KR-20260066434-A - SOLDER ALLOY, SOLDER BALL, AND SEMICONDUCTOR DEVICE HAVING THE SAME

Abstract

A solder alloy according to the technical concept of the present invention comprises 50 wt% to 60 wt% of bismuth (Bi), 5 wt% to 20 wt% of indium (In), 20 wt% to 40 wt% of tin (Sn), and a total of 100 wt% of other unavoidable impurities, and has a melting point in the range of 80°C to 113°C.

Inventors

• 김휘중
• 신종진
• 이영우
• 손재열
• 원종민
• 박지원
• 김병우
• 이재규

Assignees

• 엠케이전자 주식회사

Dates

Publication Date

20260512

Application Date

20241104

Claims (10)

1. Bismuth (Bi) 50wt% to 60wt%; Indium (In) 5 wt% to 20 wt%; Tin (Sn) 20wt% to 40wt%; and Contains 100wt% of the total of other unavoidable impurities, and Having a melting point in the range of 80℃ to 113℃, Solder alloy.
2. In paragraph 1, A solder alloy characterized by a reflow peak temperature of 110℃.
3. In paragraph 2, A solder alloy characterized by containing up to 0.01 wt% of germanium (Ge) or phosphorus (P).
4. In paragraph 3, A solder alloy characterized in that the germanium (Ge) or phosphorus (P) inhibits the oxidation of the solder alloy.
5. Solder powder comprising a solder alloy according to claim 1.
6. Solder paste comprising a solder alloy according to claim 1.
7. A solder ball comprising a solder alloy according to claim 1.
8. In Paragraph 7, A solder ball characterized by containing up to 0.01 wt% of germanium (Ge) or phosphorus (P) to inhibit oxidation of the solder ball.
9. A substrate having a plurality of first pads formed thereon; A semiconductor device mounted on the substrate and having a plurality of second pads corresponding to the plurality of first pads; and A plurality of solder bumps each connecting the plurality of first pads and the plurality of second pads corresponding to each other; The above plurality of solder bumps are semiconductor components comprising solder balls according to either claim 7 or claim 8.
10. In Paragraph 9, The above solder ball is, A semiconductor component characterized by being bonded to the plurality of first pads and the plurality of second pads at a reflow peak temperature of 110℃.

Description

Solder alloy, solder ball, and semiconductor component having the same The technical field of the present invention relates to solder alloys, solder balls, and semiconductor components including the same, and more specifically, to high-quality solder alloys having a low melting point, solder balls including solder alloys, and semiconductor components including solder balls. Tin (Sn)-lead (Pb) alloy products are primarily used as solders for electronic products. In particular, lead has served as a component determining the alloy's wetting, strength, and mechanical properties. Furthermore, the inclusion of lead allows the melting point to be lowered to 183°C, thereby preventing thermal damage that occurs during soldering in semiconductor processes. However, as regulations regarding environmental issues caused by lead become stricter, ternary lead-free solder alloys have been proposed as alternatives, and various studies on this are currently underway. Figure 1 shows the reflow profile used when evaluating the bondability of an embodiment of the present invention. Figure 2 shows the shape of a specimen after evaluating the spreadability of an embodiment of the present invention. Figure 3 shows various forms of solder balls of an embodiment of the present invention. Figure 4 shows the results after evaluating the bondability of an embodiment of the present invention. Figure 5 shows the result after evaluating the bondability of an embodiment of the present invention. FIG. 6 shows a semiconductor component including a solder ball according to an embodiment of the technical concept of the present invention. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments of the present invention may be modified in various different forms, and the scope of the present invention is not to be interpreted as being limited by the embodiments described below. Identical symbols denote identical elements. Furthermore, various elements and areas in the drawings are depicted schematically. Accordingly, the present invention is not limited by the relative sizes or spacing depicted in the attached drawings. Additionally, in the embodiments of the present invention, wt% (weight%) represents the percentage of the weight of the corresponding component relative to the total weight of the alloy. Furthermore, in the embodiments of the present invention, "complete removal" means an absence to a degree that is difficult to detect even with a high-performance component analyzer. Terms such as "first," "second," etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and conversely, the second component may be named the first component. Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by those skilled in the art to which this invention pertains. Furthermore, it will be understood that commonly used terms should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an overly formal sense unless explicitly defined herein. Solder balls can be classified into medium-temperature, low-temperature, and high-temperature types depending on their melting point. Among these, Sn-Bi solder compositions with a melting point of around 138°C are the most famous and widely used low-temperature solder balls. In the case of Sn-Bi solder compositions, stable characteristics can be achieved by bonding to a desired location (e.g., a pad on a substrate) using a reflow peak temperature of 180°C or higher. Under these circumstances, there is a need to perform the bonding process at a lower reflow peak temperature than before in order to suppress thermal damage and/or warpage of components (e.g., substrates and semiconductor chips) used with solder balls. However, since solder balls of the composition used in the past generally have a melting point of 130°C or higher, they cannot be used at a reflow peak temperature of 110°C, and even if the melting point is 110°C or lower, there is a problem that they cannot be bonded to the substrate with the desired quality in the actual process. Accordingly, the solder alloy and solder ball according to the technical concept of the present invention aim to provide a solder composition having a lower melting point and reflow peak temperature to satisfy this. Below, we will examine this with specific data. 1. Evaluation of Melting Temperature In order to invent and evaluate a solder alloy according to the technical concept of the present invention, the inventors repeatedly conducted experiments as shown in