KR-20260066147-A - Thin film diaphragm capacitive electrode

KR20260066147AKR 20260066147 AKR20260066147 AKR 20260066147AKR-20260066147-A

Abstract

An implantable sensor device comprises a deflection diaphragm layer containing a vapor-deposited thin film metal, a first capacitive electrode conformally formed on a first side of the deflection diaphragm layer, and a second capacitive electrode coupled to a rigid substrate, wherein the second capacitive electrode and the first capacitive electrode form a variable capacitor. The implantable sensor device is manufactured by depositing a thin film metal layer on a substrate using a physical vapor deposition process and depositing a conformal layer of an electrical conductor on a stack containing the thin film metal layer.

Inventors

리오스 구스타보
시몬스 알렉산더 에이치

Assignees

에드워즈 라이프사이언시스 코포레이션

Dates

Publication Date: 20260512
Application Date: 20240826
Priority Date: 20230907

Claims (20)

As an implantable sensor device, Deflectable diaphragm layer comprising a vapor-deposited thin film metal; A first capacitive electrode formed conformally on a first side of the above-mentioned biasing diaphragm layer; and An implantable sensor device comprising a second capacitive electrode coupled to a rigid substrate, wherein the second capacitive electrode and the first capacitive electrode form a variable capacitor.
An implantable sensor device according to claim 1, further comprising a first dielectric layer disposed between the biasing diaphragm layer and the first side of the first capacitive electrode.
An implantable sensor device according to paragraph 2, wherein the first dielectric layer electrically insulates the first capacitive electrode from the biasing diaphragm layer.
An implantable sensor device according to paragraph 2, further comprising a second dielectric layer disposed on a second side of the first capacitive electrode.
An implantable sensor device according to any one of claims 1 to 4, further comprising one or more electrical contact portions protruding from the first capacitive electrode, wherein the one or more electrical contact portions are in physical contact with the first capacitive electrode.
In paragraph 5, The first capacitive electrode is elliptical in shape; An implantable sensor device in which one or more of the above electrical contacts are elongated contacts arranged along the periphery of the first capacitive electrode.
An implantable sensor device according to any one of claims 1 to 4, wherein the biasing diaphragm layer and the first capacitive electrode form a stack having a thickness of less than 10 μm.
An implantable sensor device according to any one of claims 1 to 4, wherein the biasing diaphragm layer comprises a protrusion associated with one or more sides thereof.
An implantable sensor device according to claim 8, wherein the protrusion is formed using etching, masking, or electroplating.
In claim 8, the above-mentioned protrusion is a waveform portion, an implantable sensor device.
An implantable sensor device according to any one of claims 1 to 4, wherein the first capacitive electrode comprises a protrusion associated with one or more sides thereof.
An implantable sensor device according to claim 11, wherein the protrusion is formed using etching, masking, or electroplating.
As a method for manufacturing an implantable sensor device, the method A step of depositing a thin metal layer on a substrate using a physical vapor deposition process; and A method comprising the step of depositing an conformal layer of an electrical conductor on a stack comprising the above-mentioned thin film metal layer.
A method according to claim 13, further comprising the step of forming a first dielectric layer on the surface of the thin film metal layer after depositing the thin film metal layer and before depositing the electrical conductor layer, wherein the electrical conductor layer is deposited on the first dielectric layer.
A method according to claim 14, further comprising the step of forming a second dielectric layer on the electrical conductor layer.
A method comprising, in any one of claims 13 to 15, further comprising the step of forming an electrical contact flange on the electrical conductor layer.
A method according to any one of claims 13 to 15, further comprising the step of forming a surface protrusion on the surface of the thin film metal layer.
A method comprising, in any one of claims 13 to 15, further comprising the step of forming a surface protrusion on the electrical conductor layer.
In any one of paragraphs 13 through 15, A step of bonding a plate structure comprising at least the thin film metal layer and the electrical conductor layer to a base structure comprising a capacitive electrode to form a sealed cavity comprising a space between the electrical conductor layer and the capacitive electrode; and A method further comprising the step of forming a sealing flange within or on the thin film metal layer, wherein the step of joining the plate structure to the base structure comprises the step of joining the contact surface of the sealing flange to the base structure.
A method according to any one of claims 13 to 15, further comprising the step of forming one or more waveform portions on a part of the thin film metal layer, wherein the one or more waveform portions are coaxial with the electrical conductor layer.

Description

Thin film diaphragm capacitive electrode Related applications This application claims priority to U.S. Provisional Application No. 63/581,226, filed September 7, 2023, titled Thin-Film Diaphragm Capacitive Electrode, the entire disclosure of which is incorporated herein by reference in its entirety. The present disclosure generally relates to the field of sensor devices. Some sensor devices, such as those suitable for medical implantation, may include a deflectable diaphragm. The size, elasticity, conformability, biocompatibility, shape, and other characteristics of such deflectable diaphragm components may affect their suitability for implementation in implantable sensor devices. Methods, systems, and devices for facilitating the conversion of pressure, such as blood pressure/fluid pressure levels within the human body, into electrical signals for the purpose of pressure sensing are described herein. In particular, various pressure sensor packaging solutions are disclosed herein, wherein the deposition of layer(s) of a metal or other material(s) is provided to form a diaphragm structure comprising one or more layer(s), at least one of which comprises/forms a conductive capacitive electrode (e.g., 'anode') layer. Such diaphragm structures/stacks may advantageously have a relatively thin profile and/or superelastic features. For example, a sensor device according to an aspect of the present disclosure, which may function as a biocompatible sensor implant device for a heart or other implant, may comprise one or more diaphragms formed of a thin superelastic vapor-deposited layer that may be formed of nitinol or a similar material, wherein the capacitive electrode layer(s) are formed on the nitinol layer(s). The conductive electrode layer(s) may be disposed directly on the deposited thin film, superelastic metal (e.g., nitinol) layer(s), or one or more dielectric/insulator layers may be formed between the electrode(s) and the superelastic metal layer(s). The thin film superelastic metal and/or electrode layer may have certain topographic/surface features, e.g., corrugations, ridges, valleys, bumps, pillars, columns, spikes/pyramids, cones, clusters, and/or other geometric/uniform and/or amorphous/irregular features that advantageously increase the effective surface area of the diaphragm on one or more sides of linear deflection and/or the same. Examples of the present disclosure may include a thin superelastic metal (e.g., nitinol) diaphragm, wherein one or more layers of a high dielectric constant are deposited or formed thereon, and the superelastic metal layer provides a mechanical structure/substrate for dielectric and conductor stacking. The deposited thin film metal layer may advantageously provide a superelastic, biocompatible surface/shell for a sensor device. Any various systems, devices, instruments, etc. in the present disclosure may be sterilized (e.g., with heat, radiation, ethylene oxide, hydrogen peroxide, etc.) to ensure safety of use for patients, and the method of the present invention may include sterilization of associated systems, devices, instruments, etc. (e.g., using heat, radiation, ethylene oxide, hydrogen peroxide, etc.). The methods and structures disclosed herein for treating a patient also include similar methods and structures performed on or placed upon a simulated patient, the simulated patient being useful, for example, for education, demonstration, procedure and/or device development, etc. The simulated patient may be physical, virtual, or a combination of physical and virtual. The simulation may include a simulation of all or part of a patient, for example, the whole body, a part of the body (e.g., the chest), a system (e.g., the cardiovascular system), an organ (e.g., the heart), or any combination thereof. The physical element may be natural, synthetic, or any combination of natural and synthetic, comprising a human or animal cadaver or part thereof. The virtual element may be entirely in silico or may be overlaid on one or more of the physical components. The virtual element may be presented on any combination of screens, headsets, holography, projection, loudspeakers, headphones, pressure transducers, and temperature transducers, or may be presented using any combination of suitable technologies. For the purpose of summarizing the present disclosure, specific aspects, advantages, and novel features have been described. It should be understood that not all of these advantages may be achieved according to any specific embodiment. Accordingly, the disclosed embodiments may be performed in a manner that achieves or optimizes one advantage or a group of advantages as taught herein, without necessarily achieving other advantages that may be taught or suggested herein. Various embodiments are depicted in the accompanying drawings for exemplary purposes and should not be construed as limiting the scope of the invention. Additionally, various features of different disclosed embodi