KR-20260066598-A - PLATE TURNING DEVICE AND ELECTROPLATING PRODUCTION LINE

KR20260066598AKR 20260066598 AKR20260066598 AKR 20260066598AKR-20260066598-A

Abstract

The present invention discloses a plate turning device and an electroplating production line, and relates to the field of circuit board electroplating technology. In this invention, the plate turning device is used on an electroplating production line, and the electroplating production line includes two horizontal electroplating equipment. The plate turning device is installed between the two horizontal electroplating equipment. The plate turning device includes a rack, and a supply mechanism and a turning mechanism installed on the rack. The supply mechanism has a horizontal transfer surface for horizontally arranging a circuit board. A circuit board that has completed electroplating on one of the horizontal electroplating equipments enters the horizontal transfer surface, and the supply mechanism transfers it along the horizontal direction to another horizontal electroplating equipment. During the transfer process, the turning mechanism turns the circuit board on the horizontal transfer surface, swaps the positions of the two opposing sides of the circuit board, and clips the opposing sides of the circuit board with the electroplating transfer mechanisms of the two horizontal electroplating equipments. After the circuit board passes through the two horizontal electroplating equipments and is electroplated twice, the plating layer becomes more uniform, and the production quality of the circuit board is effectively improved.

Inventors

찬, 탁워

Assignees

유니버셜 서킷 보드 이큅먼트 컴퍼니 리미티드

Dates

Publication Date: 20260512
Application Date: 20250124
Priority Date: 20241104

Claims (10)

In a plate turning device applied to an electroplating production line, The above electroplating production line includes horizontal electroplating equipment, and the horizontal electroplating equipment includes an electroplating transfer mechanism and an electroplating cylinder, and the electroplating transfer mechanism is configured to clamp the side of a circuit board to drive the circuit board and move it within the electroplating cylinder to perform electroplating, and the plate turning device is configured to be installed between two of the horizontal electroplating equipment, and the plate turning device includes a rack, and a supply mechanism and a turning mechanism installed on the rack: At each end of the supply mechanism near the two horizontal electroplating equipment, a first horizontal plane and a second horizontal plane are provided, respectively, and the first horizontal plane is configured to receive a circuit board that has completed electroplating from one of the horizontal electroplating equipment, and the supply mechanism transfers the circuit board to the second horizontal plane, thereby horizontally introducing the circuit board from the second horizontal plane into the other horizontal electroplating equipment; A plate turning device characterized by the above turning mechanism being configured to turn a circuit board on the above supply mechanism and to clip the opposing sides of the circuit board to the above electroplating transfer mechanism of the two above horizontal electroplating equipment.
In paragraph 1, A plate turning device characterized in that the above turning mechanism includes a driving assembly, a rotating shaft, and a clamping assembly, wherein the clamping assembly is installed on the rotating shaft, the rotating shaft is driven and connected to the driving assembly, the clamping assembly is provided with a slot for inserting a circuit board, and the driving assembly is configured to drive the rotating shaft to rotate it, thereby driving the circuit board to the clamping assembly to turn it.
In paragraph 2, A plate turning device characterized in that the clamping assembly comprises a plurality of snap blocks, the plurality of snap blocks are spaced apart along the longitudinal direction of the rotation axis, a snap groove is opened on each of the snap blocks, and the plurality of snap grooves are connected to form the slot.
In paragraph 3, The clamping assembly further comprises a plurality of first guide wheels, wherein the plurality of first guide wheels are spaced apart on the rotation axis and installed at the bottom of the snap groove, configured to slide against the side of the circuit board; and/or A plate turning device characterized by having a plurality of snap blocks and a plurality of first guide wheels respectively installed on opposite sides of the rotation axis.
In paragraph 2, A plate turning device characterized in that the above-described drive assembly includes a drive motor, a power transmission belt, and a power transmission wheel, one end of the rotating shaft is connected to the power transmission wheel, the power transmission belt is fitted onto the power transmission wheel and the motor, and the motor drives the power transmission wheel to rotate it through the power transmission belt, thereby driving the rotating shaft to rotate it.
In any one of paragraphs 1 through 5, A plate turning device characterized in that the above-described supply mechanism includes a first transfer line and a second transfer line installed at a distance from each other, the first transfer line and the second transfer line transport a circuit board along a first direction, and the turning mechanism is installed between the first transfer line and the second transfer line and configured to turn a circuit board on the first transfer line to the second transfer line.
In paragraph 6, A plate turning device characterized in that the above-described supply mechanism further comprises a first push assembly and a second push assembly, wherein the first push assembly is installed on the first transfer line and configured to push a circuit board on the first transfer line to the turning mechanism, and the second push assembly is installed on the second transfer line and configured to push a circuit board on the second transfer line to move along the first direction.
In Paragraph 7, The above-described supply mechanism further comprises a third transfer line and a fourth transfer line, wherein the fourth transfer line is installed to extend along the transfer direction of the first transfer line, and the second push assembly is configured to push a circuit board on the second transfer line to the third transfer line, and the third transfer line is installed along a second direction to transport a circuit board on the second transfer line to the fourth transfer line, and the first direction and the second direction form a narrow angle; and/or A plate turning device characterized in that the third transfer line is connected to the second transfer line and the fourth transfer line and is installed to be vertically movable along a third direction, so as to be configured to rise to lift a circuit board on the second transfer line or lower to place a circuit board on the third transfer line onto the fourth transfer line.
In paragraph 8, The above-described supply mechanism further comprises a third push assembly and a fourth push assembly, wherein the third push assembly is provided on the third transfer line and configured to push a circuit board on the third transfer line along the second direction to the fourth transfer line, and the fourth push assembly is configured to push a circuit board on the fourth transfer line along the first direction to adjust the spacing between two adjacent circuit boards; and/or A plate turning device characterized in that the above-described supply mechanism further includes a positioning assembly, the positioning assembly is installed on the fourth transfer line, and the third push assembly pushes a circuit board located on the third transfer line to move it along the second direction and make contact with the positioning assembly.
In the electroplating production line, It includes two horizontal electroplating devices and a plate turning device according to any one of claims 1 to 9, The above-described plate turning device is installed between two of the above-described horizontal electroplating equipment in an electroplating production line.

Description

Plate Turning Device and Electroplating Production Line The present invention relates to the field of circuit board electroplating technology, and in particular to a plate turning device and an electroplating production line. The effect of the first electroplating on existing PCB boards is not very ideal, and second and third electroplatings are required. Although the first and second electroplatings are plated relatively thinly, it is required that the surface of the plate be plated very uniformly. Therefore, the first and second electroplatings must use a horizontal electroplating method. To maximize the electroplating effect, the plate must be turned and the edges of the clamping points must be changed. Since the current near the edges of the clamping points is high, the plating is generally somewhat thick. Turning is performed because the chemical environment of the upper and lower plates is different. After turning with an existing plate turning device, the precision of plate positioning is relatively low, the turning step is slow and cumbersome, and the efficiency is not high, which affects the quality of the circuit board electroplating. In order to more clearly explain the embodiments of the present invention or technical methods among the prior art, a brief introduction to the attached drawings necessary for describing the embodiments or prior art will be provided below. The attached drawings described below are merely drawings corresponding to some embodiments of the present invention, and it will be obvious to those skilled in the art that other drawings can be obtained from these attached drawings without any labor of inventive step. FIG. 1 is a schematic diagram of the structure of one embodiment of a plate turning device provided by the present invention; FIG. 2 is a schematic diagram of the internal structure of one embodiment of a plate turning device provided by the present invention; FIG. 3 is a schematic diagram of the assembly structure of a supply mechanism and a turning mechanism in one embodiment of a plate turning device provided by the present invention; FIG. 4 is a schematic diagram of a part of the structure of a supply mechanism and a turning mechanism among an embodiment of a plate turning device provided by the present invention; FIG. 5 is a schematic diagram of a circuit board being transported to a supply mechanism in one embodiment of a plate turning device provided by the present invention; FIG. 6 is a schematic diagram of the structure of a turning mechanism among an embodiment of a plate turning device provided by the present invention; FIG. 7 is a schematic diagram of the structure of a rotation axis and a clamping assembly in one embodiment of a plate turning device provided by the present invention; FIG. 8 is a schematic diagram of the structure of a first push assembly among an embodiment of a plate turning device provided in the present invention; FIG. 9 is a schematic diagram of a partial structure of one embodiment of an electroplating production line provided by the present invention. The realization of the objectives, functional features, and advantages of the present invention will be further explained by associating embodiments with the attached drawings. Below, a clear and complete description of the technical measures in the embodiments of the present invention will be provided in conjunction with the attached drawings. It will be apparent that the described embodiments are merely partial embodiments of the present invention and not the entirety thereof. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without inventive labor fall within the scope of protection of the present invention. In an embodiment of the present invention, if a directional indication (e.g., up, down, left, right, front, back, etc.) is involved, it is intended to explain that such directional indication is merely for interpreting the relative positional relationship, movement situation, etc., between each member in any specific posture, and that if a change occurs in the said specific posture, the said directional indication also changes accordingly. Furthermore, if there are descriptions related to "first," "second," etc. in the embodiments of the present invention, such descriptions of "first," "second," etc. are used merely for explanatory purposes and should not be understood as indicating or implying their relative importance, or implicitly indicating the quantity of the indicated technical features. Thus, the features defined by "first" and "second" may explicitly or implicitly include one such feature. Additionally, the meaning of "and/or" or "and/or" appearing throughout the present invention includes three parallel methods, and "taking A and/or B as an example" includes method A, method B, or a method satisfying both A and B simultaneously. Furthermore, technical methods between each embodiment may be combined with