KR-20260066482-A - Vacuum laminator system and lamination process using the same

Abstract

The present invention relates to a vacuum laminator system and a lamination process, and more specifically, to a vacuum laminator and process capable of removing bubbles and wrinkles in a film generated during a lamination process. A vacuum laminator system according to the present invention may comprise a vacuum chamber having a structure in which upper and lower chambers are opened and closed, upper and lower hot presses disposed at the upper and lower portions of the vacuum chamber, an adhesive film roll device having a roll for unwinding and rewinding an adhesive film roll and for feeding a rolled adhesive film roll into and out of the vacuum chamber, and a laminating film device for cutting a laminating film to be bonded to a wafer and loading it to be temporarily bonded to the adhesive film roll.

Inventors

• 이형규

Assignees

• 주식회사 리텍

Dates

Publication Date

20260512

Application Date

20241104

Claims (6)

1. A vacuum chamber with a structure in which upper and lower chambers are opened and closed, and Upper and lower hot presses positioned at the upper and lower parts of the vacuum chamber, and An adhesive film roll device having a roll for unwinding and rewinding an adhesive film roll, and for feeding the rolled adhesive film roll into and out of the vacuum chamber, and A vacuum laminator system comprising a laminating film device for cutting a laminating film to be bonded to a wafer and loading it to be temporarily bonded to an adhesive film roll.
2. In paragraph 1, A vacuum laminator system in which the laminating film, which is temporarily attached to the adhesive film roll by the adhesive film roll device, is positioned below the upper hot press and the wafer is positioned above the lower hot press.
3. A laminating film cutting step for cutting a film to be bonded to a wafer by a film cutting device; A rolling transfer step in which the laminated film cut by an adhesive film roll device is rolled and transferred in a state temporarily attached to an adhesive film roll and fed into a vacuum chamber; A lamination process using a vacuum laminator, comprising: a laminating step of maintaining the inside of the vacuum chamber at a predetermined vacuum level, and then bonding a laminating film onto a wafer by means of upper and lower hot presses.
4. In paragraph 1, A lamination process using a vacuum laminator, wherein, in the laminating step, the wafer and the laminating film are spaced apart from each other vertically while a vacuum process is performed.
5. In paragraph 1, A lamination process using a vacuum laminator, wherein in the above laminating step, the laminating film is temporarily attached to the adhesive film roll to maintain a flat state, and is pressed by the upper and lower hot presses at a predetermined pressure and temperature to prevent wrinkling of the laminating film when bonded to the wafer.
6. In paragraph 1, A lamination process using a vacuum laminator, wherein in the above laminating step, the laminating film is temporarily attached to the adhesive film roll to maintain a flat state, and is pressed by the upper and lower hot presses at a predetermined pressure and temperature to prevent wrinkling of the laminating film when bonded to the wafer.

Description

Vacuum laminator system and lamination process using the same The present invention relates to a vacuum laminator system and a lamination process, and more specifically, to a vacuum laminator and process capable of removing bubbles and wrinkles in a film generated during a lamination process. Generally, the NCF (non-conductive film) lamination process is used in the process of laminating films onto a wafer. In lamination processes such as NCF/DF/ABF/DFSR, a film designed and cut to fit the wafer size is placed on the wafer in a tack-attached state and laminated onto the wafer through vacuum and pressurization processes inside a vacuum chamber. In addition, after the first lamination, the protective film may be removed, and the second, third, or more laminations may be performed. However, this lamination process often causes defects such as bubble formation during the vacuum and pressurization process between the wafer and the film, and also causes problems such as wrinkles forming due to the films sticking together prematurely because of the stickiness between the films during the second, third, or more lamination processes of the product with the film laminated on the wafer, which becomes a cause of product defects. Figure 1 is a schematic diagram of a conventional NCF lamination process. Referring to FIG. 1, vacuum and pressurization are performed in a vacuum chamber (100) including an upper hot press (110) and a lower hot press (120) while a film (140) is temporarily attached to a wafer (130). Between the upper hot press (110) and the lower hot press (120), vacuum sealing is performed by a vacuum sealing member (150) to maintain a vacuum state inside, and after increasing the vacuum level to a reference value, a film (140) is laminated onto a wafer (130) by applying a pressure based on a predetermined design value while maintaining that state. At this time, the film (140), which is cut to fit the size of the wafer (130), is mounted on the wafer (130) in a temporarily attached state. This causes a problem in which air bubbles do not disappear in a specific area that is already temporarily attached during vacuuming, and there is no auxiliary device to maintain the flatness of the film (140) during the vacuum and pressurization process, resulting in a problem in which wrinkles occur in the film. Figure 1 is a structural diagram of a conventional vacuum laminator. FIG. 2 is a structural diagram of a vacuum laminator according to the present invention. FIG. 3 is a diagram of a combined structural system of a vacuum laminator and a film roller according to the present invention. Figure 4 is a flowchart of a lamination process using a vacuum laminator according to the present invention. Hereinafter, a vacuum laminator system according to the present invention and a lamination process using the same will be described in detail with reference to the drawings. The detailed description of specific embodiments illustrated in the attached drawings is to be read in conjunction with the accompanying drawings, and the drawings are considered to be part of the description of the entire invention. References to directions or orientations are for convenience of explanation only and are not intended to limit the scope of the invention in any way. It should be noted that when assigning reference numerals to the components of each drawing, the same components are assigned the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the present invention, if it is determined that a detailed description of related known components or functions could obscure the essence of the invention, such detailed description is omitted. FIG. 2 is a structural diagram of a vacuum laminator according to the present invention. Referring to FIG. 2, the vacuum laminator may comprise a vacuum chamber (100) including an upper hot press (210) and a lower hot press (220), a vacuum sealing member (250) that seals the upper and lower parts of the vacuum chamber (100), and an adhesive film roll device (260). Between the upper hot press (210) and the lower hot press (220), a wafer (230) may be positioned on the upper side of the lower hot press (220), and a laminating film (240) attached to an adhesive film roll device (260) may be positioned on the lower side of the upper hot press (210). Before laminating, the wafer (230) and the laminating film (240) can be placed in corresponding upper and lower positions. After the wafer (230) and the laminating film (240) are placed at positions corresponding to each other, the laminating film (240) can be moved by an adhesive film roll device and placed at the corresponding position. In this state, the space between the upper hot press (210) and the lower hot press (220) is vacuum-sealed by a vacuum sealing member (250) to maintain a vacuum state inside and increase the vacuum level to a reference value, and then, while maintaining that state, apply a pres