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KR-20260066194-A - Copper alloy plate, electronic components and method of manufacturing copper alloy plate

KR20260066194AKR 20260066194 AKR20260066194 AKR 20260066194AKR-20260066194-A

Abstract

The present disclosure aims to provide a copper alloy plate having high strength. The copper alloy plate of the present disclosure contains 1.5 to 4.5 mass% of Ni and 0.10 to 1.2 mass% of Si, with the remainder being Cu and unavoidable impurities, and has a tensile strength of 930 MPa or more in a direction perpendicular to the rolling direction.

Inventors

  • 츠카세 다이키
  • 기타가와 히로유키

Assignees

  • 제이엑스금속주식회사

Dates

Publication Date
20260512
Application Date
20240725
Priority Date
20231207

Claims (20)

  1. It contains 1.5 to 4.5 mass% of Ni and 0.10 to 1.2 mass% of Si, with the remainder consisting of Cu and unavoidable impurities, A copper alloy plate having a tensile strength of 930 MPa or more in a direction perpendicular to the rolling direction.
  2. In paragraph 1, A copper alloy plate further containing 0.050 to 1.00 mass% in total of one or more selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn, and Cr.
  3. In paragraph 1, Copper alloy plate containing 0.050 to 0.80 mass% of Mg further.
  4. In paragraph 1, A copper alloy plate having a tensile strength of 950 MPa or more in the direction perpendicular to the above.
  5. In paragraph 1, A copper alloy plate having a 0.2% yield strength of 895 MPa or more in a direction perpendicular to the rolling direction.
  6. In paragraph 1, A copper alloy plate having a tensile strength of 870 MPa or more in a direction parallel to the rolling direction.
  7. In paragraph 1, A copper alloy plate having a 0.2% yield strength of 840 MPa or more in a direction parallel to the rolling direction.
  8. In paragraph 1, A copper alloy plate having a tensile strength of 885 MPa or more in a direction inclined at 45° with respect to the rolling direction.
  9. In paragraph 1, A copper alloy plate having a tensile strength of 880 MPa or more in a direction inclined at 22.5° with respect to the rolling direction.
  10. In paragraph 1, A copper alloy plate having a conductivity of 35% IACS or higher in a direction parallel to the rolling direction.
  11. It contains 1.5 to 4.5 mass% of Ni, 0.10 to 1.2 mass% of Si, and 0.050 to 0.80 mass% of Mg, with the remainder consisting of Cu and unavoidable impurities, A copper alloy plate having a tensile strength of 885 MPa or more in a direction inclined at 45° with respect to the rolling direction.
  12. In Paragraph 11, A copper alloy plate having a tensile strength of 900 MPa or more in the above 45° inclined direction.
  13. In Paragraph 11, A copper alloy plate having a 0.2% yield strength of 845 MPa or more in a direction inclined at 45° with respect to the rolling direction.
  14. In Paragraph 11, A copper alloy plate having a tensile strength of 870 MPa or more in a direction parallel to the rolling direction.
  15. In Paragraph 11, A copper alloy plate having a tensile strength of 930 MPa or more in a direction perpendicular to the rolling direction.
  16. In Paragraph 11, A copper alloy plate having a tensile strength of 880 MPa or more in a direction inclined at 22.5° with respect to the rolling direction.
  17. In Paragraph 11, A copper alloy plate having a conductivity of 35% IACS or higher in a direction parallel to the rolling direction.
  18. It contains 1.5 to 4.5 mass% of Ni, 0.10 to 1.2 mass% of Si, and 0.050 to 0.80 mass% of Mg, with the remainder consisting of Cu and unavoidable impurities, A copper alloy plate having a tensile strength of 880 MPa or more in a direction inclined at 22.5° with respect to the rolling direction.
  19. In Paragraph 18, A copper alloy plate having a tensile strength of 890 MPa or more in the above 22.5° inclined direction.
  20. In Paragraph 18, A copper alloy plate having a 0.2% yield strength of 840 MPa or more in a direction inclined at 22.5° with respect to the rolling direction.

Description

Copper alloy plate, electronic components and method of manufacturing copper alloy plate The present invention relates to a copper alloy plate, an electronic component, and a method for manufacturing a copper alloy plate. The Corson alloy is an alloy in which intermetallic compounds such as Ni-Si, Co-Si, and Ni-Co-Si are precipitated in a Cu matrix, and it possesses high strength and high conductivity. Because the Corson alloy has such characteristics, it can be used as a copper alloy component in electronic components, for example, as a lead frame that supports and fixes a semiconductor device and forms internal wiring in a semiconductor package (for example, see Patent Document 1). Figure 1 is a graph summarizing the relationship between the parameter X, represented by the equation (X=(A 2 × B)/(C×D) … (1)), and the tensile strength (MPa) in a direction parallel to the rolling direction of a copper alloy plate (e.g., after aging treatment), using the conductivity (A), 0.2% yield strength (B), tensile strength (C), and plate thickness (D) of a copper alloy intermediate after solution treatment. Embodiments of the present disclosure will be described in detail below, but the present invention is not limited to the following embodiments. In the present disclosure, “a to b” means “a or more and b or less.” Here, a and b represent numerical values. [Copper alloy plate] [First Embodiment] The copper alloy plate of the first embodiment is a copper alloy plate containing 1.5 to 4.5 mass% of Ni and 0.10 to 1.2 mass% of Si, with the remainder consisting of Cu and unavoidable impurities. That is, the copper alloy plate of the present embodiment is a Cu-Ni-Si alloy. By performing an aging treatment, Ni and Si form precipitated particles of an intermetallic compound mainly consisting of fine Ni₂Si , thereby significantly increasing the strength of the copper alloy plate. Furthermore, high conductivity is achieved in conjunction with the precipitation of Ni₂Si during the aging treatment. In the composition of the copper alloy plate of the first embodiment, the concentration of Ni is 1.5 to 4.5 mass%, and the concentration of Si is 0.10 to 1.2 mass%. By doing so, the strength of the copper alloy plate can be further improved while maintaining the high conductivity of the copper alloy plate. If the concentration of Ni is less than 1.5 mass% or the concentration of Si is less than 0.10 mass%, the desired strength is not obtained even if the other component is added. If the concentration of Ni exceeds 4.5 mass% or the concentration of Si exceeds 1.2 mass%, sufficient strength is obtained, but it results in a decrease in conductivity. The concentration of Ni is preferably 1.6 to 4.2 mass%. In addition, the lower limit of the concentration of Ni can be 1.6 mass%, preferably 2.2 mass%. In addition, the upper limit of the concentration of Ni can be 4.2 mass%, preferably 3.0 mass%. The concentration of Ni can be 2.2 to 4.2 mass%, or it is also possible to have it 1.6 to 3.0 mass%. In addition, the concentration of Si is preferably 0.25 to 1.2 mass%, more preferably 0.25 to 0.9 mass%, and even more preferably 0.4 to 0.7 mass%. As described above, Ni-Si precipitates formed by Ni and Si are considered to be intermetallic compounds mainly composed of Ni₂Si . However, Ni and Si in the copper alloy do not all become precipitates due to the aging treatment during the manufacturing process of the copper alloy plate, and to some extent, they may exist in a solid solution state within the Cu matrix. Although Ni and Si in the solid solution state can slightly improve the strength of the copper alloy plate, the effect is small compared to the precipitated state and can also be a factor in reducing conductivity. Therefore, it is desirable to make the ratio of Ni and Si content close to the compositional ratio of the precipitated Ni₂Si . Accordingly, the mass ratio of Ni to Si is preferably 3.4 to 5.4, and more preferably 3.8 to 5.0. In the composition of the copper alloy plate of the first embodiment, one or more elements selected from the group consisting of Mg, Fe, P, Mn, Co, Pb, Zn, and Cr (hereinafter also referred to as "additive elements") other than the elements mentioned above may be further contained in a total of 0.050 to 1.00 mass%. By doing so, the strength, heat resistance, and stress relaxation resistance of the copper alloy plate can be improved. When the total amount of the additive element is 0.050 mass% or more, the above-mentioned desired effect tends to be easily obtained. In addition, when the total amount of the additive element is 1.00 mass% or less, it is possible to prevent a decrease in conductivity while obtaining the desired characteristics. The total amount of the added element is preferably 0.075 to 0.60 mass%, and more preferably 0.10 to 0.40 mass%. In the composition of the copper alloy plate of the first embodiment, Mg may be contained in an amount of 0.050 to 0.80 mass%. By doing so, stress relaxation resis