KR-20260066392-A - APPARATUS AND METHOD FOR INSPECTING OF POWER SEMICONDUCTOR MODULE

Abstract

An inspection device for a power semiconductor power module according to one aspect of the present invention is characterized by comprising: a current rise rate limiting circuit unit connected to a current path between a power semiconductor power module and a power supply unit and limiting the rise rate of a current applied to the power module; a sensing unit measuring at least one of the current and voltage of the power module; and an overcurrent blocking unit connected between the current rise rate limiting circuit unit and the power supply unit, determining whether an overcurrent has occurred based on at least one of the current and voltage measured through the sensing unit, and blocking the current path if it is determined that an overcurrent has occurred.

Inventors

• 유종욱
• 정기영
• 송인혁
• 서동수

Assignees

• 현대모비스 주식회사

Dates

Publication Date

20260512

Application Date

20241104

Claims (10)

1. A current rise rate limiting circuit connected to a current path between a power module of a power semiconductor and a power supply unit, and limiting the rise rate of the current applied to the power module; A sensing unit for measuring at least one of the current and voltage of the power module; and An overcurrent blocking unit connected between the current rise rate limiting circuit unit and the power supply unit, which determines whether an overcurrent has occurred based on at least one of the current and voltage measured through the sensing unit, and blocks the current path if it is determined that an overcurrent has occurred; A power semiconductor power module inspection device characterized by including
2. In paragraph 1, The above current rise rate limiting circuit is, A power semiconductor power module inspection device characterized by limiting the slope of the current rise rate.
3. In paragraph 1, The above current rise rate limiting circuit is, It includes a plurality of current rise rate limiting modules, and A power semiconductor power module inspection device characterized in that each current rise rate limiting module is connected in parallel and operates independently.
4. In paragraph 3, The above current rise rate limiting module is, Power supply; A current measuring unit for measuring the current applied to the above power module; A switching element connected in parallel with the above current measuring unit; and A power semiconductor power module inspection device characterized by including a control logic unit that controls the operation of the switching element based on the current measured through the current measuring unit.
5. In paragraph 4, The above current measuring unit is, A power semiconductor power module inspection device characterized by being implemented with a shunt resistor.
6. In paragraph 4, The above control logic unit is, A power semiconductor power module inspection device characterized by turning on the switching element when the current measured through the current measuring unit is not greater than or equal to a preset limiting current, so that the combined resistance value of the forward conduction resistance value of the switching element and the resistance value of the shunt resistance operates as a damping resistance.
7. In paragraph 6, The above control logic unit is, A power semiconductor power module inspection device characterized by turning off the switching element when the current measured through the current measuring unit is greater than or equal to the limiting current.
8. A method for testing a power semiconductor power module using a current rise rate limiting circuit including a switching element, a shunt resistor, and a control logic section, The step of the shunt resistor measuring the current applied from the power supply to the power module; and A step of limiting the rate of increase of the current applied to the power module by the control logic unit controlling the operation of the switching element based on the current measured through the shunt resistor; A method for inspecting a power semiconductor power module including
9. In paragraph 8, In the step of limiting the rate of increase of the above current, A method for inspecting a power semiconductor power module, characterized in that the control logic unit turns on the switching element when the measured current is not greater than or equal to a preset limiting current, so that the combined resistance value of the forward conduction resistance value of the switching element and the resistance value of the shunt resistance operates as a damping resistance.
10. In paragraph 8, In the step of limiting the rate of increase of the above current, A method for testing a power semiconductor power module, characterized in that the control logic unit turns off the switching element when the current measured through the current measuring unit is greater than or equal to the limiting current.

Description

Apparatus and Method for Inspecting Power Semiconductor Power Module The present invention relates to an inspection device and method for a power semiconductor power module that can control the current rise rate of the power semiconductor power module. Generally, in vehicle factories, finished vehicles are fed into the final inspection line at the end of the line (EOL), where electrical inspections are performed on the various electrical components applied according to the type and specifications of the vehicle. In particular, power modules, which are core components of a vehicle's power converter, undergo the End-of-Life (EOL) process (testing) even under harsh conditions. The EOL process (testing) of power modules examines the conditions that may occur under actual vehicle conditions and the basic electrical characteristic limits of the power semiconductors actually used. The purpose of the EOL process is to verify the quality of the product's electrical characteristics and pin configuration, and to supply verified products by conducting tests that comply with product specifications. Among the various test items for power modules, there is a test that applies the maximum value of the short-circuit current; in this case, the total composite resistance component within the closed-loop circuit is controlled to create conditions as identical as possible to those of an actual vehicle, and the short-circuit test is then conducted. Meanwhile, semiconductor devices constituting the power module are being replaced with those that have improved performance. In such cases, even though the overcurrent is blocked through the overcurrent blocking unit, the power module is damaged by the overcurrent before the overcurrent is blocked by the overcurrent blocking unit, and as a result, the auxiliary circuits are damaged. The background technology of the present invention is the "overcurrent protection circuit" of Korean Registered Patent No. 10-1436691 (September 1, 2014). Figure 1 is a schematic diagram showing a conventional power semiconductor power module inspection device. FIG. 2 is a diagram illustrating the configuration of a power semiconductor power module inspection device according to one embodiment of the present invention. FIG. 3 is an illustrative diagram for explaining a current rise rate limiting circuit according to one embodiment of the present invention. FIG. 4 is a graph for explaining the current rise rate limit according to one embodiment of the present invention. FIG. 5 is a drawing for explaining a current rise rate limiting module according to one embodiment of the present invention. FIG. 6 is a flowchart illustrating the operation of a current rise rate limiting circuit according to one embodiment of the present invention. Hereinafter, an embodiment of the inspection apparatus and method for a power semiconductor power module according to the present invention will be described with reference to the attached drawings. In this process, the thickness of lines or the size of components depicted in the drawings may be exaggerated for the sake of clarity and convenience of explanation. Furthermore, the terms described below are defined considering their functions in the present invention, and these may vary depending on the intent or convention of the user or operator. Therefore, the definitions of these terms should be based on the content throughout this specification. Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present invention in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification are denoted by similar reference numerals. Throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. Terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention, based on the principle that the inventor can appropriately define the concept of the terms to best describe his invention. Accordingly, the embodiments described in this specification and the configurations illustrated in the drawings are merely some of the most preferred embodiments of the invention and do not represent all of the technical spirit of the invention; therefore, it should be understood that various equivalents and modifications capable of replacing them may exist at the time of filing this application. Furthermore, as used herein, "comprise" or "include" and/or