KR-20260066597-A - HORIZONTAL ELECTROPLATING PRODUCTION LINE

KR20260066597AKR 20260066597 AKR20260066597 AKR 20260066597AKR-20260066597-A

Abstract

The present invention discloses a horizontal electroplating production line and relates to the field of circuit board electroplating technology. The horizontal electroplating production line comprises a horizontal electroplating device and a circuit board supply device. The horizontal electroplating device comprises a first rack, an electroplating cylinder installed on the first rack, and a horizontal electroplating transfer device. The electroplating cylinder extends along a first direction. The horizontal electroplating transfer device is configured to clamp a circuit board, move it within the electroplating cylinder, and perform electroplating. The circuit board supply device comprises a second rack and a supply transfer mechanism installed on the second rack. The supply transfer mechanism is a transfer line having a certain length. The supply transfer mechanism is configured to arrange the circuit board horizontally and transfer the circuit board along the horizontal direction to the horizontal electroplating transfer device of the electroplating device. During the overall transfer process, there is no need to perform operations to maintain the horizontal position of the circuit board using a robotic hand. The device occupies a smaller space than conventional electroplating devices, has lower manufacturing costs, and meets the requirements for high-precision electroplating.

Inventors

찬, 탁워

Assignees

유니버셜 서킷 보드 이큅먼트 컴퍼니 리미티드

Dates

Publication Date: 20260512
Application Date: 20250124
Priority Date: 20241104

Claims (20)

In a horizontal electroplating production line, A horizontal electroplating device comprising a first rack, an electroplating cylinder installed on the first rack, and a horizontal electroplating transfer device, wherein an inlet and an outlet are provided at each end of the electroplating cylinder, and the horizontal electroplating transfer device is configured to drive a circuit board entering the electroplating cylinder from the inlet and move it toward the outlet; and A horizontal electroplating production line characterized by comprising: a circuit board supply device installed at one end of the electroplating cylinder near the entrance, and including a second rack and a supply transfer mechanism installed on the second rack, wherein the supply transfer mechanism is configured to arrange the circuit board horizontally and transfer the circuit board along a first direction to maintain the circuit board that has entered the electroplating cylinder horizontally and move it onto the horizontal electroplating transfer device.
In paragraph 1, A horizontal electroplating production line characterized in that the circuit board supply device further comprises a first positioning mechanism and a first pushing mechanism, wherein the first positioning mechanism is configured to position a circuit board on the supply transfer mechanism to a preset position, and the first pushing mechanism is configured to drive the circuit board on the supply transfer mechanism to move along a first direction, thereby adjusting the spacing between two adjacent circuit boards positioned along the first direction and passing through the first positioning mechanism.
In paragraph 2, A horizontal electroplating production line characterized in that the first pushing mechanism pushes a circuit board positioned by the first positioning mechanism to move it along the first direction, such that the gap between the pushed circuit board and the previous circuit board positioned by the first positioning mechanism becomes a preset value (L), the actual gap between the two circuit boards is D, and L and D satisfy L-1.5mm ≤ D ≤ L+1.5mm.
In any one of paragraphs 1 through 3, The horizontal electroplating production line comprises a plate turning device and two horizontal electroplating devices, wherein the plate turning device is installed between the two horizontal electroplating devices and is configured to turn a circuit board after electroplating is completed in one of the horizontal electroplating devices and transfer it to the other horizontal electroplating device, and to clamp the opposing sides of the circuit board to the horizontal electroplating transfer devices of the two horizontal electroplating devices.
In paragraph 4, A horizontal electroplating production line characterized in that the plate turning device comprises a third rack and a supply mechanism and a turning mechanism installed on the third rack, wherein the supply mechanism is configured to arrange a circuit board horizontally and the turning mechanism is configured to turn the circuit board on the supply mechanism.
In paragraph 5, A horizontal electroplating production line characterized in that the turning mechanism comprises a driving assembly, a rotating shaft, and a clamping assembly, wherein the clamping assembly is installed on the rotating shaft, the rotating shaft is driven and connected to the driving assembly, the clamping assembly is provided with a slot for inserting a circuit board, and the driving assembly is configured to drive the rotating shaft to rotate it, thereby driving the circuit board to the clamping assembly to turn it.
In paragraph 6, A horizontal electroplating production line characterized in that the above-described supply mechanism includes a first transfer line, a second transfer line, a third transfer line, and a fourth transfer line, wherein the first transfer line and the second transfer line transport a circuit board along a first direction, the turning mechanism is installed between the first transfer line and the second transfer line and configured to turn a circuit board on the first transfer line to the second transfer line, the fourth transfer line is installed to extend along the transfer direction of the first transfer line, the third transfer line is installed along a second direction and configured to transport a circuit board on the second transfer line to the fourth transfer line, and the first direction and the second direction form a narrow angle.
In Paragraph 7, A horizontal electroplating production line characterized by the above-described plate turning device further comprising a second pushing mechanism and a second positioning mechanism, wherein the second positioning mechanism is installed on the fourth transfer line and configured to position a circuit board at a preset position, and the second pushing mechanism sequentially pushes the circuit board along the first transfer line, the second transfer line, the third transfer line, and the fourth transfer line, pushes the circuit board after being positioned by the second positioning mechanism to the horizontal electroplating device, and is configured to adjust the spacing between two adjacent circuit boards positioned along the first direction after passing through the second positioning mechanism.
In paragraph 1, A horizontal electroplating production line characterized by the above-described horizontal electroplating transfer device further comprising a clamping mechanism and an electroplating transfer mechanism, wherein a guide rail is installed along a horizontal direction on the first rack, the clamping mechanism comprises an interconnected sliding member and a clamping member, the clamping member is configured to be installed on the electroplating transfer mechanism to clamp a circuit board, the sliding member is slidably connected to the guide rail, and the electroplating transfer mechanism is configured to drive the clamping mechanism to move along the guide rail and transfer the circuit board.
In Paragraph 9, The above clamping member is, Fixing clip; A movable clip activably mounted to the fixed clip via a connecting assembly and configured to clamp a circuit board in cooperation with the fixed clip; and A horizontal electroplating production line characterized by including: a lifting support wheel installed on one side of the movable clip facing away from the fixed clip, which rises or falls to open or close the movable clip and the fixed clip when the clamping mechanism is moved through the electroplating transfer mechanism.
In Paragraph 10, The above-described horizontal electroplating transfer device further comprises a guide assembly installed on the first rack, wherein the guide assembly comprises a first guide member and a second guide member, wherein the first guide member is located on the path of material supply of the clamping mechanism and the second guide member is located on the path of material unloading of the clamping mechanism, and both the first guide member and the second guide member are provided with a guide slope; On the material supply path of the clamping mechanism, the guide slope comes into contact with the lifting support wheel when guiding and moving the clamping mechanism, thereby increasing the distance between the fixed clip and the movable clip to clamp the circuit board; and A horizontal electroplating production line characterized by being configured such that, on the material unloading path of the clamping mechanism, the guide slope comes into contact with the lifting support wheel when guiding and moving the clamping mechanism, thereby increasing the distance between the fixed clip and the movable clip so that the circuit board is disengaged.
In Paragraph 9, The above electroplating transfer mechanism includes a transfer steel belt, a driving mechanism, and a tensioning mechanism, and The above-mentioned conveying steel belt is installed to slide on the first rack, and the clamping mechanism is installed on the conveying steel belt; The above driving mechanism includes a transfer driving wheel and a transfer driven wheel, wherein the transfer driving wheel and the transfer driven wheel are each installed at both ends of the first rack, and the transfer driving wheel and the transfer driven wheel are connected via the transfer steel belt to form a closed-loop power transmission, thereby realizing continuous transfer; and A horizontal electroplating production line characterized in that the tensioning mechanism is elastically connected to the conveying steel belt and the first rack, and when the conveying steel belt slides on the first rack, the tensioning mechanism elastically deforms to change the horizontal gap between the first rack and the conveying steel belt so that the conveying steel belt is tensioned.
In Paragraph 12, A horizontal electroplating production line characterized in that the horizontal electroplating device further comprises a cathodic conductive clip reverse peeling device, wherein the cathodic conductive clip reverse peeling device comprises a deplating cylinder and a peeling assembly, wherein the deplating cylinder is installed on the first rack, and the conveying steel belt conveys the clamping mechanism into the deplating cylinder to form a conductive circuit with the clamping mechanism and the peeling assembly to peel off the electroplating material on the clamping mechanism.
In Paragraph 9, The above horizontal electroplating device further includes a conductive device, and the conductive device includes a conductive oil tank assembly, a cathode assembly, a conductive slider assembly, and a circulation mechanism. The above conductive oil tank assembly is equipped with conductive oil; The above cathode assembly is configured to be connected to the positive member of the power source to generate current; The conductive slider assembly is positioned in a clamping mechanism, the conductive slider assembly is installed within the conductive oil tank assembly and immersed in the conductive oil, and the conductive slider assembly is electrically connected to the cathode assembly to transmit current to the horizontal electroplating clip, thereby configuring to charge a circuit board on the horizontal electroplating clip; and A horizontal electroplating production line characterized in that the above-described circulation mechanism includes a collection tank and a circulation assembly, wherein the collection tank is configured to store conductive oil, and the conductive oil tank assembly is connected to the collection tank through the circulation assembly to form a circulation passage, thereby enabling mutual circulation of the conductive oil in the collection tank and the conductive oil in the conductive oil tank assembly.
In Paragraph 14, A horizontal electroplating production line characterized in that the conductive device further includes an oil supply mechanism, the circulation mechanism further includes an overflow assembly, the oil supply mechanism is configured to communicate with the conductive oil tank assembly to provide conductive oil to the conductive oil tank assembly, the overflow assembly has an overflow port, the overflow assembly communicates with the conductive oil tank assembly through the overflow port, the conductive oil tank assembly communicates with the oil collection tank through the overflow assembly, the conductive oil tank assembly has a preset volume, and when the liquid volume within the conductive oil tank assembly exceeds the preset volume, the conductive oil within the conductive oil tank assembly can be introduced into the oil collection tank through the overflow assembly.
In paragraph 1, The horizontal electroplating device further includes an anode spray device installed within the electroplating cylinder, and the anode spray device includes an anode mesh hole plate, an anode mesh, a spray assembly, and a conductive assembly. The above anode mesh is detachably mounted on the anode mesh hole plate; The above spray assembly is mounted on one side of the anode mesh facing away from the anode mesh hole plate; and A horizontal electroplating production line characterized by the anode mesh connecting a rectifier through the conductive assembly.
In Paragraph 16, A horizontal electroplating production line characterized in that at least two sets of anode spray devices are spaced apart and mounted within the electroplating cylinder, the spray sides of the two sets of anode spray devices are installed opposite each other, and optionally, the space between the two sets of anode spray devices installed opposite each other forms an electroplating chamber for receiving circuit board electroplating.
In Paragraph 17, The above-mentioned anode mesh hole plate includes a hole plate body and a guide wheel, and The hole plate body has a plurality of mesh holes and a plurality of first spray holes, each of the mesh holes is installed in a hexagonal shape, the plurality of mesh holes are arranged in a honeycomb array on the body, the plurality of first spray holes are installed spaced apart on the hole plate body, and the hole plate body is provided with a spray side facing a circuit board and performing a spray on the circuit board; and A horizontal electroplating production line characterized in that the guide wheel is mounted on the spray side of the hole plate body and configured to come into contact with the circuit board.
In paragraph 1, The above horizontal electroplating production line further includes a copper melting device, and the copper melting device includes a copper melting cylinder, a transfer pipeline, and an overflow mechanism. A dividing plate is installed within the copper dissolution cylinder, and the dividing plate divides the copper dissolution cylinder into a first cylinder body and a second cylinder body; the first cylinder body is equipped with a liquid inlet for introducing a reaction stock solution and a copper pellet basket for placing pure copper; an overflow portion is provided on the upper part of the dividing plate to communicate the first cylinder body and the second cylinder body; and an overflow port is opened in the second cylinder body to discharge an electroplating solution. The above transfer conduit connects the second cylinder body and the first cylinder body, thereby connecting the first cylinder body, the overflow portion, the second cylinder body, and the transfer conduit to form an internal circulation loop; and A horizontal electroplating production line characterized in that the overflow mechanism is mounted on the overflow port, and the overflow mechanism is configured to send the liquid in the second cylinder body to the electroplating cylinder.
In paragraph 1, The above horizontal electroplating production line further comprises a plate cleaning device and a plate drying device, wherein the plate cleaning device is installed at the inlet of the electroplating cylinder and is located between the circuit board supply device and the electroplating cylinder, and/or, the plate cleaning device is installed at the outlet of the electroplating cylinder; and A horizontal electroplating production line characterized by the above-mentioned plate drying device being installed at the outlet of the electroplating cylinder and positioned on one side of the plate cleaning device away from the electroplating cylinder, and configured to remove water from a circuit board that has been cleaned after passing through the plate cleaning device following electroplating.

Description

Horizontal Electroplating Production Line The present invention relates to the field of circuit board electroplating technology, and in particular to a horizontal electroplating production line. Conventional electroplating of circuit boards, regardless of whether using a gantry line or VCP, has utilized a vertical electroplating method. During the electroplating process, the circuit board is immersed in a chemical agent using vertical clamping of a jig, and the circuit board is shaken using a mechanism with a shaking function to cause the chemical agent to flow through the interconnection holes of the circuit board, thereby forming the electroplating under the conduction of the chemical agent. Horizontal electroplating devices of this structure occupy a large space, and since both material supply and unloading must be performed via robotic hands, manufacturing costs are high, plate manufacturing precision is relatively low, and they fail to meet the requirements for high-precision electroplating. In order to more clearly explain the embodiments of the present invention or technical methods among the prior art, a brief introduction to the attached drawings necessary for describing the embodiments or prior art will be provided below. The attached drawings described below correspond merely to some embodiments of the present invention, and it will be obvious to those skilled in the art that other drawings can be obtained from these attached drawings without any inventive labor. FIG. 1 is a schematic diagram of the structure of one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 2 is a plan view of one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 3 is a schematic diagram of the connection structure between a circuit board supply device and a horizontal electroplating device in one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 4 is a schematic diagram of the structure of a circuit board supply device among an embodiment of a horizontal electroplating production line provided by the present invention; FIG. 5 is a schematic diagram of a part of the structure of a circuit board supply device among an embodiment of a horizontal electroplating production line provided by the present invention; FIG. 6 is a schematic diagram of the connection structure between a plate turning device and two horizontal electroplating devices in one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 7 is a schematic diagram of the structure of a plate turning device among an embodiment of a horizontal electroplating production line provided by the present invention; FIG. 8 is a schematic diagram of a part of the structure of a plate turning device among an embodiment of a horizontal electroplating production line provided by the present invention; FIG. 9 is a schematic diagram of a transfer line for a circuit board of a plate turning device among an embodiment of a horizontal electroplating production line provided by the present invention; FIG. 10 is a schematic diagram of the structure of a turning mechanism of a plate turning device in one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 11 is a schematic diagram of the internal structure of a horizontal electroplating device among an embodiment of a horizontal electroplating production line provided by the present invention; FIG. 12 is a schematic diagram of the structure of a horizontal electroplating transfer device among an embodiment of a horizontal electroplating production line provided by the present invention; FIG. 13 is a schematic diagram of the structure of a clamping mechanism and a conveyed steel plate among a horizontal electroplating conveying device in one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 14 is a schematic diagram of the structure of a clamping mechanism and a conveyed steel plate in one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 15 is a schematic diagram of the assembly structure of a clamping mechanism and a guide rail in one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 16 is a schematic diagram of the cooperative structure of a clamping member and a guide assembly in one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 17 is a schematic diagram of the structure of an electroplating transfer mechanism in one embodiment of a horizontal electroplating production line provided by the present invention; FIG. 18 is a schematic diagram of the structure of a conveying steel belt, a conveying driving wheel, and a conveying driven wheel in one embodiment of a horizontal electroplating production line provided by