KR-20260066246-A - Aluminum knuckle and carrier precision processing equipment

Abstract

The present invention relates to a Machining Center Technology (MCT) machine for precisely machining aluminum knuckle and carrier raw materials, and in particular to a multi-axis machining system and a cleaning cycle optimization algorithm for increasing the efficiency and productivity of the machine.

Inventors

• 강휘원
• 강대국

Assignees

• 오엠씨 주식회사

Dates

Publication Date

20260512

Application Date

20241104

Claims (1)

1. An aluminum knuckle machining module that performs high-precision 5-axis machining of aluminum knuckles by machining at desired angles and positions through multi-axis (X, Y, Z, A, C) control; A carrier material processing module comprising a fixing jig unit and a cutting tool unit for fixing and cutting a carrier material, wherein the cutting tool unit is connected to a tool condition monitoring unit to check the wear condition and performs cooling and chip evacuation through a cutting fluid injection unit; A numerical control and angle adjustment module including an NC control unit that controls the X, Y, Z, A, and C axes of the machining modules in real time to adjust the position and angle; A cleaning and maintenance module that detects chips and foreign substances generated during processing, collects them in a filter unit, removes foreign substances through a self-cleaning execution unit and a high-temperature cleaning module, and automatically adjusts the cleaning cycle by a foreign substance detection sensor unit and a cleaning cycle optimization algorithm; Includes, An aluminum knuckle and carrier precision machining device characterized by the above cleaning cycle optimization algorithm operating according to the following mathematical formula. [Mathematical Formula] Here: C_opt is the optimal cleaning cycle, D is the processing time, S is the chip generation amount, T_avg is the average filter temperature, F is the filter cleaning frequency, P is the filter operating pressure, and α, β, γ, δ are the weights.

Description

Aluminum knuckle and carrier precision processing equipment The present invention relates to a Machining Center Technology (MCT) machine for precisely machining aluminum knuckle and carrier raw materials, and in particular to a multi-axis machining system and a cleaning cycle optimization algorithm for increasing the efficiency and productivity of the machine. Conventional aluminum knuckle and carrier processing devices are generally composed of three axes (X, Y, Z), making it difficult to perform precision processing of complex shapes. In addition, there were problems such as frequent work stoppages and shortened equipment lifespan due to the inefficient evacuation of cutting chips and filter cleaning during processing. Accordingly, there is a demand for the development of technologies that enhance machining performance and maintenance efficiency through high-precision multi-axis machining and automated cleaning systems. Figure 1 shows an example of product manufacturing according to the present invention. The aluminum knuckle machining module is a module that performs high-precision 5-axis machining of aluminum knuckles. Aluminum knuckles are machined at desired angles and positions through multi-axis (X, Y, Z, A, C) control, and complex shapes can be machined by adding 2-axis rotation (A, C). The knuckle processing module is arranged in parallel with the carrier raw material processing module to enable simultaneous processing. The cutting tool and jig are fixed to the main spindle, and rotation and feed are performed. The cutting fluid supply line controls the heat generated during the cutting process and efficiently discharges cutting chips through the mixed output of cutting fluid and compressed air. In addition, the position and angle of each axis are adjusted in real time by the NC numerical control unit. The carrier raw material processing module is a module that includes a fixing and tooling system for the cutting of the carrier raw material. The fixed jig securely holds the carrier, and the cutting tool machines the carrier through numerical control of the spindle. It is coupled with the machining module and operates independently of the knuckle machining module, but is synchronized and operated by the same NC control unit. The fixed jig firmly holds the carrier, and the cutting tool checks its wear status through the tool condition monitoring unit and is replaced at the appropriate time. During machining, the cutting fluid injection unit injects cutting fluid to cool the workpiece, and the pressure and flow rate of the cutting fluid are controlled. The carrier raw material machining module and the cutting fluid control module cooperate to optimize the machining environment. The numerical control and angle adjustment module is responsible for precise numerical control and angle adjustment for multi-axis machining. The rotation of the A and C axes is controlled by the NC control unit and synchronized with the movement of the X, Y, and Z axes to perform complex curved surface machining. It is closely connected to the machining modules and is located at the center of the entire machining system, responsible for the numerical control and angle adjustment of all machining modules. The NC program input section and the multi-axis control interface section operate in connection with an external controller and are structured to enable precise angle control. The A and C axis rotation control units interact with the knuckle machining module and the carrier machining module, synchronizing the movements of different axes to maximize machining precision. The cleaning and maintenance module is It is a module designed to automatically remove chips and foreign substances generated during processing, maintain system cleanliness, and ensure the long-term operation of the equipment. The filter unit collects chips and foreign substances, the self-cleaning unit automatically cleans the filter at regular intervals, and the foreign substance discharge unit safely discharges the chips. It is positioned at the bottom of the processing module to allow for easy chip discharge, and is designed to facilitate chip evacuation and filter cleaning. The filter unit is detachable for easy replacement during maintenance, and the cleaning unit and the foreign matter discharge unit are assembled in close contact. The foreign object detection sensor unit automatically activates cleaning mode to remove foreign objects when they are detected. The high-temperature cleaning module cleans the filter at a high temperature at a constant temperature to completely remove residue. The cleaning cycle optimization algorithm ([mathematical formula]) analyzes processing data and automatically adjusts the cleaning cycle to maximize cleaning efficiency. [Mathematical Formula] Here: C_opt is the optimal cleaning cycle, D is the processing time, S is the amount of chips generated, T_avg is the average value of the filter temperature, F is the filter clea