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KR-20260066585-A - ELECTRONIC DEVICE INCLUDING SHIELD CAN

KR20260066585AKR 20260066585 AKR20260066585 AKR 20260066585AKR-20260066585-A

Abstract

According to one embodiment, an electronic device may comprise: a printed circuit board (PCB) including a first conductive pad and a second conductive pad; a shield can disposed on the PCB; an insulating material disposed on the shield can; and a conductive line attached to the insulating material, electrically isolated from the shield can, and extending from the first conductive pad of the PCB to the second conductive pad of the PCB across the surface of the top wall of the shield can. The conductive line may be configured to transmit a signal from the first conductive pad of the PCB to the second conductive pad of the PCB.

Inventors

  • 정동근
  • 박장제
  • 박정균
  • 윤청노
  • 이승혁
  • 이평희

Assignees

  • 삼성전자주식회사

Dates

Publication Date
20260512
Application Date
20241223
Priority Date
20241104

Claims (20)

  1. In the electronic device (200), A PCB (printed circuit board) (390) including a first conductive pad and a second conductive pad; A shield can (340) placed on the above PCB (390); Insulating material (370) placed on the shield can (340); and It includes a conductive line (310) that is attached to the insulating material (370), is electrically separated from the shield can (340), and extends from the first conductive pad of the PCB (390) to the second conductive pad of the PCB (390) across the surface of the top wall (350) of the shield can (340). The conductive line (310) is configured to transmit a signal from the first conductive pad of the PCB (390) to the second conductive pad of the PCB (390). Electronic device (200).
  2. In claim 1, The above shield can (340) includes a recess, and The above recess is: Bottom portion (353); and It includes wall portions (351; 352) from both sides of the floor portion (353), and The insulating material (370) is placed on the bottom portion (353) of the shield can (340), and A portion of the conductive line (310) attached to the insulating material (370) is located between the wall portions (351; 352) of the shield can (340) and spaced apart from the wall portions (351; 352), Electronic device (200).
  3. In claim 2, The height of the portion of the conductive line (310) is substantially the same as or lower than the heights of the wall portions (351; 352) of the shield can (340). Electronic device (200).
  4. In any one of claims 1 to 3, The shield can (340) includes a side wall (360) extending from the top wall (350) to the PCB (390), and The side wall (360) of the shield can (340) is: A first portion (361) placed on the PCB (390); A second portion (362) disposed on the PCB (390) and separated from the first portion (361) of the sidewall (360); A third portion (363) disposed on the PCB (390); and It includes a fourth part (364) disposed on the PCB (390) and separated from the third part (363) of the side wall (360), The insulating material (370) is attached to the upper wall (350) of the shield can (340), and The above conductive line (310) is: A first part (311) positioned between the first part (361) of the side wall (360) and the second part (362) of the side wall (360), spaced apart from the first part (361) of the side wall (360) and the second part (362) of the side wall (360), and electrically connected to the first conductive pad of the PCB (390); A second part (312) positioned between the third part (363) of the side wall (360) and the fourth part (364) of the side wall (360), spaced apart from the third part (363) of the side wall (360) and the fourth part (364) of the side wall (360), and electrically connected to the second conductive pad of the PCB (390); and A third portion (313) attached to the insulating material (370) so as to be spaced apart from the upper wall (350) of the shield can (340), and extending from the first portion (311) of the conductive line (310) to the second portion (312) of the conductive line (310). Electronic device (200).
  5. In any one of claims 1 to 4, The first end of the conductive line (310) is soldered to the first conductive pad of the PCB (390), and The second end of the conductive line (310) is soldered to the second conductive pad of the PCB (390). Electronic device (200).
  6. In any one of claims 1 to 5, It includes an electronic component (392) disposed on the PCB (390) and electrically connected to the second conductive pad of the PCB (390), The conductive line (310) is configured to transmit a power signal of the electronic component (392) from the first conductive pad to the second conductive pad. Electronic device (200).
  7. In claim 6, A connector (394) placed on the PCB (390); and It includes a battery (270) electrically connected to the connector of the PCB (390), and The shield can (340) is located between the electronic component (392) and the connector (394) of the PCB (390) when viewed from above. Electronic device (200).
  8. In claim 7, The above electronic component (392) includes a flash light emitting diode module. Electronic device (200).
  9. In any one of claims 1 to 8, A non-conductive layer disposed on the upper wall (350) of the shield can (340) to cover a portion of the conductive line (310); A thermal interface material (TIM) disposed on the above-mentioned non-conductive layer; and A vapor chamber comprising, which is thermally connected to the shield can through the above non-conductive layer and the above TIM, Electronic device (200).
  10. In any one of claims 1 to 9, It includes a speaker (696) adjacent to the edge portion (692) of the PCB (390), and The conductive line (310) includes a section substantially parallel to the edge portion (692) of the PCB (390). Electronic device (200).
  11. In claim 10, In order to offset at least a portion of the magnetic field generated by a return current flowing in a first direction substantially parallel to the edge portion (692) of the PCB (390), the section of the conductive line (310) is configured so that a current in a second direction opposite to the first direction can flow. Electronic device (200).
  12. In any one of claims 1 to 11, The top wall of the shield can comprises another surface opposite to the surface of the top wall and facing the PCB, Electronic device (200).
  13. In any one of claims 1 to 11, The surface of the top wall of the shield can faces the PCB. Electronic device (200).
  14. In the electronic device (200), A PCB (printed circuit board) (390) including a first conductive pad and a second conductive pad; A shield can (740; 840) comprising a top wall (750; 850) and a side wall (760; 860) extending from the top wall (750; 850) to the PCB (390); An insulating material (770; 870) disposed on the upper wall (750; 850) of the shield can (740; 840); A first connector (781; 881) disposed on the first conductive pad of the PCB (390) and electrically connected to the first conductive pad of the PCB (390); A second connector (782; 882) disposed on the second conductive pad of the PCB (390) and electrically connected to the second conductive pad of the PCB (390); and It includes a conductive line (710; 810) that is electrically separated from the shield can (740; 840), and the conductive line (710; 810) is: A first part attached to the insulating material above; A second portion extending from a first end of the first portion to the first connector along the first side of the above-mentioned sidewall and electrically connected to the first conductive pad through the first connector; and It includes a third part extending from the second end of the first part to the second connector along the second side of the side wall and electrically connected to the second conductive pad through the second connector, The conductive line (710; 810) is configured to transmit a signal from the first conductive pad of the PCB (390) to the second conductive pad of the PCB (390). Electronic device (200).
  15. In claim 14, The side wall (760; 860) of the shield can (740; 840) is: A first portion (761; 861) disposed on the PCB (390); A second portion (762; 862) disposed on the PCB (390) and separated from the first portion (761; 861) of the sidewall (760; 860); A third portion (763; 863) disposed on the PCB (390); and It includes a fourth part (764; 864) disposed on the PCB (390) and separated from the third part (763; 863) of the sidewall (760; 860), and The first connector (781; 881) is located between the first and second portions (761; 861; 762; 862) of the side wall (760; 860) of the shield can (740; 840), and The second connector (782; 882) is located between the third and fourth portions (763; 863; 764; 864) of the side wall (760; 860) of the shield can (740; 840), Electronic device (200).
  16. In claim 14 or claim 15, The above PCB (390) is: A third conductive pad to which the first portion (761; 861) of the side wall (760; 860) of the shield can (740; 840) is electrically connected; and The second portion (762; 862) of the side wall (760; 860) of the shield can (740; 840) is electrically connected to a fourth conductive pad, and The first conductive pad is spaced apart from the third conductive pad and the fourth conductive pad, and is located between the third conductive pad and the fourth conductive pad. Electronic device (200).
  17. In claim 14, The above insulating material (770; 870) is: A first part (871) attached to a first part (866) of the above side wall (760; 860); A second part (872) attached to a second part (867) of the above side wall (760; 860); and It includes a third part (873) attached to the upper wall (750; 850) of the side wall (760; 860) and connecting the first part (871) of the insulating material (770; 870) to the second part (872) of the insulating material (770; 870), The second portion of the conductive line (710; 810) is attached to the first portion (871) of the insulating material (770; 870) so as to be spaced apart from the first portion (866) of the side wall (760; 860), is in contact with the first connector (781; 881), and is located between the first connector (781; 881) and the first portion (866) of the side wall (760; 860). The third portion of the conductive line (710; 810) is attached to the second portion (872) of the insulating material (770; 870) so as to be spaced apart from the second portion (867) of the side wall (760; 860), is in contact with the second connector (782; 882), and is located between the second connector (782; 882) and the second portion (867) of the side wall (760; 860). The first portion of the conductive line (710; 810) is attached to the third portion (873) of the insulating material (770; 870) so as to be spaced apart from the top wall (750; 850) of the shield can (740; 840). Electronic device (200).
  18. In any one of claims 14 to 17, A connector (394) placed on the PCB (390); A battery (270) electrically connected to the connector of the PCB (390); and A power management circuit (188) disposed on the PCB (390) and electrically connected to the battery (270) through the connector (394), configured to transmit a power signal based on power supplied from the battery (270) to the first conductive pad; It includes an electronic component (392) disposed on the PCB (390) and electrically connected to the second conductive pad of the PCB (390), The shield can (740; 840) is positioned between the connector (394) and the electronic component (392), and The conductive line (710; 810) is configured to transmit the power signal received from the first conductive pad to the second conductive pad from the power management circuit (188) in order to transmit the power signal to the electronic component (392). Electronic device (200).
  19. In any one of claims 14 to 18, A non-conductive layer disposed on the upper wall (350) of the shield can (340) to cover a portion of the conductive line (310); A thermal interface material (TIM) disposed on the above-mentioned non-conductive layer; and A vapor chamber comprising, which is thermally connected to the shield can through the above non-conductive layer and the above TIM, Electronic device (200).
  20. In any one of claims 14 to 19, A recess (355; 555) is formed on the upper surface of the upper wall of the shield can (740; 840) to accommodate the first portion of the conductive line (710; 810). Electronic device (200).

Description

Electronic device including shield can The present disclosure relates to an electronic device comprising a shield can. An electronic device, such as a smartphone, may include a printed circuit board (PCB) and various electronic components disposed on the PCB. Additionally, the electronic device may include a shielding member, such as a shield can disposed on the PCB to cover the electronic components for electromagnetic interference (EMI) shielding of the electronic components. The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure. FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments. FIG. 2a is a drawing showing an exemplary electronic device according to one embodiment. FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment. FIGS. 3a and FIGS. 3b show a printed circuit board of an electronic device according to one embodiment. FIG. 3c is an exploded view of a conductive bar attached to a shield can according to one embodiment. FIG. 3d is an enlarged view showing a first portion of a conductive bar according to one embodiment. FIG. 3e is an enlarged view showing a second portion of a conductive bar according to one embodiment. Figure 4 shows a printed circuit board of an electronic device according to a comparative example. FIG. 5a shows a printed circuit board of an electronic device according to one embodiment. FIG. 5b is an exploded view of a conductive bar attached to a shield can according to one embodiment. FIG. 5c is an enlarged view showing a first portion of a conductive bar according to one embodiment. FIG. 5d is an enlarged view showing a second portion of a conductive bar according to one embodiment. FIG. 6 is a drawing showing a printed circuit board of an electronic device and a speaker adjacent to the printed circuit board according to one embodiment. FIG. 7a shows a printed circuit board of an electronic device according to one embodiment. FIG. 7b is a cross-sectional view along line 7B-7B' of FIG. 7a. FIG. 8a shows a printed circuit board of an electronic device according to one embodiment. FIG. 8b is a cross-sectional view along line 8B-8B' of FIG. 8a. FIG. 9a is a drawing showing a printed circuit board assembly according to one embodiment. Figure 9b is an enlarged view of the area (R) of Figure 9a. FIG. 10 shows a printed circuit board of an electronic device according to one embodiment. FIGS. 11a and FIGS. 11b show a printed circuit board of an electronic device according to one embodiment. FIG. 12a is a drawing showing a printed circuit board of an electronic device according to one embodiment. FIG. 12b is a cross-sectional view along line 12B-12B' of FIG. 12a. FIG. 13a is a drawing showing a printed circuit board of an electronic device according to one embodiment. FIG. 13b is a cross-sectional view along line 13B-13B'-13B'' of FIG. 13a. Identical or similar components in the drawings may be assigned the same reference numerals. Descriptions of components having the same reference numeral may be applied identically or in a corresponding manner when referring to different drawings, unless otherwise noted, and redundant descriptions of components having the same reference numeral may not be repeated. In the following descriptions referring to specific drawings, reference numerals from other drawings may be referenced. FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single