KR-20260066473-A - JIG FOR CLEANING FLUX

KR20260066473AKR 20260066473 AKR20260066473 AKR 20260066473AKR-20260066473-A

Abstract

The present disclosure provides a flux cleaning jig comprising, as one embodiment, a lower jig on which a substrate having a plurality of semiconductor chips attached as conductive bumps is placed; and an upper jig disposed on the substrate placed on the lower jig, having a plurality of openings in which at least a portion of the semiconductor chips are each disposed, a partition disposed between the plurality of openings, and a frame surrounding the partition, wherein the partition includes a section in which the width increases in the direction from the upper jig toward the lower jig.

Inventors

이순철

Assignees

삼성전자주식회사

Dates

Publication Date: 20260512
Application Date: 20241104

Claims (10)

A lower jig on which a substrate having multiple semiconductor chips attached as conductive bumps is mounted; and An upper jig disposed on a substrate seated on the lower jig and having a plurality of openings in which at least a portion of the semiconductor chips are each disposed, a partition disposed between the plurality of openings, and a frame surrounding the partition; comprising The above section includes a section in which the width increases in a first direction toward the upper jig toward the lower jig. Flux cleaning jig.
In Article 1, The above-mentioned section is spaced apart from the semiconductor chip, Flux cleaning jig.
In Article 2, The gap between the above partition and the semiconductor chip is 100 μm or more, Flux cleaning jig.
In Article 1, The above-mentioned section has a maximum width on the surface facing the substrate, Flux cleaning jig.
In Article 1, The above substrate is extended and disposed over the plurality of openings, Flux cleaning jig.
In Article 1, The thickness of the section in which the width increases in the first direction of the above-mentioned section is thicker than the sum of the thicknesses of the section in which the width is constant and the section in which the width decreases in the first direction. Flux cleaning jig.
A lower jig on which a substrate with multiple semiconductor chips attached as conductive bumps is mounted; An upper jig disposed on a substrate seated on the lower jig and having a plurality of openings in which at least a portion of the semiconductor chips are each disposed, a partition disposed between the plurality of openings, and a frame surrounding the partition; and A plurality of first support structures coupled to the lower surface of the upper jig and pressing the substrate seated on the lower jig; comprising Flux cleaning jig.
In Article 7, The above first support structure includes a magnet, and At least one of the lower jig and the upper jig comprises a magnetic material. Flux cleaning jig.
In Article 7, The first support structures are arranged to surround each of the semiconductor chips. Flux cleaning jig.
In Article 7, A second support structure disposed between the lower jig and the frame and connecting the lower jig and the upper jig; further comprising Flux cleaning jig.

Description

JIG FOR CLEANING FLUX The present disclosure relates to a jig for flux cleaning. In the semiconductor packaging industry, flip chip bonding technology is known, which involves attaching solder bumps to a semiconductor chip, aligning the chip with the attached bumps onto a substrate, and then connecting the chip and the substrate through a reflow process at high temperatures. Flip chip bonding technology offers the advantages of enabling high-speed data transmission, as well as product miniaturization and high performance. During flip-chip bonding, flux is used to ensure smooth bonding between the solder bumps and the substrate. If flux residue remains after the reflow process is completed, problems such as reduced adhesion between the semiconductor chip surface and the EMC, and decreased electrical reliability may occur. Figure 1 shows the upper jig and lower jig of a flux cleaning jig according to one embodiment before they are combined. Figure 2 is a plan view of the lower jig shown in Figure 1. Figure 3 is a plan view of the upper jig shown in Figure 1. FIG. 4 is a partially enlarged cross-sectional view showing a substrate coupled to a flux cleaning jig according to one embodiment. FIGS. 5 and 6 are drawings for explaining a flux cleaning process using a flux cleaning jig according to one embodiment. FIGS. 7 to 10 are cross-sectional views showing a substrate coupled to a flux cleaning jig according to a modified example, partially enlarged. FIG. 11 shows the upper jig and lower jig of a flux cleaning jig according to another embodiment before they are combined. FIG. 12 is a plan view of the lower jig shown in FIG. 11. FIG. 13 is a plan view of the upper jig shown in FIG. 11. FIG. 14 is a partially enlarged cross-sectional view showing a substrate coupled to a flux cleaning jig according to another embodiment. FIGS. 15 and 16 show the discharge path of the cleaning liquid in a flux cleaning jig according to another embodiment. FIG. 17 shows the upper jig and lower jig of a flux cleaning jig according to another embodiment before they are combined. FIGS. 18 to 22 are cross-sectional views showing a substrate coupled to a flux cleaning jig according to a modified example, partially enlarged. Hereinafter, various embodiments of the present disclosure are described in detail with reference to the attached drawings so that those skilled in the art can easily implement them. The present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present disclosure, parts unrelated to the description have been omitted, and the same reference numerals are used for identical or similar components throughout the specification. Furthermore, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, and thus the present disclosure is not necessarily limited to what is illustrated. Thicknesses have been enlarged in the drawings to clearly represent various layers and regions. Additionally, in the drawings, the thickness of some layers and regions has been exaggerated for convenience of explanation. Throughout the specification, when a part is described as being "connected" to another part, this includes not only cases where they are "directly connected," but also cases where they are "indirectly connected" through other members. In a similar vein, this includes not only cases where they are "physically connected," but also cases where they are "electrically connected." Furthermore, when it is said that a part, such as a layer, membrane, region, or plate, is "on" or "on" another part, this includes not only the case where it is "directly above" the other part, but also the case where there is another part in between. Conversely, when it is said that a part is "directly above" another part, it means that there is no other part in between. Also, saying that a part is "on" or "on" a reference part means that it is located above or below the reference part, and does not necessarily mean that it is located "on" or "on" in the direction opposite to gravity. Furthermore, throughout the specification, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components. Additionally, throughout the specification, "planar" means when the subject part is viewed from above, and "cross-sectional" means when the cross-section obtained by vertically cutting the subject part is viewed from the side. Furthermore, throughout the specification, numbers such as "first," "second," etc., are used to distinguish a component from other components that are identical or similar, and are not intended to specifically refer to a particular component. Accordingly, a component referred to as the first component in a specific part of this specification may be referred to as the second component i