KR-20260066427-A - PRINTED CIRCUIT BOARD

KR20260066427AKR 20260066427 AKR20260066427 AKR 20260066427AKR-20260066427-A

Abstract

The present disclosure relates to a printed circuit board comprising: a glass layer having a first surface and a second surface facing in a first direction; a through-via penetrating at least a portion between the first surface and the second surface of the glass layer; a first pad disposed on the side of the first surface of the glass layer and connected to one end of the through-via in the first direction; and a second pad disposed on the side of the second surface of the glass layer and connected to the other end of the through-via in the first direction; wherein the structure and/or arrangement of the first and second pads are different.

Inventors

김송이

Assignees

삼성전기주식회사

Dates

Publication Date: 20260512
Application Date: 20241104

Claims (16)

A glass layer having a first surface and a second surface facing each other in a first direction; A through-via penetrating at least a portion between the first and second surfaces of the glass layer; A first pad embedded on the first surface side of the glass layer and connected to one end of the through-via in the first direction; and A second pad protruding on the second surface of the glass layer and connected to the other end of the through-via in the first direction; comprising Printed circuit board.
In Article 1, The first pad has a side surface and a bottom surface that are substantially rounded, Printed circuit board.
In Article 2, The second pad above has a side surface and a bottom surface, respectively, having a substantially flat shape. Printed circuit board.
In Article 1, One end of the above through-via has a step difference with the first surface of the glass layer, Printed circuit board.
In Article 4, The other end of the above-mentioned through-via is substantially co-plane with the second surface of the glass layer, Printed circuit board.
In Article 1, A first seed layer included in the first pad is disposed between one end of the above-mentioned through-via and the bottom surface of the first pad, and A second seed layer included in the second pad is disposed between the other end of the above-mentioned through-via and the bottom surface of the second pad, Printed circuit board.
In Article 1, A first insulating body disposed on a first surface of the glass layer; and A second insulating body disposed on a second surface of the glass layer; further comprising, In the first direction, the first insulating body is thicker than the second insulating body, Printed circuit board.
In Article 7, A plurality of first wiring layers each disposed on or within the first insulating body; and A second wiring layer disposed on or within the second insulating body; further comprising, The above plurality of first wiring layers has more layers than the second wiring layer, Printed circuit board.
In Article 8, A plurality of first via layers, each disposed within the first insulating body and each connected to one or more of the plurality of first wiring layers; and A second via layer disposed within the second insulating body and connected to the second wiring layer; comprising, The plurality of first via layers has more layers than the second via layers, Printed circuit board.
In Article 9, The glass layer has a cavity penetrating at least a portion of the glass layer from a first surface of the glass layer in the first direction, and At least a portion of the first electronic component is disposed in the cavity above, and The first insulating body covers at least a portion of the first electronic component and fills at least a portion of the cavity, The first electronic component is connected to one or more of the plurality of first wiring layers through one or more of the plurality of first via layers, Printed circuit board.
In Article 9, A first resist layer disposed on the first insulating body, covering at least a portion of the first wiring layer disposed on the outermost side with respect to the first direction among the plurality of first wiring layers, while exposing at least another portion; A second resist layer disposed on the second insulating body, covering at least a portion of the second wiring layer while exposing at least another portion; A second electronic component disposed on the first resist layer and connected to another exposed portion of the first wiring layer disposed on the outermost side through a first electrical connection metal; and A second electrical connection metal disposed on the second resist layer and connected to another exposed portion of the second wiring layer; further comprising Printed circuit board.
In Article 1, A frame having a penetration part; further comprising, At least a portion of the glass layer is disposed within the penetration portion, and The space between the above frame and the above glass layer is filled with a filler, Printed circuit board.
A glass layer having a first surface and a second surface facing each other in a first direction; A through-via penetrating at least a portion between the first and second surfaces of the glass layer; A first pad disposed on the first surface side of the glass layer and connected to one end of the through-via in the first direction; and A second pad disposed on the second surface side of the glass layer and connected to the other end of the through-via in the first direction; comprising, The first pad and the second pad have a structure that is asymmetric to each other with respect to the centerline between the first surface and the second surface of the glass layer. Printed circuit board.
In Article 13, Based on the first direction, the distance between the first pad and the center line is shorter than the distance between the second pad and the center line. Printed circuit board.
In Article 13, The surface of the first pad connected to one end of the through-via has a substantially rounded shape, and the surface of the second pad connected to the other end of the through-via has a substantially flat shape. Printed circuit board.
In Article 13, A first seed layer is disposed between the first pad and the through-via, and A second seed layer is disposed between the second pad and the through-via, Printed circuit board.

Description

Printed Circuit Board The present disclosure relates to a printed circuit board. An interposer is a type of intermediate substrate used in semiconductor packaging technology. To ensure electrical connection between a chip and a substrate with a large pitch difference, it typically includes a redistribution layer in the portion connected to the chip. Consequently, interposers can have an asymmetrical structure between their upper and lower sections, which may limit the ability to control warpage. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board. FIG. 3 is a process cross-sectional view schematically showing an example of manufacturing through-vias and first and second pads included in the printed circuit board of FIG. 2. Figure 4 is a process cross-sectional view schematically illustrating an example of step B of Figure 3. Figure 5 is a process cross-sectional view schematically illustrating another example of step B of Figure 3. FIG. 6 is a schematic cross-sectional view of another example of a printed circuit board. The present disclosure will be described below with reference to the attached drawings. In the drawings, the shapes and sizes of elements may be exaggerated or reduced for clearer explanation. Figure 1 is a block diagram schematically illustrating an example of an electronic device system. Referring to the drawing, the electronic device (1000) accommodates a main board (1010). Chip-related components (1020), network-related components (1030), and other components (1040), etc., are physically and/or electrically connected to the main board (1010). These are also combined with other electronic components described later to form various signal lines (1090). The chip-related components (1020) include memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPU), graphics processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs), but are not limited thereto, and other types of chip-related electronic components may also be included. Furthermore, it is obvious that these chip-related components (1020) may be combined with each other. The chip-related components (1020) may also be in the form of a package containing the aforementioned chips or electronic components. Network-related components (1030) include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated thereafter, but are not limited thereto, and any of a number of other wireless or wired standards or protocols may be included. In addition, it goes without saying that network-related components (1030) can be combined with chip-related components (1020). Other components (1040) include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCC (multi-layer ceramic condensers), etc. However, they are not limited to these, and may also include passive components in the form of chip components used for various other purposes. In addition, it goes without saying that other components (1040) may be combined with chip-related components (1020) and/or network-related components (1030). Depending on the type of electronic device (1000), the electronic device (1000) may include other electronic components that may or may not be physically and/or electrically connected to the main board (1010). Examples of other electronic components include a camera module (1050), an antenna module (1060), a display (1070), a battery (1080), etc. However, it is not limited thereto, and may include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a CD (compact disk), a DVD (digital versatile disk), etc. In addition to these, other electronic components used for various purposes may be included depending on the type of electronic device (1000). The electronic device (1000) may be a smartphone, personal digital assistant, digital video camera, digital still camera, network system, computer, monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, server, etc. However, it is not limited to these, and it may be any other electronic device that processes data in addition to these. FIG. 2 is a schematic cross-sectional view of an example of a printed circuit board. Referring to the drawings, a printed circuit board (100A) according to an example may include a glass la