KR-20260066230-A - BOARD FOR REDUCING INTER-FLOOR NOISE USING KENAF FIBER AND PREPARATION METHOD THEREOF

Abstract

A construction inter-floor noise prevention board structure with excellent sound absorption, flame retardancy, breathability, and moisture resistance using kenaf fibers, and a method for manufacturing the same are provided. The method for manufacturing the inter-floor noise prevention board comprises the steps of: preparing kenaf bark; mixing fibers containing the bark with a liquid; mixing ceramic powder into the mixture; and molding the mixture containing the ceramic by placing it into a mold.

Inventors

• 임희경

Assignees

• 친환경세상 주식회사

Dates

Publication Date

20260512

Application Date

20241104

Claims (6)

1. Steps for preparing kenaf bark; A step of mixing the fibers containing the above bark with a liquid; A step of mixing ceramic powder into the above mixture; and A method for manufacturing an interlayer noise reduction board comprising the step of placing a mixture of the above-mentioned ceramics into a mold and molding it.
2. In paragraph 1, The above ceramic powder is a method for manufacturing an interlayer noise reduction board containing titanium dioxide.
3. In paragraph 1, The above fibers further include fibers derived from kenaf branches, and With respect to 100 parts by weight of the sum of the above branches and bark, A method for manufacturing an interlayer noise reduction board by mixing 20 to 35 parts by weight of the above ceramic.
4. An inter-floor noise reduction board manufactured using the method of claim 1.
5. Polymer; Kenaf-derived fibers mixed in the above polymer; and It includes ceramic powder mixed with the above polymer, The ceramic powder above is, An interlayer noise reduction board in which at least the fibers derived from the bark of the above-mentioned kenaf are penetrated.
6. In paragraph 5, The porosity of the above inter-floor noise reduction board is 15% to 20%, and An interlayer noise reduction board having a void size of 100㎛ to 200㎛.

Description

Board for reducing inter-floor noise using kenaf fiber and method for manufacturing the same The present invention relates to an inter-floor noise prevention board using kenaf and a method for manufacturing the same. More specifically, it relates to a structural inter-floor noise prevention board for construction using kenaf fibers that exhibits excellent sound absorption, flame retardancy, breathability, and moisture resistance, and a method for manufacturing the same. Generally, the floors of vertically stacked multi-unit dwellings, such as apartments, consist of reinforced concrete slabs, mortar layers (underlayment), pipes, and finishes. Since the floors of upper levels in vertical multi-unit dwellings like apartments serve as the ceilings of lower levels, noise generated on the upper floors is transmitted directly to the lower levels, making them vulnerable to so-called inter-floor noise. To address this, soundproofing materials are sometimes added to the floors. However, while soundproofing materials are effective against high-frequency noise, they have limitations in reducing low-frequency noise, thus requiring better methods for preventing or reducing inter-floor noise. Furthermore, it is known that recent inter-floor noise issues are also influenced by construction methods. Traditional frame structures support the building's main loads using columns and beams; by separating columns from walls and allowing for thicker slabs, noise and vibration are dispersed through the columns. Additionally, the thick slabs and vibration dispersion result in minimal floor vibration, making them advantageous for preventing inter-floor noise. Recently, as buildings have become taller, wall-bearing structures, in which the walls support the load as a whole and provide stability suitable for high-rise buildings, are preferred. Furthermore, wall-bearing structures are utilized as a primary construction method because they are relatively simple to design and construct, as well as offer high space utilization. However, it has been pointed out that wall-bearing structures are vulnerable to inter-floor noise because columns and beams are omitted or simplified, the walls themselves contribute to supporting the building's main loads, and the walls and floors are connected; consequently, noise and vibration are transmitted directly through the connected walls as well as the slabs, causing the walls to become pathways for noise transmission and potentially spreading across multiple floors in complex patterns. The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but can be implemented in various different forms. The embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Furthermore, the scope of patent claims is not a matter describing the technical content that constitutes the substance of the invention, but rather a matter indicating what scope is claimed as a right based on the technical configuration disclosed in the detailed description of the invention. Therefore, it is somewhat inevitable that the scope of patent claims is composed of abstract higher-level concepts that include the technology disclosed in the detailed description of the invention, and if a person skilled in the art can understand the technical configuration, combination, and functional effects belonging to the scope of patent claims through the entire specification, then the scope of patent claims should be considered to be supported by the detailed description of the invention. That is, various modifications may be made to the embodiments presented in the present invention. The embodiments described below are not intended to limit the forms of practice and should be understood to include all modifications, equivalents, and substitutions thereof. If any term described in this specification is to be used with a specific meaning, such meaning may be defined and used, and it should be interpreted accordingly. Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in a meaning that is commonly understood by those skilled in the art to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise. In this specification, "and/or" includes each of the mentioned items and all combinations of one or more. Also, the singular form includes the plural form unless specifically stated otherwise in the text. As used in this specification, "comprises" and/or "co