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KR-20260066620-A - EDGE MOUNT MEMORY CONNECTOR WITH STAGGERED FOOTPRINT PINS

KR20260066620AKR 20260066620 AKR20260066620 AKR 20260066620AKR-20260066620-A

Abstract

Dual In-Line Memory Module (DIMM) connectors have pins that connect to the pad footprint, and signal routing crosstalk and noise are reduced. The signal pins are staggered, with long and short signal pins arranged alternately. The long pins have corresponding signal pads on the system board, which are located further away from the connector than the corresponding signal pads of the short pins.

Inventors

  • 행크스 랜던

Assignees

  • 인텔 코포레이션

Dates

Publication Date
20260512
Application Date
20251002
Priority Date
20241104

Claims (18)

  1. As a connector, Housing and, The first signal pin having a first length from the first pin foot to the first end of the first signal pin, and The second signal pin having a second length from the second pin foot to the second end of the second signal pin - the first length is longer than the second length, and the first pin foot is further from the center of the housing than the second pin foot - and, Ground pin between the first signal pin and the second signal pin A connector including
  2. In paragraph 1, The first pin foot is bent away from the first signal pin and the housing, Connector.
  3. In paragraph 1 or 2, The second pin foot is bent down below the first signal pin and down below the housing, Connector.
  4. In any one of paragraphs 1 through 3, The first signal pin is a long pin wound upward to provide a connection point to a pad on the memory module board, Connector.
  5. In any one of paragraphs 1 through 4, The second signal pin is a short pin wound downward to provide a connection point to a pad on the memory module board, Connector.
  6. In any one of paragraphs 1 through 5, The grounding pin comprises a first grounding pin mounted on a grounding pad and further comprises a second grounding pin mounted on the grounding pad, wherein the first grounding pin has a length equal to the first length of the first signal pin and the second grounding pin has a length equal to the second length of the second signal pin. Connector.
  7. In paragraph 6, The above connector has alternately arranged ground pins and signal pins, wherein the first ground pin and the second ground pin are located between the first signal pin and the second signal pin, and further includes another pair of ground pins to have the first signal pin located between the two pairs of ground pins. Connector.
  8. As a computer system, A motherboard comprising a first surface having a first ground pad connected to a second ground pad of a dual in-line memory module (DIMM) board and a first signal pad connected to a second signal pad of the DIMM board, and It includes a connector, and the connector is, Housing and, The first signal pin having a first length from the first pin foot to the first end of the first signal pin, and The second signal pin having a second length from the second pin foot to the second end of the second signal pin - the first length is longer than the second length, and the first pin foot is further from the center of the housing than the second pin foot - and, A ground pin between the first signal pin and the second signal pin, Computer system.
  9. In paragraph 8, The first pin foot is bent away from the first signal pin and the housing, Computer system.
  10. In Article 8 or 9, The second pin foot is bent down below the first signal pin and down below the housing, Computer system.
  11. In any one of paragraphs 8 through 10, The first signal pin is a long pin wound upward to provide a connection point to a pad on the memory module board, Computer system.
  12. In any one of paragraphs 8 through 11, The second signal pin is a short pin wound downward to provide a connection point to a pad on the memory module board, Computer system.
  13. In any one of paragraphs 8 through 12, The grounding pin comprises a first grounding pin mounted on a grounding pad and further comprises a second grounding pin mounted on the grounding pad, wherein the first grounding pin has a length equal to the first length of the first signal pin and the second grounding pin has a length equal to the second length of the second signal pin. Computer system.
  14. In Paragraph 13, The above connector has alternately arranged ground pins and signal pins, wherein the first ground pin and the second ground pin are located between the first signal pin and the second signal pin, and further includes another pair of ground pins to have the first signal pin located between the two pairs of ground pins. Computer system.
  15. In any one of paragraphs 8 through 14, The first ground pad is longer than the first signal pad. Computer system.
  16. In paragraph 15, The first grounding pad has a first foot pad portion and a second foot pad portion, and the first foot pad portion and the second foot pad portion are connected through a through-hole via between them. Computer system.
  17. In any one of paragraphs 8 through 16, The second ground pad is longer than the second signal pad, and the ground pin comes into contact with the corresponding second ground pad before the first signal pin comes into contact with the corresponding second signal pad, and before the second signal pin comes into contact with the corresponding second signal pad. Computer system.
  18. In any one of paragraphs 8 through 17, A host processor device mounted on the above motherboard, A display connected to the host processor of the above motherboard so as to be able to communicate, A network interface connected to the host processor of the above motherboard so as to be communicable, or One or more of the batteries supplying power to the above computer system A computer system that further includes

Description

Edge Mount Memory Connector with Staggered Footprint Pins The detailed explanation concerns the memory system in general, and more specifically, the interconnection of memory modules. DDR (double data rate) memory is a critical component of computing systems that provides data and code to computing applications. As operating speeds increase, the demand for high-speed memory bandwidth and increased memory throughput grows. DDR memory can be provided in computing devices that have memory modules, such as DIMMs (Dual In-Line Memory Modules). DIMM refers to a type of surface-mount memory module, and there may be other types of surface-mount memory modules that are connected to pads on a system board using connectors. The connectors and footprints of the pads corresponding to the connector pins provide memory channel interconnection. As signal rates become increasingly faster, the burden on signaling through connectors, pins, and surface-mount pads is growing. Signaling can be adversely affected by routing constraints resulting from pins being closer together and more ground vias being used. Signaling can also be adversely affected by connector pin and surface-mount pad impedances that reduce signal integrity. Signaling can also be adversely affected by increased crosstalk between adjacent signals, particularly as pin-pad separation decreases. The following description includes a discussion of the drawings, which have illustrations given as examples of implementation. The drawings should be understood as examples, not limitations. As used herein, reference to one or more examples should be understood as describing specific features, structures, or characteristics included in at least one embodiment of the invention. Phrases such as “in one example” or “in an alternative example” disclosed herein provide examples of embodiments of the invention and do not necessarily refer to the same embodiment. However, these embodiments are not necessarily mutually exclusive. Figure 1 is a block diagram of an example of a system with memory module pads and routing for improving memory signaling. Figure 2a is a block diagram of an example of a connector pad footprint. Figure 2b is a diagram of an example of a memory board connected to a connector pin. FIG. 2c is a drawing of an example of a connector pin corresponding to the pad footprint of FIG. 2a. Figure 2d is a diagram of an example of a connector pin connected to the memory board of Figure 2b. Figure 3a is a block diagram of an example of a grounding pad footprint. Figure 3b is a drawing of an example of the ground pin foot of the ground pad footprint of Figure 3a. Figure 4a is a block diagram of an example of a ground pad footprint and signal footprint with reduced length. Figure 4b is a diagram of an example of the ground pin foot of the ground pad footprint and the signal pin foot of the signal pad footprint of Figure 4a. Figure 5 is a block diagram of an example of a memory subsystem in which a DIMM connector can be implemented. Figure 6 is a block diagram of an example of a computing system in which a DIMM connector can be implemented. Figure 7 is a block diagram of an example of a multi-node network in which a DIMM connector can be implemented. Specific details and embodiments, including other potential embodiments and a non-limiting description of the drawings, are described below, and the drawings may represent some or all examples. The surface-mount memory module connector described herein has pins and corresponding surface-mount pad footprints that reduce crosstalk and noise. The shape and arrangement of the ground pad, signal pad, and corresponding pin improve grounding of the noise signal. Both the pins, namely the ground pin and the signal pin, have lengths and spacing that improve signal isolation from the signal pin, thereby increasing signal integrity. A memory module connector is a connector for edge-mounted memory modules, such as DIMMs (Dual In-Line Memory Modules). An edge-mounted memory module refers to a memory module board that is mounted to the connector by inserting the edge of the board into the connector. The connector generally has pins that contact both surfaces of the memory module board. The connector is surface-mounted because it has connector pins with a foot portion that mounts to a corresponding pad on a system board, such as a motherboard. The connector has staggered signal pins with long and short signal pins arranged alternately. The long pins have corresponding signal pads on the system board, which are located further away from the connector than the corresponding signal pads of the short pins. FIG. 1 is a block diagram of an example of a system having memory module pads and routing for improving memory signaling. The system (100) includes a host (110) having a processor (114) and a controller (120). The controller (120) may be a memory controller. In one example, the controller (120) is an integrated memory controller (iMC). The sys