KR-20260066631-A - CO-PACKAGED OPTICS SYSTEMS THAT INCLUDE OPTICAL ENGINES AND METHODS OF MAKING THE SAME

Abstract

An optical engine and a method for manufacturing the optical engine are provided. In embodiments, the optical engine comprises a silicon substrate and a photonic component mounted on the silicon substrate. The photonic component comprises a coupling interface and an edge coupler configured to interface with one or more external optical components. The edge coupler comprises a photonic component edge at the coupling interface. The silicon substrate comprises a substrate coupling edge at the coupling interface. The photonic component edge protrudes beyond the substrate coupling edge at the coupling interface.

Inventors

• 리우 웨이-캉
• 탕 청-쩌
• 루 하우-얀
• 천 춘-훙
• 왕 이-춘
• 양 쭝-수에
• 쩡 리-추안

Assignees

• 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드

Dates

Publication Date

20260512

Application Date

20251030

Priority Date

20241104

Claims (10)

1. In a method for manufacturing a semiconductor package, Step of mounting photonic components on a silicon substrate - The above photonic component includes a coupling interface and an edge coupler configured to interface with an external optical component; The edge coupler includes a first edge located at the coupling interface; The silicon substrate includes a second edge at the coupling interface; and A step of removing a portion of the silicon substrate such that the first edge protrudes beyond the second edge located at the coupling interface. A method for manufacturing a semiconductor package including
2. In semiconductor packaging, silicon substrate; Photonic component mounted on the above silicon substrate - The above photonic component includes a coupling interface and an edge coupler configured to interface with one or more external optical components; The edge coupler includes a photonic component edge at the coupling interface; The silicon substrate includes a substrate coupling edge at the coupling interface; The above photonic component edge protrudes beyond the substrate coupling edge at the coupling interface; The shape of the silicon substrate includes a semicircular notch below the edge of the photonic component -; and A conductive terminal providing an electrical connection for ground or power supply voltage between the semiconductor package and an external component. A semiconductor package comprising, wherein the conductive terminal comprises a solder region and an intermetallic compound (IMC) region.
3. In paragraph 2, A semiconductor package wherein the coupling interface extends along a coupling plane, and the substrate coupling edge includes a recess portion spaced apart from the coupling plane by a first non-zero predetermined distance and an end portion spaced apart from the coupling plane by a second non-zero predetermined distance, wherein the first and second non-zero predetermined distances are different.
4. In paragraph 3, The above edge coupler is a semiconductor package comprising a spot size converter (SSC), a buried oxide layer, and a cladding.
5. In paragraph 2, An electronic integrated circuit mounted on the silicon substrate adjacent to the above photonic component A semiconductor package including additional
6. In photonic semiconductor packages, silicon substrate; Photonic component mounted on the above silicon substrate Includes, The above photonic component includes a coupling interface and an edge coupler configured to interface with one or more external optical components, and The edge coupler includes a photonic component edge at the coupling interface, and The silicon substrate includes a substrate edge at the coupling interface, and In the plan view of the above photonic semiconductor package, the edge coupler extends along a direction from a position on the silicon substrate to a position beyond the substrate edge, and A photonic semiconductor package in which the width of the edge coupler gradually decreases along the direction.
7. In paragraph 6, An electronic integrated circuit hybridly bonded to the top of the above photonic component A photonic semiconductor package including additional
8. In Paragraph 7, The above photonic component is a photonic semiconductor package comprising one or more through-silicon vias (TSVs) that electrically connect one or more transistors of the electronic integrated circuit to an external component.
9. In paragraph 8, A photonic semiconductor package in which the above photonic component includes one or more interconnection structures that electrically connect the TSV to one or more conductive pads.
10. In Paragraph 9, The above photonic component is a photonic semiconductor package comprising one or more conductive terminals on the conductive pad.

Description

Co-packaged optical systems including optical engines and methods of making the same The present invention relates to an optical engine and a method for manufacturing an optical engine. Silicon photonics technology can be useful for high-speed data transmission and optical communication systems. One of the components within some of these optical communication systems is an edge coupler, which facilitates the efficient transmission of optical signals between the silicon photonic device of the optical communication system and an external optical element. These external elements typically include, for example, a fiber array unit (FAU) or a micro-optical lens that can be used to direct and focus optical signals into and out of the silicon photonic chip. The integration of an effective edge coupler can help minimize coupling losses and ensure high-performance operation of the entire optical communication system. The embodiments of the present disclosure are best understood from the following detailed description when read together with the accompanying drawings. In accordance with standard practice in the industry, it should be noted that various features are not drawn to actual scale. In practice, the dimensions of various features may be increased or decreased at will for clarity of description. FIGS. 1a through 1g illustrate an exemplary co-packaged optical system comprising an example optical engine. FIGS. 2a and 2b are vertical cross-sectional views of alternative embodiment configurations for an optical engine. FIGS. 3a to 3e illustrate various intermediate structures that can be formed and used in an exemplary process for manufacturing an optical engine having an edge coupler. FIGS. 4a through 4e illustrate various intermediate structures that can be formed and used in an exemplary process for manufacturing an optical engine having an edge coupler having a silicon nitride (SiN) spot size converter. FIGS. 5a to 5d illustrate various intermediate structures that can be formed and used in other exemplary processes for manufacturing an optical engine having an edge coupler. FIGS. 6a to 6d illustrate various intermediate structures that can be formed and used in other exemplary processes for manufacturing an optical engine having an edge coupler. FIGS. 7a through 7d illustrate the elements of an exemplary optical engine after the removal of a silicon ledge. FIGS. 8a and 8b illustrate various intermediate structures that can be formed and used in an exemplary process for aligning an edge coupler with an exemplary optical component. FIG. 9 illustrates a flowchart of an exemplary method for manufacturing an optical engine. The disclosure below provides many different embodiments or examples for implementing various features of the invention provided. To simplify the disclosure, specific examples of components and devices are described below. Of course, these are merely examples and are not intended to be limiting. For example, in the following detailed description, the formation of the first feature on or above the second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features so that the first and second features do not come into direct contact. Additionally, the disclosure may repeat reference numbers and/or letters in various examples. Such repetition is for the purpose of simplification and clarification, and such repetition itself does not affect the relationship between the various embodiments and/or configurations disclosed. Additionally, spatial relative terms such as “below,” “bottom,” “lower,” “above,” and “above” may be used herein for ease of description to explain the relationship between one element or feature shown in the drawings and other element(s) or feature(s). Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the drawings. The device may be oriented differently (rotated 90° or rotated to a different orientation), and accordingly, the spatial relative terms used herein may be interpreted in the same way. Unless otherwise explicitly stated, each element having the same reference number is presumed to have the same material composition and a thickness within the same thickness range. Various embodiments will be described in detail with reference to the accompanying drawings. Where possible, the same reference numbers will be used throughout the drawings to refer to identical or similar parts. References and implementations of specific examples are for illustrative purposes only and are not intended to limit the scope of the claims. The fabrication of edge couplers in silicon photonics can present several technical challenges. These challenges include maintaining low insertion loss and high coupling efficiency over a wide wavelength range, as w