KR-20260066289-A - Printed circuit heat exchanger having asymmetric header and method for manufacturing the same

KR20260066289AKR 20260066289 AKR20260066289 AKR 20260066289AKR-20260066289-A

Abstract

According to one embodiment of the technical concept of the present invention, a printed circuit board type heat exchanger having an asymmetric header and a method for manufacturing the same are related to a printed circuit board type heat exchanger and a method for manufacturing the same that can improve the uniformity of fluid flow distribution flowing into the printed circuit board type heat exchanger by causing the cross-sectional area of the header portions of metal plates to gradually decrease from the top to the bottom of the printed circuit board type heat exchanger. The printed circuit board type heat exchanger comprises a group of flow paths including horizontally arranged flow paths arranged vertically, and includes a header that distributes fluid to the flow path groups, wherein the cross-sectional area of the header can decrease as it goes from the top to the bottom of the printed circuit board type heat exchanger.

Inventors

김우경
김창현
김민창
김태훈
도규형
이공훈

Assignees

한국기계연구원

Dates

Publication Date: 20260512
Application Date: 20241104

Claims (16)

In a printed circuit board type heat exchanger in which groups of channels including horizontally arranged channels are arranged vertically, Includes a header for distributing fluids to Euro groups, A printed circuit board type heat exchanger characterized in that the header decreases in cross-sectional area from the top to the bottom of the printed circuit board type heat exchanger.
In Article 1, A printed circuit board type heat exchanger characterized by fluid being supplied from the upper part of the header to the lower part of the header.
In Article 2, The reduction rate of the header's cross-sectional area A printed circuit board type heat exchanger characterized by a reduction rate determined to ensure uniform flow distribution to Euro groups connected to a header.
In Article 2, A printed circuit board type heat exchanger characterized in that, in the header, the surface facing the Euro groups is an inclined surface.
A first metal plate comprising first euros and a first header portion connected to the first euros; A second metal plate located below the first metal plate and including second channels and a second header portion; and A third metal plate located below the second metal plate and comprising third channels and a third header portion connected to the third channels, wherein The first metal plate, the second metal plate, and the third metal plate are combined, and the first header part, the second header part, and the third header part are connected to each other to form a single header, and A printed circuit board type heat exchanger characterized in that the cross-sectional area of the header decreases from the first metal plate to the third metal plate.
In Article 5, A printed circuit board type heat exchanger characterized in that the first metal plate, the second metal plate, and the third metal plate are joined through a diffusion bonding method.
In Article 5, The first header portion, the second header portion, and the third header portion are each formed to penetrate the first metal plate, the second metal plate, and the third metal plate, respectively, and A printed circuit board type heat exchanger characterized in that the first, second, and third channels are concave grooves formed on the upper surfaces of the first metal plate, the second metal plate, and the third metal plate, respectively.
In Article 7, A printed circuit board type heat exchanger characterized in that the first header section, the second header section, the third header section, the first flow paths, the second flow paths, and the third flow paths are formed through an etching process.
In Article 5, The first fluid flows in the first Euro and the third Euro, and The second fluid flows in the second Euro, and A printed circuit board type heat exchanger characterized in that the first fluid and the second fluid are fluids having a temperature difference.
In Article 5, The reduction rate of the header's cross-sectional area is A printed circuit board type heat exchanger characterized by being determined by a reduction rate that ensures uniform flow distribution to the first and third euros.
In Article 5, A printed circuit board type heat exchanger characterized in that the surfaces facing the first, second, and third flow paths in the first header section, the second header section, and the third header section are each inclined surfaces and are connected to each other to form a single inclined surface.
(a) forming first fluid passages in the shape of concave grooves on the upper surface of the first metal plate, and a first header portion penetrating the first metal plate and connected to the first fluid passages; (b) forming a second fluid passage in the shape of a concave groove and a second header portion penetrating the second metal plate on the upper surface of the second metal plate; (c) forming a third fluid passage in the shape of a concave groove on the upper surface of the third metal plate, and a third header portion penetrating the third metal plate and connected to the third fluid passages; (d) a step of stacking the third metal plate, the second metal plate, and the first metal plate in sequence and joining them together, wherein A method for manufacturing a printed circuit board type heat exchanger, characterized in that a first header section, a second header section, and a third header section are connected to each other to form a single header, and the cross-sectional area of the header decreases from the first metal plate to the third metal plate.
In Article 12, A method for manufacturing a printed circuit board type heat exchanger characterized in that the first metal plate, the second metal plate, and the third metal plate are joined through a diffusion bonding method.
In Article 12, A method for manufacturing a printed circuit board type heat exchanger characterized in that the first header section, the second header section, the third header section, the first flow paths, the second flow paths, and the third flow paths are formed through an etching process.
In Article 12, The first fluid flows in the first and third channels, and the second fluid flows in the second channel, and The first fluid and the second fluid are fluids with a temperature difference, and The reduction rate of the header's cross-sectional area is A method for manufacturing a printed circuit board type heat exchanger characterized by being determined by a reduction rate that makes the flow distribution to the first and third euros uniform.
In Article 12, A method for manufacturing a printed circuit board type heat exchanger, characterized in that the surfaces facing the first, second, and third flow paths in the first header section, the second header section, and the third header section are each inclined surfaces and are connected to each other to form a single inclined surface.

Description

Printed circuit heat exchanger having asymmetric header and method for manufacturing the same The present invention relates to a printed circuit board type heat exchanger having an asymmetric header and a method for manufacturing the same. More specifically, the invention relates to a printed circuit board type heat exchanger and a method for manufacturing the same, wherein the cross-sectional area of the header portions of the metal plates gradually decreases from the top to the bottom of the printed circuit board type heat exchanger to improve the uniformity of fluid flow distribution flowing into the printed circuit board type heat exchanger. Figure 1 is a schematic diagram illustrating the shape of a conventional printed circuit board type heat exchanger. A Printed Circuit Heat Exchanger (PCHE) is a heat exchanger designed to withstand extreme environments such as high pressure and low temperature, and is capable of providing stable structural and thermal performance in cryogenic environments such as liquid hydrogen. A printed circuit board type heat exchanger is formed by stacking and combining multiple metal plates (10 to 80) with flow paths formed by a chemical etching process between an upper plate (7) and a lower plate (8), and generally, one type of fluid flows through one metal plate. In the conventional printed circuit board type heat exchanger shown in FIG. 1, heat exchange between the high-temperature fluid and the low-temperature fluid occurs by flowing the high-temperature fluid metal plates (20, 40, 60, 80) and the low-temperature fluid metal plates (10, 30, 50, 70), respectively. In the case of a printed circuit board type heat exchanger, it is possible to simply scale up by stacking multiple metal plates. However, as the number of metal plates increases, flow is not provided uniformly to each metal plate, and an imbalance in flow distribution occurs. That is, when fluid supplied through the inlet (9) and header (2) in the printed circuit board type heat exchanger is distributed to the flow paths (11, 31, 51, 71) of each metal plate (10, 30, 50, 70), a problem of unbalanced flow distribution occurs in which more fluid is supplied as it goes toward the lower metal plate (i.e., toward direction B). Such flow distribution imbalance not only causes problems in scaling up the heat exchange capacity of the heat exchanger but can also have adverse effects, such as freezing issues with the heat source fluid. Furthermore, since this flow distribution imbalance reduces the efficiency of printed circuit board (PCB) heat exchangers, it must be resolved for these heat exchangers to be applied in applications requiring high efficiency, such as liquid hydrogen refueling stations. Many inventors recognize the importance of resolving flow distribution imbalance in PCB heat exchangers and are researching and developing solutions, but satisfactory results have not yet been achieved. A brief description of each drawing is provided to help to better understand the drawings cited in this specification. Figure 1 is a schematic diagram illustrating the shape of a conventional printed circuit board type heat exchanger. FIG. 2 is a schematic diagram illustrating the configuration of a printed circuit board type heat exchanger according to one embodiment of the technical concept of the present invention. FIG. 3 is a schematic diagram illustrating the configuration of each metal plate of a printed circuit board type heat exchanger according to one embodiment of the technical concept of the present invention. FIG. 4 is a schematic cross-sectional view of a printed circuit board type heat exchanger according to one embodiment of the technical concept of the present invention. The present invention is capable of various modifications and may have various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the present invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In describing the present invention, if it is determined that a detailed description of related prior art may unnecessarily obscure the essence of the present invention, such detailed description is omitted. Additionally, numbers used in the description of this specification (e.g., 1st, 2nd, etc.) are merely identification symbols to distinguish one component from another. In addition, when a component is described in this specification as being "connected" or "connected" to another component, it should be understood that the component may be directly connected to or directly connected to the other component, but unless otherwise specifically stated, it may also be connected or connected through another component in between. In addition, components expressed as '~part' in this specification may con