KR-20260066655-A - Process chamber substrate transfer

Abstract

A processing system comprising a first chamber and a second chamber is provided. The first chamber comprises a chamber body that encloses an internal volume; an edge ring having an upper portion and a lower portion, wherein the edge ring comprises a first ridge extending inward from the upper portion and a second ridge extending inward relative to the first ridge. The first ridge is configured to support a substrate, and the second ridge is configured to support a susceptor. The first chamber further comprises a plurality of heating lamps positioned over the edge ring. The second chamber comprises a chamber body that encloses an internal volume; a first cooling plate; one or more robots within the internal volume of the second chamber — the one or more robots have one or more end effectors positioned over the first cooling plate —; and a plurality of lift pins extending through the first cooling plate.

Inventors

• 아더홀트, 볼프강 알.
• 데몬트, 피터

Assignees

• 어플라이드 머티어리얼스, 인코포레이티드

Dates

Publication Date

20260512

Application Date

20240827

Priority Date

20230907

Claims (20)

1. As a processing system, First chamber; and A second chamber coupled to the first chamber above Includes, The first chamber above is, Chamber body that encloses internal volume, An edge ring positioned in the internal volume — the edge ring has an uppermost portion and a lowermost portion, and the edge ring includes a first ledge extending inwardly from the uppermost portion and a second ledge extending inwardly relative to the first ledge, wherein the first ledge is configured to support a substrate and the second ledge is configured to support a susceptor —, and A plurality of heating lamps positioned on the edge ring above Includes, The above second chamber is, Chamber body that encloses internal volume, First cooling plate, One or more robots within the internal volume of the second chamber — said one or more robots have one or more end effectors positioned on the first cooling plate —, and A plurality of lift pins extending through the first cooling plate A processing system including
2. In paragraph 1, One or more of the above end effectors are located at an outer position within the internal volume of the second chamber, and A processing system in which the above outer position is not placed on the plurality of lift pins.
3. In paragraph 1, A processing system in which each of the above one or more robots is configured to move one of the above one or more end effectors in a horizontal direction.
4. In paragraph 1, A processing system further comprising a controller configured to activate the one or more robots to move the one or more end effectors from a first position to a second position toward the center of the internal volume of the second chamber.
5. In paragraph 4, A processing system in which one or more end effectors are configured to contact the edge of a substrate at the second position, and the controller is further configured to lower the plurality of lift pins when the one or more end effectors are at the second position.
6. In paragraph 1, A processing system further comprising a susceptor positioned on the second reg of the edge ring, wherein the susceptor has a diameter smaller than the diameter of the second reg by a distance of about 0.1 mm to about 0.5 mm.
7. In paragraph 1, A processing system wherein the second chamber further comprises a second cooling plate positioned above the first cooling plate in the internal volume of the second chamber.
8. In Paragraph 7, A processing system further comprising an actuator coupled to the second cooling plate, wherein the actuator is configured to move the second cooling plate from a first position to a second position, and the second position is located closer to the first cooling plate than the first position.
9. As a processing system, First chamber; and A second chamber coupled to the first chamber above Includes, The first chamber above is, Chamber body that encloses internal volume, An edge ring positioned in the internal volume — the edge ring has an uppermost portion and a lowermost portion, and the edge ring includes a first ledge extending inwardly from the uppermost portion and a second ledge extending inwardly relative to the first ledge, wherein the first ledge is configured to support a substrate and the second ledge is configured to support a susceptor —, and A plurality of heating lamps positioned on the edge ring above Includes, The above second chamber is, A chamber body that encloses an internal volume, and A robot having an end effector comprising a body, a first support member, and a second support member — the body has an uppermost and a lowermost portion, the first support member and the second support member are located on the uppermost portion of the body, and the second support member is movable relative to the first support member from a first position to a second position — A processing system including
10. In Paragraph 9, The above-mentioned first support member includes an uppermost part, a lowermost part, a first resistor, and a second resistor, and The first resistor above extends toward the second support, and A processing system in which the second resistor extends from the first resistor toward the second support member.
11. In Paragraph 9, The above-mentioned second support member includes an uppermost part, a lowermost part, a first resistor, and a second resistor, and The above first resistor extends toward the above first support member, and A processing system in which the second resistor extends from the first resistor toward the first support member.
12. In Paragraph 11, A processing system in which the second support member comprises a recess located between the first resistor and the uppermost portion of the second support member.
13. In Paragraph 9, A processing system further comprising a susceptor positioned on the second reg of the edge ring, wherein the susceptor has a diameter smaller than the diameter of the second reg by a distance of about 0.1 mm to about 0.5 mm.
14. As a method for processing a substrate, A step of moving a substrate positioned on a susceptor into the internal volume of a process chamber; A step of positioning the susceptor supporting the substrate on a support portion within the internal volume of the process chamber; A step of performing a process on the substrate within the internal volume of the process chamber; and After the above process is performed, the step of simultaneously removing the substrate and the susceptor from the internal volume of the process chamber. A method including
15. In Paragraph 14, A method in which the above substrate has a larger diameter than the above susceptor.
16. In Paragraph 14, A method in which the above susceptor comprises a top surface without any holes.
17. In Paragraph 14, A step of moving the susceptor supporting the substrate to a second chamber; and Step of separating the substrate from the susceptor in the second chamber A method that further includes.
18. In Paragraph 17, A method comprising the step of removing the substrate from the second chamber after separating the substrate from the susceptor.
19. In Paragraph 18, A method comprising the step of, after separating the substrate from the susceptor, placing a new substrate on the susceptor in the second chamber.
20. In Paragraph 17, A method further comprising the steps of: positioning the susceptor on a first cooling plate within the second chamber; and providing a cooling fluid to flow through the first cooling plate when the susceptor is positioned on the first cooling plate.

Description

Process chamber substrate transfer The embodiments of the present disclosure generally relate to methods and related equipment for improving the uniformity of processes performed on substrates in process chambers, such as the transfer of substrates between chambers and rapid thermal processing. Components used in electronic devices are continuously becoming smaller. Manufacturing these smaller components presents challenges regarding the handling of the smaller components and the thinner substrates on which they are formed. Furthermore, as the size of the components to be formed continues to shrink, achieving process uniformity across the substrate during processes such as rapid thermal processing is becoming increasingly important. Accordingly, there is a need for methods and equipment that can improve the handling of thinner substrates and the uniformity of processes performed on the substrates. In one embodiment, a processing system is provided, the processing system comprising: a first chamber; and a second chamber coupled to the first chamber, wherein the first chamber comprises a chamber body enclosing an internal volume, an edge ring positioned in the internal volume—the edge ring has an upper portion and a lower portion, the edge ring comprises a first ledge extending inwardly from the upper portion and a second ledge extending inwardly relative to the first ledge, the first ledge is configured to support a substrate and the second ledge is configured to support a susceptor—and a plurality of heating lamps positioned over the edge ring, and the second chamber comprises a chamber body enclosing an internal volume, a first cooling plate, one or more robots within the internal volume of the second chamber—the one or more robots have one or more end effectors positioned over the first cooling plate—and a plurality of lift pins extending through the first cooling plate. In another embodiment, a processing system is provided, the processing system comprising: a first chamber; and a second chamber coupled to the first chamber, wherein the first chamber comprises a chamber body enclosing an internal volume, an edge ring positioned in the internal volume—the edge ring has an upper and lower portion, the edge ring includes a first leg extending inward from the upper portion, and a second leg extending inward relative to the first leg, the first leg is configured to support a substrate, and the second leg is configured to support a susceptor—and a plurality of heating lamps positioned over the edge ring, and the second chamber comprises a chamber body enclosing an internal volume, and a robot having an end effector comprising a body, a first support, and a second support—the body has an upper and lower portion, the first support and the second support are positioned on the upper portion of the body, and the second support is movable relative to the first support from a first position to a second position. In another embodiment, a method for processing a substrate is provided, the method comprising the steps of: moving a substrate positioned on a susceptor into the internal volume of a process chamber; positioning a susceptor supporting the substrate on a support within the internal volume of the process chamber; performing a process on the substrate within the internal volume of the process chamber; and, after the process is performed, simultaneously removing the substrate and the susceptor from the internal volume of the process chamber. In another embodiment, a susceptor for heat treatment of a substrate is provided, the susceptor comprising a disk-shaped body having a first surface, a second surface, and an outer edge connecting the first surface to the second surface, the first surface being configured to face the substrate during treatment, the first surface having no holes, and the susceptor being configured to be repositioned between a process chamber and a cooling chamber while the substrate is at least partially supported on the first surface. In a manner that allows the features of the above-mentioned disclosure to be understood in detail, a more specific description of the disclosure briefly summarized above may be made with reference to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings are merely illustrative of exemplary embodiments and should not be construed as limiting the scope of the disclosure, and that other equally valid embodiments may be permitted. FIG. 1 illustrates a simplified drawing of a processing system according to one embodiment. FIG. 2 shows a side cross-sectional view of the RTP system illustrated in FIG. 1 according to one embodiment. FIG. 3 is a side view of the cooling system illustrated in FIG. 1 according to one embodiment. FIG. 4a is a partial side view of the end effector of the transfer robot from FIG. 1 according to one embodiment. FIG. 4b is a partial side view of an end effector from F