KR-20260066596-A - CIRCUIT BOARD FEEDING DEVICE AND ELECTROPLATING EQUIPMENT

KR20260066596AKR 20260066596 AKR20260066596 AKR 20260066596AKR-20260066596-A

Abstract

The present invention discloses a circuit board supply device and an electroplating equipment, and relates to the field of circuit board electroplating technology. In this invention, the circuit board supply device includes a rack and a supply transfer mechanism, a positioning mechanism, and a push mechanism installed on the rack. The supply transfer mechanism is configured to arrange a circuit board horizontally and transfer the circuit board along a horizontal direction to an electroplating transfer mechanism of the electroplating equipment. The positioning mechanism is configured to position a circuit board on the supply transfer mechanism at a predetermined position. The push mechanism includes a first driving member and a first push member. The first push member is driven and connected to the first driving member. The first driving member drives the first push member to move it back and forth along a first direction, thereby driving and moving the circuit board. After positioning, the distance between two adjacent circuit boards arranged along the first direction is adjusted. By performing positioning with the positioning mechanism, a position offset can be prevented from occurring on the electroplating transfer mechanism, and by adjusting the distance between adjacent circuit boards with the push mechanism, the electroplating uniformity and production efficiency can be improved.

Inventors

찬, 탁워

Assignees

유니버셜 서킷 보드 이큅먼트 컴퍼니 리미티드

Dates

Publication Date: 20260512
Application Date: 20250124
Priority Date: 20241104

Claims (10)

In a circuit board supply device applied to electroplating equipment, The above electroplating equipment includes an electroplating transfer mechanism and an electroplating cylinder, and the electroplating transfer mechanism is configured to drive a circuit board to move it within the electroplating cylinder to perform electroplating, and the circuit board supply device includes a rack and a supply transfer mechanism, a positioning mechanism, and a pushing mechanism provided on the rack; The above-mentioned supply transfer mechanism is configured to arrange the circuit board horizontally and transfer the circuit board along the horizontal direction to the above-mentioned electroplating transfer mechanism; The above positioning mechanism is configured to position a circuit board on the above supply transfer mechanism at a preset position and to move the circuit board to the above electroplating transfer mechanism along a first direction; A circuit board supply device characterized in that the above-described push mechanism is configured to push a circuit board to move it along the first direction, and to adjust the spacing between two adjacent circuit boards arranged along the first direction after being positioned by the above-described positioning mechanism.
In paragraph 1, A circuit board supply device characterized in that the above-described push mechanism includes a first driving member and a first push member, the first push member is driven and connected to the first driving member, the first push member has a first position and a second position on the first driving member, the position determining mechanism is located between the first position and the second position, and the first driving member is configured to drive the first push member to move reciprocally between the first position and the second position.
In paragraph 2, A circuit board supply device characterized in that the first push member comprises a first connecting plate and a first guide wheel, the first connecting plate is drivenly connected to the first driving member, and a plurality of the first guide wheels are rotatably installed on one side of the first connecting plate facing the supply transfer mechanism and are spaced apart along a second direction to push and move a circuit board.
In paragraph 3, A circuit board supply device characterized in that the first push member further includes a first lifting device, the first connecting plate is driven and connected to the first driving member through the first lifting device, and the first lifting device drives the first connecting plate and the first guide wheel to move along a third direction, thereby causing the first guide wheel to move closer to or further away from the supply transfer mechanism.
In paragraph 1, A circuit board supply device characterized in that the above-described push mechanism pushes a circuit board positioned by the above-described positioning mechanism to move it along the above-described first direction, so that the gap between the pushed circuit board and the previous circuit board positioned by the above-described positioning mechanism becomes a preset value (L), the actual gap value between the two circuit boards is D, and L and D satisfy L-1.5mm ≤ D ≤ L+1.5mm.
In a circuit board supply device according to any one of claims 1 to 5, A circuit board supply device characterized in that the positioning mechanism comprises a second driving member, a second pushing member, and a positioning member, wherein the positioning member and the second pushing member are each installed on both sides of the supply transfer mechanism, a positioning area is formed between the second pushing member and the positioning member, the second pushing member is driven and connected to the second driving member, and the second pushing member is configured to push a circuit board located in the positioning area to make contact with the positioning member.
In paragraph 6, The positioning member comprises a mounting plate and a second guide wheel, wherein a plurality of the second guide wheels are rotatably installed on the mounting plate and spaced apart along the first direction to be configured to abut the circuit board; and/or A circuit board supply device characterized in that the second push member comprises a second connecting plate and a third guide wheel, the second connecting plate is drivenly connected to the second driving member, and a plurality of the third guide wheels are rotatably installed on one side of the second connecting plate toward the supply transfer mechanism and are spaced apart along the first direction to push the circuit board.
In paragraph 1, A circuit board supply device characterized in that the above-described supply transfer mechanism includes a plurality of rotating rollers, the plurality of rotating rollers are spaced apart along the first direction to form a transfer line, a plurality of friction wheels are spaced apart and installed on each of the rotating rollers, and the rotating rollers are configured to drive the friction wheels to rotate, thereby driving the circuit board with the friction wheels to move it along the first direction.
In paragraph 1, A circuit board supply device characterized in that the above-described supply transfer mechanism further includes a steering support assembly installed on the above-described positioning mechanism, the steering support assembly includes a support and a guide member, and a plurality of the guide members are movably installed on the support and configured to slide into contact with the circuit board when moving along the first direction on the circuit board or when moving through the positioning mechanism.
In electroplating equipment, Electroplating equipment characterized by comprising an electroplating transfer mechanism, an electroplating cylinder, and a circuit board supply device according to any one of claims 1 to 9.

Description

Circuit Board Feeding Device and Electroplating Equipment The present invention relates to the field of circuit board electroplating technology, and in particular to a circuit board supply device and electroplating equipment. In the current printed circuit board (PCB) manufacturing process, the effectiveness of the primary electroplating often fails to meet ideal standards, requiring a secondary electroplating treatment. An ideal electroplating effect generally requires performing thin-layer electroplating first, followed by thick-layer electroplating; to achieve this objective, conventional electroplating methods typically utilize horizontal electroplaters. Before the plates enter the electroplating machine, it is required that they be arranged neatly side by side and maintain a constant spacing. However, since existing equipment transports the structure via rollers, the precision of spacing control is insufficient, and generally, it can only reach 10 to 15 mm. If the positioning is inaccurate, the inclination problem caused by the difference in plate thickness affects the final electroplating quality, leading to a decrease in production efficiency. In order to more clearly explain the embodiments of the present invention or technical methods among the prior art, a brief introduction to the attached drawings necessary for describing the embodiments or prior art will be provided below. The attached drawings described below are merely drawings corresponding to some embodiments of the present invention, and it will be obvious to those skilled in the art that other drawings can be obtained from these attached drawings without any labor of inventive step. FIG. 1 is a schematic diagram of the structure of one embodiment of a circuit board supply device provided by the present invention; FIG. 2 is a schematic diagram of the internal structure of one embodiment of a circuit board supply device provided by the present invention; FIG. 3 is a schematic diagram of the structure of a supply transfer mechanism, a positioning mechanism, and a push mechanism among an embodiment of a circuit board supply device provided by the present invention; FIG. 4 is a plan view of a supply transfer mechanism and a positioning mechanism among an embodiment of a circuit board supply device provided by the present invention; FIG. 5 is a schematic diagram of the structure of a push mechanism among an embodiment of a circuit board supply device provided by the present invention; FIG. 6 is a schematic diagram of the exploded structure of a first push member in one embodiment of a circuit board supply device provided by the present invention; FIG. 7 is a schematic diagram of the assembly structure of a positioning mechanism and a steering support assembly in one embodiment of a circuit board supply device provided by the present invention; FIG. 8 is a schematic diagram of the exploded structure of the positioning mechanism and steering support assembly in FIG. 7; FIG. 9 is a schematic diagram of the structure of one embodiment of the electroplating equipment provided by the present invention; FIG. 10 is a plan view of the connection location of the circuit board supply device, the electroplating cylinder, and the electroplating transfer mechanism in one embodiment of the electroplating equipment provided in the present invention. The realization of the objectives, functional features, and advantages of the present invention will be further explained by associating embodiments with the attached drawings. Below, a clear and complete description of the technical measures in the embodiments of the present invention will be provided in conjunction with the attached drawings. It will be apparent that the described embodiments are merely partial embodiments of the present invention and not the entirety thereof. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without inventive labor fall within the scope of protection of the present invention. In an embodiment of the present invention, if a directional indication (e.g., up, down, left, right, front, back, etc.) is involved, it is intended to explain that such directional indication is merely for interpreting the relative positional relationship, movement situation, etc., between each member in any specific posture, and that if a change occurs in the said specific posture, the said directional indication also changes accordingly. Furthermore, if there are descriptions related to "first," "second," etc. in the embodiments of the present invention, such descriptions of "first," "second," etc. are used merely for explanatory purposes and should not be understood as indicating or implying their relative importance, or implicitly indicating the quantity of the indicated technical features. Thus, the features defined by "first" and "second" may explicitly or implicitly include one such feature. Additionally, the meaning of "and/or" or "and/o