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KR-20260066619-A - EDGE MOUNT MEMORY CONNECTOR FOOTPRINT

KR20260066619AKR 20260066619 AKR20260066619 AKR 20260066619AKR-20260066619-A

Abstract

Dual in-line memory module (DIMM) connectors have pins that connect to the pad footprint, and signal routing crosstalk and noise are reduced. The shape and placement of the ground pad and signal pad can improve grounding of noise signals and improve signal isolation of the signal pins. The ground pad may have additional ground vias to increase the ground path to the ground plane.

Inventors

  • 행크스 랜던

Assignees

  • 인텔 코포레이션

Dates

Publication Date
20260512
Application Date
20251002
Priority Date
20241104

Claims (20)

  1. As a connector, Housing and, A plurality of ground pins for connecting the first ground pad of a dual in-line memory module (DIMM) board to the second ground pad of a system board, and It includes a plurality of signal pins for connecting a first signal pad of the DIMM board to a second signal pad of the system board—the signal pins are separated by a ground pin—and The above signal pin has a pin foot having a circular end tab for connecting to each second signal pad of the system board, Connector.
  2. In paragraph 1, The grounding pin has a pin foot having a foot portion and a circular end tab extending from the foot portion, Connector.
  3. In paragraph 2, The above ground pin foot is longer than the above signal pin foot, Connector.
  4. In paragraph 3, The circular end tab of the pin foot of the above signal pin is connected to a circular signal pad positioned between two ground pads, Connector.
  5. In any one of paragraphs 1 through 4, The second signal pad is located below the housing, and the signal pin is bent below the housing to contact the second signal pad. Connector.
  6. In paragraph 5, The second grounding pad is located below the housing, and the grounding pin is bent below the housing to contact the second grounding pad. Connector.
  7. As a computer system, A motherboard comprising a first surface having a first ground pad connected to a second ground pad of a dual in-line memory module (DIMM) board and a first signal pad connected to a second signal pad of the DIMM board, wherein the first signal pad is in a circular shape, and It includes a connector, and the connector is, Housing and, A grounding pin for connecting the first grounding pad to the second grounding pad, and It includes a signal pin for connecting the first signal pad to the second signal pad, and The above signal pin has a pin foot that is circular in shape for connecting to each of the first signal pads having the circular shape, Computer system.
  8. In Paragraph 7, The first signal pad above is in a circular shape, Computer system.
  9. In Article 7 or Article 8, The first grounding pad has a straight portion and a circular portion connected to the grounding pin, and the grounding pin has a pin foot having a straight portion and a circular end tab extending from the straight portion. Computer system.
  10. In Paragraph 9, The above ground pin foot is longer than the above signal pin foot, Computer system.
  11. In Paragraph 10, The pin foot of the above signal pin is connected to the circular signal pad positioned between two ground pads, Computer system.
  12. In any one of paragraphs 7 through 11, The second signal pad is located below the housing, and the signal pin is bent below the housing to contact the second signal pad. Computer system.
  13. In Paragraph 12, The second grounding pad is located below the housing, and the grounding pin is bent below the housing to contact the second grounding pad. Computer system.
  14. In any one of paragraphs 7 through 13, The above grounding pad has a first circular portion, a second circular portion, and a rectangular portion connecting the first circular portion to the first circular portion. Computer system.
  15. In Paragraph 14, The first circular portion is electrically connected to two through-hole vias to connect to a ground plane - said through-hole vias are located one on each side of the first circular portion and are offset from the center line of the first ground pad - , the second circular portion is electrically connected to two through-hole vias to connect to the ground plane - said through-hole vias are located one on each side of the second circular portion and are offset from the center line of the first ground pad - , Computer system.
  16. In any one of paragraphs 7 through 13, The first grounding pad has two physically separated parts on the first surface, namely a circular part and a rectangular part, Computer system.
  17. In Paragraph 16, The above circular portion is electrically connected to two through-hole vias and connected to a ground plane - the through-hole vias are located one on each side of the above circular portion, and the through-hole vias are offset from the center line of the first ground pad - , Computer system.
  18. In Paragraph 16, The above rectangular portion is electrically connected to two through-hole vias and connected to a ground plane - said through-hole vias are located one on each side of said rectangular portion, and said through-hole vias are offset from the center line of said first ground pad - , Computer system.
  19. In Paragraph 16, The first signal pad has a capacitive stub extending from the circular pin foot, and the capacitive stub extends between the two physically separated parts of an adjacent first ground pad. Computer system.
  20. In any one of paragraphs 7 through 19, A host processor device mounted on the above motherboard, A display connected to the host processor of the above motherboard so as to be able to communicate, A network interface connected to the host processor of the above motherboard so as to be communicable, or One or more of the batteries supplying power to the above computer system A computer system that further includes

Description

Edge Mount Memory Connector Footprint The detailed explanation concerns the memory system in general, and more specifically, the interconnection of memory modules. DDR (double data rate) memory is a critical component of computing systems that provides data and code to computing applications. As operating speeds increase, the demand for high-speed memory bandwidth and increased memory throughput grows. DDR memory can be provided in computing devices that have memory modules, such as DIMMs (Dual In-Line Memory Modules). DIMM refers to a type of surface-mount memory module, and there may be other types of surface-mount memory modules that are connected to pads on a system board using connectors. The following description includes a discussion of the drawings, which have illustrations given as examples of implementation. The drawings should be understood as examples, not limitations. As used herein, reference to one or more examples should be understood as describing specific features, structures, or characteristics included in at least one embodiment of the invention. Phrases such as “in one example” or “in an alternative example” disclosed herein provide examples of embodiments of the invention and do not necessarily refer to the same embodiment. However, these embodiments are not necessarily mutually exclusive. Figure 1 is a block diagram of an example of a system with memory module pads and routing for improving memory signaling. Figure 2a is a block diagram of an example of a grounding pad footprint. Figure 2b is a drawing of an example of the ground pin foot of the ground pad footprint of Figure 2a. Figure 3a is a block diagram of an example of a ground pad footprint and signal footprint with reduced length. Figure 3b is a diagram of an example of the ground pin foot of the ground pad footprint and the signal pin foot of the signal pad footprint of Figure 3a. Fig. 3c is a drawing of an example of a DIMM connector with the pin rotated under the connector housing. Figure 4a is a block diagram of an example of a reduced-length ground pad footprint and signal footprint with a capacitive stub. Figure 4b is a diagram of an example of the ground pin foot of the ground pad footprint and the signal pin foot of the signal pad footprint of Figure 4a. Figure 4c is a drawing of an example of a cross-sectional view of Figure 4b. Figure 5 is a block diagram of an example of a memory subsystem in which a DIMM connector can be implemented. Figure 6 is a block diagram of an example of a computing system in which a DIMM connector can be implemented. Figure 7 is a block diagram of an example of a multi-node network in which a DIMM connector can be implemented. Specific details and embodiments, including other potential embodiments and a non-limiting description of the drawings, are described below, and the drawings may represent some or all examples. The surface-mount memory module connector described herein has pins and a corresponding surface-mount pad footprint that reduces crosstalk and noise. The shape and placement of the ground pad and signal pad can increase signal integrity by improving grounding of noise signals and improving signal isolation of the signal pins. The connector footprint can also improve signal routing options. The ground pad may have additional ground vias to increase the ground path to the ground plane. FIG. 1 is a block diagram of an example of a system having memory module pads and routing for improving memory signaling. The system (100) includes a host (110) having a processor (114) and a controller (120). The controller (120) may be a memory controller. In one example, the controller (120) is an integrated memory controller (iMC). The system (100) includes a DIMM (dual inline memory module) (150), which represents a surface-mounted memory module. Surface-mounted memory modules other than DIMMs may have the described pin and pad footprints. A memory device (130) represents a memory device mounted on the DIMM (150). The memory device (130) includes an array (140), which represents a memory array for storing data. The memory device (130) includes a decoder (136) for decoding commands and a register (134) for storing configuration information. In one example, the register (134) is a mode register. The configuration of the register (134) controls the operating mode of the memory device (130). The memory device (130) includes a column DEC (decoder) (142) for managing access to specific columns and bits of memory. The memory device (130) includes a row DEC (decoder) (144) for managing access to selected rows of memory. The I/O (input/output) (112) represents a hardware interface of the host (110) for connecting to the I/O (input/output) (152) of the DIMM (150). The I/O (132) represents a hardware interface of the memory device (130) for connecting to the signals of the DIMM (150). The interface includes a CA (command/address) (162), which represents a signal line for the command and address bus. The