

Description

Forming apparatus, forming method, and article manufacturing method The present invention relates to a forming apparatus, a forming method, and a method for manufacturing an article. As the demand for the miniaturization of semiconductor devices increases, microfabrication technology is attracting attention in addition to conventional photolithography technology. This technology involves molding an uncured composition on a substrate using a mold, curing the composition, and forming a pattern of the composition on the substrate. This technology is called imprint technology and can form fine patterns of a few nanometers on a substrate. As an example of imprint technology, there is a photocuring method. An imprint device employing the photocuring method forms a pattern on a substrate by molding a photocurable composition supplied to a shot area on the substrate into a mold, curing the composition by irradiating it with light, and separating the cured composition from the mold. Recently, a technique for planarizing a composition on a substrate has been proposed (Japanese unexamined patent application publication number 2011-529626). The technique disclosed in Japanese unexamined patent application publication number 2011-529626 attempts to increase the precision of planarization by enabling the dropping of a composition based on the level difference of the substrate and enabling the curing of the composition while the dropped composition is in contact with the flat surface of the mold. Figure 1 is a schematic diagram illustrating the configuration of a flattening device. Figure 2 is a drawing illustrating the configuration of the coating module of a flattening device. Figure 3 is a diagram illustrating the configuration of the flattening module of a flattening device. Figure 4 is a diagram illustrating the configuration of the heat treatment module of the flattening device. Figures 5a to 5c are drawings illustrating a flattening process. Figure 6 is a flowchart illustrating the flow of the flattening process in the flattening device. Figure 7 is a graph illustrating heat treatment in a heat treatment module. Figure 8 is a graph illustrating the polymerization conversion rate of a curable composition. Preferred exemplary embodiments of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same components are indicated by the same reference numeral, and their redundant description is omitted. FIG. 1 is a schematic diagram illustrating the configuration of a flattening device (100) (flattening system) used as a forming device. In this specification and drawings, directions are indicated in an X-Y-Z coordinate system in which the horizontal plane is the X-Y plane. Hereinafter, directions parallel to the X-axis, Y-axis, and Z-axis in the X-Y-Z coordinate system are referred to as the X direction, Y direction, and Z direction, respectively. The flattening device (100) includes a coating module (101) (coating unit) for applying a curable composition, a flattening module (102) for performing flattening using a flattening member (109) (super straight), and a heat treatment module (103) for performing heat treatment. Additionally, a conveying mechanism (104), a flattening member in/out mechanism (105), a substrate in/out mechanism (106), a control unit (111), and an input unit (112) are arranged. The flattening device (100) according to the present invention can form a flat surface of a cured composition on a substrate comprehensively or locally by curing the cured composition while in contact with a flattening member (109) on a substrate and separating the cured composition from the flattening member (109). In addition, the flattening device (100) can further cure the separated cured composition, thereby making the composition into a cured state suitable for post-processing. In this exemplary embodiment, an example is described in which one coating module (101), one flattening module (102), and one heat treatment module (103) are arranged in a flattening device (100). Note that a plurality of coating modules (101), a plurality of flattening modules (102), and a plurality of heat treatment modules (103) may be arranged. Although a silicon wafer is a representative base material of the substrate (110), the base material of the substrate (110) is not limited thereto. The base material of the substrate (110) may be freely selected from materials known as base materials for semiconductor devices, such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, silicon nitride, etc. The substrate (110) used may be a substrate in which an adhesion layer is formed by surface treatments such as silane coupling treatment, silazane treatment, and the deposition of an organic thin film, and the adhesion to a curable composition is increased. The substrate (110) typically has a circular outer shape with a diameter of 300 mm or 2