KR-20260066639-A - POWER DELIVERY MODULE

KR20260066639AKR 20260066639 AKR20260066639 AKR 20260066639AKR-20260066639-A

Abstract

A heat dissipation structure is positioned between two busbars or outside the busbars to dissipate heat from the busbars. In one embodiment, since the heat dissipation structure is positioned between two busbars, heat from two busbars can be dissipated simultaneously using a single heat dissipation structure, thereby reducing the cost of the heat dissipation structure. Additionally, an insulating member is positioned between the two busbars and/or between the busbars and the heat dissipation structure to achieve electrical insulation. A heat dissipation structure is positioned between the two busbars and/or between the busbars and the heat dissipation structure to achieve electrical insulation.

Inventors

후 치-위
추앙 웬-칭
호 위-시옌
팡 위-칭
리 리-추앙
파울스티히 르네

Assignees

신테크 컴퍼니, 리미티드

Dates

Publication Date: 20260512
Application Date: 20251103
Priority Date: 20251027

Claims (20)

As a power transfer module, 1st busbar; A second busbar positioned facing the first busbar; A heat dissipation structure disposed between the first busbar and the second busbar; A first insulating member disposed between the first busbar and the heat dissipation structure; and A second insulating member disposed between the first busbar and the second busbar Includes, The thickness of the first insulating member is greater than or equal to the thickness of the second insulating member. Power transfer module.
In paragraph 1, A power transfer module in which the first insulating member is formed as a single ring-shaped structure surrounding the heat dissipation structure, and the first insulating member is also positioned between the second busbar and the heat dissipation structure.
In paragraph 1, A power transfer module in which the thermal conductivity of the first insulating member is greater than the thermal conductivity of the second insulating member.
In paragraph 1, A power transfer module in which the material of the first insulating member is different from the material of the second insulating member.
In paragraph 1, A power transfer module in which the resistivity of the second insulating member is greater than the resistivity of the first insulating member.
In paragraph 1, A power transfer module in which the first insulating member partially overlaps with the second insulating member.
In paragraph 1, The above-mentioned heat dissipation structure is a power transfer module comprising a pipe having a plurality of fins formed therein.
In paragraph 1, The above-described heat dissipation structure is a power transfer module comprising a pipe and a plurality of sub-tubes disposed within the pipe.
In paragraph 1, The above-described heat dissipation structure comprises a pipe and two heat conduction blocks, and the pipe is interposed between the two heat conduction blocks, forming a power transfer module.
In Paragraph 9, A power transfer module in which the above pipe is accommodated in a space formed between the two heat conduction blocks, and the space is filled with a thermal interface material.
In paragraph 1, The above-described heat dissipation structure comprises a pipe and a thermal conductive plate, wherein the pipe is embedded in the thermal conductive plate and exposed from one side of the thermal conductive plate, a power transfer module.
In paragraph 1, The above-described heat dissipation structure comprises a pipe and at least one corrugated plate disposed within the pipe, a power transfer module.
In Paragraph 12, The above-described heat dissipation structure comprises a plurality of corrugated plates arranged at intervals within the pipe, forming a power transfer module.
In Paragraph 12, The above-described heat dissipation structure comprises a plurality of corrugated plates, and the two corrugated structures of two adjacent corrugated plates are arranged in a staggered manner, power transfer module.
In Paragraph 12, A power transmission module having at least one longitudinal groove formed in the inner wall of the pipe, and at least one corrugated plate having at least one engaging portion that engages with the at least one longitudinal groove.
In paragraph 1, A power transfer module in which the first busbar and the second busbar have two recesses facing each other, and the heat dissipation structure is accommodated in the two recesses.
In paragraph 1, A third insulating member disposed between the second busbar and the heat dissipation structure; and A power transfer module further comprising a fourth insulating member disposed between the first busbar and the second busbar, wherein the second insulating member and the fourth insulating member are located on opposite sides of the heat dissipation structure.
As a power transfer module, 1st busbar; A second busbar positioned facing the first busbar; A first heat dissipation structure disposed outside the first busbar; and An insulating member comprising a central portion and a first clamping portion Includes, The above central portion is connected to the first clamping portion and interposed between the first busbar and the second busbar, and the first clamping portion clamps the first heat dissipation structure together with the first busbar. Power transfer module.
In Paragraph 18, The above-mentioned first heat dissipation structure is a power transfer module comprising a pipe having a plurality of fins formed therein.
In Paragraph 18, The above-mentioned first heat dissipation structure is a power transfer module comprising a pipe and a plurality of sub-tubes disposed within the pipe.

Description

Power Delivery Module The present invention relates to a power transfer module, and more specifically, to a power transfer module capable of improving the heat dissipation efficiency of a busbar and reducing heat dissipation costs. With the rise of big data, machine learning, the Internet of Things, and various network platforms, the demand for servers in daily life is steadily increasing. Typically, servers are connected to busbars behind racks for power supply. Busbars generate a significant amount of heat during operation. Therefore, effectively improving the heat dissipation efficiency of busbars and reducing heat dissipation costs has become a critical design challenge. To solve the aforementioned problems, the present invention provides a power transfer module capable of improving the heat dissipation efficiency of a busbar and reducing heat dissipation costs. According to one embodiment of the present invention, a power transfer module comprises a first busbar, a second busbar, a heat dissipation structure, a first insulating member, and a second insulating member. The second busbar is positioned facing the first busbar. The heat dissipation structure is positioned between the first busbar and the second busbar. The first insulating member is positioned between the first busbar and the heat dissipation structure. The second insulating member is positioned between the first busbar and the second busbar. The thickness of the first insulating member is greater than or equal to the thickness of the second insulating member. In one embodiment, the first insulating member is formed as a single ring-shaped structure surrounding the heat dissipation structure, and the first insulating member is also positioned between the second busbar and the heat dissipation structure. In one embodiment, the thermal conductivity of the first insulating member is greater than the thermal conductivity of the second insulating member. In one embodiment, the material of the first insulating member is different from the material of the second insulating member. In one embodiment, the resistivity of the second insulating member is greater than the resistivity of the first insulating member. In one embodiment, the first insulating member partially overlaps with the second insulating member. In one embodiment, the heat dissipation structure includes a pipe having a plurality of fins formed inside. In one embodiment, the heat dissipation structure includes a pipe and a plurality of sub-tubes disposed within the pipe. In one embodiment, the heat dissipation structure comprises a pipe and two heat conduction blocks, and the pipe is sandwiched between the two heat conduction blocks. In one embodiment, the pipe is accommodated in a space formed between the two heat conduction blocks, and the space is filled with a thermal interface material. In one embodiment, the heat dissipation structure comprises a pipe and a thermal conductive plate, wherein the pipe is embedded in the thermal conductive plate and exposed from one side of the thermal conductive plate. In one embodiment, the heat dissipation structure comprises a pipe and at least one corrugated plate disposed within the pipe. In one embodiment, the heat dissipation structure includes a plurality of corrugated plates arranged at intervals within the pipe. In one embodiment, the heat dissipation structure includes a plurality of corrugated plates, and two corrugated structures of two adjacent corrugated plates are arranged in a staggered manner. In one embodiment, at least one longitudinal groove is formed in the inner wall of the pipe, and the at least one corrugated plate has at least one engaging portion that engages with the at least one longitudinal groove. In one embodiment, the first busbar and the second busbar have two recesses facing each other, and the heat dissipation structure is accommodated in the two recesses. In one embodiment, the power transfer module further includes a third insulating member and a fourth insulating member. The third insulating member is positioned between the second busbar and the heat dissipation structure. The fourth insulating member is positioned between the first busbar and the second busbar. The second insulating member and the fourth insulating member are located on opposite sides of the heat dissipation structure. According to another embodiment of the present invention, a power transfer module comprises a first busbar, a second busbar, a first heat dissipation structure, and an insulating member. The second busbar is positioned facing the first busbar. The first heat dissipation structure is positioned outside the first busbar. The insulating member comprises a central portion and a first clamping portion. The central portion is connected to the first clamping portion and interposed between the first busbar and the second busbar, and the first clamping portion clamps the first heat dissipation structure together with the first busbar. I