KR-20260066272-A - Manufacturing Method for Sheet Pin for Semiconductor Test Socket

Abstract

The present invention relates to a method for manufacturing a sheet pin for a semiconductor test socket. A method for manufacturing a sheet pin for a semiconductor test socket according to an embodiment of the present invention comprises the steps of: forming a conductive pattern on an insulating sheet; cutting the insulating sheet to manufacture a plurality of composites; preparing an elastic body; aligning the composites on a lower jig; placing the elastic body on the upper surface of the composites and curing to bond them; and bonding both ends of the composites to each of the two sides of the elastic body.

Inventors

• 이희준
• 박선아
• 이예은

Assignees

• 미르텍알앤디 주식회사

Dates

Publication Date

20260512

Application Date

20241104

Claims (2)

1. A step of forming a conductive pattern on an insulating sheet; A step of manufacturing a plurality of composites by cutting the above insulating sheet; Step of preparing the elastic body; A step of aligning the above composite on a lower jig; The step of placing the above elastic body on the upper surface of the above composite and curing to bond it, and A step comprising joining each end of the above composite to each side of the above elastic body. Method for manufacturing sheet pins for semiconductor test sockets.
2. In paragraph 1, The step of preparing the above elastic body is, The method includes the step of bonding a support onto the elastic body. Method for manufacturing sheet pins for semiconductor test sockets.

Description

Manufacturing Method for Sheet Pin for Semiconductor Test Socket Manufacturing Method for Sheet Pin for Semiconductor Test Socket The present invention relates to a method for manufacturing a sheet pin for a semiconductor test socket. The present invention is the result of the project ‘Development of a test socket with an LCP sheet for stable testing of LGA-type memory modules (LPCAMM)’ under the Regional Specialized Industry Development Project and Regional Key Industry Development Project, funded by the Ministry of SMEs and Startups in 2024 and supported by the Korea Institute of Technology Information Promotion (RIIPA) (Research and Development Project No.: S3400895). Semiconductor test sockets are essential devices used to evaluate the performance of semiconductor devices and ensure their quality. These sockets provide a stable electrical connection between semiconductor chips and testing equipment, enabling accurate signal transmission and reliable data measurement during various testing and inspection processes. In particular, since semiconductor test sockets must maintain high durability and electrical reliability even under repetitive testing, a precise design is required that incorporates insulation, conductivity, and structural stability. However, conventional semiconductor test sockets have a problem in that conductive patterns and insulating sheets are susceptible to damage from repeated contact and pressure. In particular, if contact stability deteriorates, the likelihood of signal transmission errors increases, which can lead to a decrease in the reliability of test results. Furthermore, if the elastomer deforms during the bonding process with the conductive sheet, contact pressure becomes uneven, potentially causing unstable electrical contact resistance. These issues can shorten the lifespan of the test socket and incur additional maintenance costs. FIG. 1 illustrates a method for manufacturing a sheet pin for a semiconductor test socket according to an embodiment of the present invention. FIG. 2 illustrates a sheet pin for a semiconductor test socket according to an embodiment of the present invention. Figure 3 illustrates the connection of a sheet pin for a semiconductor test socket to a semiconductor test socket. FIG. 4 illustrates a semiconductor test socket according to an embodiment of the present invention. Preferred embodiments of the present invention are described below with reference to the attached drawings. However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and operations. Furthermore, throughout the specification, the term "comprising" a component means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. FIG. 1 illustrates a method for manufacturing a sheet pin (100) for a semiconductor test socket according to an embodiment of the present invention. Referring to FIG. 1, the method for manufacturing a sheet pin (100) for a semiconductor test socket according to an embodiment of the present invention comprises: a step of forming a conductive pattern (112) on an insulating sheet (111); a step of manufacturing a plurality of composites (110) by cutting the insulating sheet (111); a step of preparing an elastic body (120); a step of aligning the composites (110) on a lower jig (J1); a step of placing the elastic body (120) on the upper surface of the composites (110) and curing to bond them; and a step of bonding both ends of the composites (110) to each of the two sides of the elastic body (120). The step of forming a conductive pattern (112) on the insulating sheet (111) is performed through a plating process on the insulating sheet (111) to the extent that multiple composites (110) can be manufactured (see FIG. 1(a)). Since the insulating sheet (111) requires stability regarding both thermal and electrical properties, it may be made of high heat-resistant and high-insulating materials such as polyimide, LCP (Liquid Crystal Polymer), and Ultem. These materials maintain their physical properties even at high temperatures, ensuring the performance of the sheet even in high-temperature environments. Furthermore, since they are thin, flexible, and have high strength, they can maintain a stable structure without deformation even during repeated contact between the semiconductor device and the inspection equipment. The conductive pattern (112) may be for