KR-20260066413-A - MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

KR20260066413AKR 20260066413 AKR20260066413 AKR 20260066413AKR-20260066413-A

Abstract

A capacitor body comprising a plurality of dielectric layers and a plurality of internal electrode layers stacked between the dielectric layers; and an external electrode disposed on the outside of the capacitor body, wherein the capacitor body comprises an active region in which the dielectric layers and the internal electrode layers are alternately disposed, and a cover region in which the dielectric layers are disposed on the upper and lower surfaces of the active region in a stacking direction, and the external electrode comprises an interface layer disposed on one surface of the active region and an external layer covering the interface layer, wherein the interface layer has a bridge structure comprising a body region, a plurality of leg regions connected to the lower part of the body region, and a gap region disposed between the plurality of leg regions, wherein the leg regions of the interface layer are connected to the internal electrode layers and the gap region of the interface layer is disposed on one surface of the dielectric layer. The present invention provides a multilayer ceramic capacitor and a method for manufacturing the same.

Inventors

성광동
최봉규
이도경
윤선호
김정렬

Assignees

삼성전기주식회사

Dates

Publication Date: 20260512
Application Date: 20241104

Claims (20)

A capacitor body comprising a plurality of dielectric layers and a plurality of internal electrode layers stacked with the dielectric layers in between; and It includes an external electrode disposed on the outer side of the capacitor body, and The capacitor body comprises an active region in which the dielectric layer and the internal electrode layer are alternately arranged, and a cover region in which the dielectric layer is arranged on the upper and lower surfaces of the active region in a stacking direction. The above external electrode includes an interface layer disposed on one surface of the active region and an external layer covering the interface layer, and The above interface layer has a bridge structure comprising a body region, a plurality of leg regions connected to the lower part of the body region, and a gap region disposed between the plurality of leg regions, and The bridge region of the interface layer is connected to the internal electrode layer, and the gap region of the interface layer is disposed on one surface of the dielectric layer, and A multilayer ceramic capacitor in which the ratio of the number of internal electrode layers connected to the bridge region of the interface layer to the total number of internal electrode layers within the active region is 90% or more and 100% or less.
In paragraph 1, A multilayer ceramic capacitor in which the bridge region of the above interface layer extends into the interior of the capacitor body and is connected to the internal electrode layer.
In paragraph 1, The bridge region of the above interface layer is a multilayer ceramic capacitor comprising an alloy of a conductive metal.
In paragraph 1, The bridge region of the above interface layer is a multilayer ceramic capacitor comprising a Cu-Ni alloy.
In Paragraph 3, A multilayer ceramic capacitor in which the bridge region of the interface layer comprises an alloy of the conductive metal in an amount of 60% to 100% by weight relative to the total amount of the bridge region.
In paragraph 1, The gap region of the above interface layer is a multilayer ceramic capacitor including glass.
In paragraph 6, The above glass is a multilayer ceramic capacitor comprising one or more selected from aluminum oxide ( Al₂O₃ ) and silicon dioxide ( SiO₂ ).
In paragraph 6, A multilayer ceramic capacitor in which the gap region of the above interface layer comprises 60% to 100% by weight of the glass with respect to the total amount of the gap region.
In paragraph 1, The body region of the above interface layer is a multilayer ceramic capacitor containing a conductive metal.
In Paragraph 1, The body region of the above interface layer is a multilayer ceramic capacitor containing copper (Cu).
In Paragraph 9, A multilayer ceramic capacitor in which the body region of the interface layer comprises the conductive metal in an amount of 60% to 100% by weight relative to the total amount of the body region.
In paragraph 1, The bridge region of the above interface layer comprises an alloy of a conductive metal, and The gap region of the above interface layer includes glass, and The body region of the above interface layer is a multilayer ceramic capacitor containing a conductive metal.
In paragraph 1, The bridge region of the above interface layer includes a Cu-Ni alloy, and The gap region of the above interface layer includes glass, and The body region of the above interface layer is a multilayer ceramic capacitor containing copper (Cu).
In paragraph 1, The above internal electrode layer comprises a conductive metal alloy at the interface with the above interface layer, forming a multilayer ceramic capacitor.
A capacitor body comprising a plurality of dielectric layers and a plurality of internal electrode layers stacked with the dielectric layers in between; and It includes an external electrode disposed on the outer side of the capacitor body, and The capacitor body comprises an active region in which the dielectric layer and the internal electrode layer are alternately arranged, and a cover region in which the dielectric layer is arranged on the upper and lower surfaces of the active region in a stacking direction. The above external electrode includes an interface layer disposed on one surface of the active region and an external layer covering the interface layer, and The above interface layer has a bridge structure comprising a body region, a plurality of leg regions connected to the lower part of the body region, and a gap region disposed between the plurality of leg regions. The bridge region of the interface layer is connected to the internal electrode layer, and the gap region of the interface layer is disposed on one surface of the dielectric layer, and A multilayer ceramic capacitor in which the body region of the interface layer comprises a conductive metal, the leg region of the interface layer comprises an alloy of a conductive metal, and the gap region of the interface layer comprises glass.
In Paragraph 15, The body region of the above interface layer contains copper (Cu), and The bridge region of the above interface layer includes a Cu-Ni alloy, and The gap region of the above interface layer is a multilayer ceramic capacitor comprising glass containing aluminum oxide ( Al₂O₃ ) and silicon dioxide ( SiO₂ ).
A step of forming a metal particle film by applying and reducing metal-organic decomposition (MOD) ink to one surface of a capacitor body comprising a plurality of dielectric layers and a plurality of internal electrode layers stacked between the dielectric layers; A step of applying a paste comprising a conductive metal and a glass composition to one surface of a capacitor body on which the metal particle film is formed; and The method includes the step of calcining the paste to form an external electrode comprising an interface layer formed from the metal particle film and an outer layer covering the interface layer and formed from the paste. The above interface layer has a bridge structure comprising a body region, a plurality of leg regions connected to the lower part of the body region, and a gap region disposed between the plurality of leg regions, and A method for manufacturing a multilayer ceramic capacitor in which the bridge region of the interface layer is connected to the internal electrode layer, and the gap region of the interface layer is disposed on one surface of the dielectric layer.
In Paragraph 17, The above metal-organic decomposition (MOD) ink is a method for manufacturing a multilayer ceramic capacitor comprising a metal ligand material, an amine compound, a binder, an antioxidant, and a solvent.
In Paragraph 17, A method for manufacturing a multilayer ceramic capacitor comprising metal nanoparticles of 10 nm to 100 nm in the metal particle film above.
In Paragraph 17, A method for manufacturing a multilayer ceramic capacitor in which the glass composition is included in an amount of 20% to 40% by weight relative to the total amount of the paste.

Description

Multilayer Ceramic Capacitor and Method of Manufacturing the Same The present disclosure relates to a multilayer ceramic capacitor and a method for manufacturing the same. Electronic components that use ceramic materials include capacitors, inductors, piezoelectric elements, varistors, and thermistors. Among these ceramic electronic components, multilayer ceramic capacitors (MLCCs) can be used in various electronic devices due to their advantages of being small, ensuring high capacitance, and being easy to mount. For example, multilayer ceramic capacitors can be used as chip-type capacitors mounted on the substrates of various electronic products, such as video devices (liquid crystal displays, LCDs), plasma display panels (PDPs), and organic light-emitting diodes (OLEDs), computers, personal portable terminals, and smartphones, to charge or discharge electricity. Recently, with the miniaturization and increased capacitance of MLCCs, research on the miniaturization of internal electrodes and dielectric thicknesses is being conducted, and consequently, research to improve the contact between internal and external electrodes is actively underway. To improve the connectivity between internal and external electrodes, an external electrode forming paste containing small metal particles must be used. However, as the metal particles used become smaller, the unit cost increases due to the difficulty of synthesis, and side effects occur where the content of other polymers required for the dispersion and adhesion of the paste, such as dispersants and binders, becomes relatively higher. If the content of other polymers increases, the metal solid content becomes relatively lower, and changes in viscosity and rheological properties affect printing characteristics. FIG. 1 is a perspective view showing a multilayer ceramic capacitor according to one embodiment. Figure 2 is a cross-sectional view of a multilayer ceramic capacitor cut along line II' of Figure 1. Figure 3 is a cross-sectional view of a multilayer ceramic capacitor cut along the line II-II' of Figure 1. FIG. 4 is an exploded perspective view illustrating the stacked structure of the internal electrode layer in the capacitor body of FIG. 1. FIG. 5a is a schematic diagram showing the external electrodes of a multilayer ceramic capacitor according to one embodiment. Figure 5b is an enlarged view of the R region in Figure 5a. FIG. 6 is a schematic diagram showing a method for manufacturing an external electrode of a multilayer ceramic capacitor according to one embodiment. Figure 7 is a scanning electron microscope (SEM) analysis image of the external electrode of a multilayer ceramic capacitor according to Example 1. Figure 8 is an SEM (scanning electron microscope) analysis image of the external electrode of a multilayer ceramic capacitor according to Comparative Example 1. Figure 9 is a SEM-EDS (Scanning Electron Microscope-Energy Dispersive Spectroscopy) mapping analysis image of the external electrode of a multilayer ceramic capacitor according to Example 1. Figure 10 is a SEM-EDS (Scanning Electron Microscope-Energy Dispersive Spectroscopy) mapping analysis image of the external electrode of a multilayer ceramic capacitor according to Comparative Example 1. Figure 11 is a graph showing the capacitance characteristics of a multilayer ceramic capacitor according to Example 1 and Comparative Example 1. Figure 12 is a graph showing the moisture resistance reliability of a multilayer ceramic capacitor according to Example 1. Figure 13 is a graph showing the moisture resistance reliability of a multilayer ceramic capacitor according to Comparative Example 1. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the invention. In order to clearly explain the invention in the drawings, parts unrelated to the explanation have been omitted, and the same reference numerals have been used for identical or similar components throughout the specification. Furthermore, in the attached drawings, some components may be exaggerated, omitted, or schematically depicted, and the size of each component does not entirely reflect its actual size. The attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; it should be understood that all modifications, equivalents, and substitutions included within the concept and technical scope of the present invention are included. Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. Furthermore, when it is said that a part, such as a layer, membrane, region, or plate, is "on" or "o