KR-20260066733-A - Resin molding device and method for manufacturing resin molded articles

Abstract

A resin molding device (1) comprises a resin supply mechanism (26) that supplies a granular resin to a resin receiving portion (24) including a release film (F) and a frame member (24a) disposed on the release film (F); a resin molding mechanism (3) that performs resin molding by placing a release film (F) supplied with granular resin between the upper mold (UM) and the lower mold (LM), and a resin recovery mechanism (6) capable of sucking and recovering the granular resin supplied to the release film (F) before placing the release film (F) in the molding mold (M).

Inventors

• 이토세 타미
• 나카오 사토시

Assignees

• 토와 가부시기가이샤

Dates

Publication Date

20260512

Application Date

20240530

Priority Date

20230912

Claims (8)

1. A resin supply mechanism for supplying a granular resin to a resin receiving portion comprising a release film and a frame member disposed on the release film, and A resin molding apparatus having a molding mold comprising an upper mold and a lower mold facing the upper mold, wherein a release film having the separable resin supplied thereon is placed between the upper mold and the lower mold to perform resin molding, and A resin molding apparatus having a resin recovery mechanism capable of sucking and recovering the granular resin supplied to the resin receiving portion before placing the above-mentioned release film in the molding mold.
2. In paragraph 1, The resin recovery mechanism comprises a plate-shaped member that covers the upper portion of the resin receiving portion including the frame member to form a resin receiving space between the release film and the frame member, a recovery path in which one end is connected to a first hole formed in the plate-shaped member and the other end is connected to a suction source, and a recovery portion connected to the other end of the recovery path, forming a resin molding device.
3. In paragraph 2, The above plate-shaped member is a resin molding device having a second hole capable of supplying gas by communicating the resin receiving space and the outside of the resin receiving space.
4. In paragraph 3, The above plate-shaped member has a plurality of the above second holes, A resin molding device in which a plurality of the second holes are arranged around the first holes.
5. In paragraph 3 or 4, A resin molding device in which the above plate-shaped member contacts the above frame member and covers the upper part of the above resin receiving portion.
6. In any one of paragraphs 2 through 4, A resin molding device in which the above plate-shaped member covers the upper part of the resin receiving portion while having a gap between it and the above frame member.
7. A resin supply process for supplying a predetermined amount of granular resin to a resin receiving portion comprising a release film and a frame member disposed on the release film, and A determination process for determining whether the resin on the granular body supplied to the resin receiving part is appropriate, and If it is determined in the above determination process that the resin on the granular body is not suitable, a recovery process for sucking and recovering the resin on the granular body supplied to the resin receiving part, and A method for manufacturing a resin molded article, comprising a molding process in which, when the resin on the granular body is determined to be suitable in the above determination process, the release film supplied with the resin on the granular body and the molding target are placed between an upper mold and a lower mold, and resin molding is performed.
8. In Paragraph 7, The above determination process is a method for manufacturing a resin molded article in which the resin on the powder is determined to be unsuitable when the supply amount of the resin on the powder exceeds the above predetermined amount, when the flow rate of the resin on the powder exceeds a critical value, or when the distribution of the resin on the powder is uneven.

Description

Resin molding device and method for manufacturing resin molded articles The present disclosure relates to a resin molding apparatus and a method for manufacturing a resin molded article. A substrate having a semiconductor chip fixed thereon, etc., is generally used as an electronic component by resin sealing. Conventionally, in a resin molding apparatus, a resin material is supplied to a pre-cut release film, and the release film supplied with the resin material is transferred to a molding mold (e.g., Patent Document 1). In the resin molding device of Patent Document 1, if the resin material supplied on the release film is not suitable, such as when the resin material is larger than the target weight, the release film is discarded together with the supplied resin material. FIG. 1 is a schematic diagram showing a resin molding apparatus according to the present embodiment. Figure 2 is a schematic diagram showing the configuration of a resin molding module. FIG. 3a is a schematic diagram showing a resin recovery mechanism of the first embodiment. Figure 3b is a plan view of a plate-shaped member. FIG. 4 is a schematic diagram showing a resin recovery mechanism of the second embodiment. Figure 5 is a flowchart showing a method for manufacturing a resin molded article. Hereinafter, embodiments of a resin molding apparatus and a method for manufacturing a resin molded article according to the present disclosure will be described with reference to the drawings. Furthermore, the embodiments described below are examples for explaining the present disclosure and are not limited to these embodiments. Accordingly, the present disclosure can be implemented in various forms without departing from the gist thereof. A substrate (a molding target) on which a semiconductor chip (hereinafter referred to as "chip") is fixed is used as an electronic component (a resin-molded product) by resin sealing. Technologies for resin sealing the substrate include compression molding and transfer molding. As a compression method, a resin sealing method can be described in which liquid resin or granular resin is supplied to a release film, the release film is loaded into the lower mold of a molding mold, and the molding target is immersed in the molten liquid resin or granular resin on the release film to perform resin molding. Examples of electronic components include, in addition to semiconductor chips, resistors and capacitors. [Composition of the Resin Molding Device] FIG. 1 illustrates a schematic diagram of a resin molding device (1). The resin molding device (1) in this embodiment employs a compression method and is equipped with a resin supply module (2), a plurality of resin molding modules (3) (an example of a resin molding mechanism) (three in this embodiment), a substrate supply module (4), and a control unit (5). The resin supply module (2), the plurality of resin molding modules (3), and the substrate supply module (4) can each be independently mounted or detached. In addition, although the resin molding modules (3) in this embodiment are composed of three, they can be composed of two or fewer or four or more, and an optimal number can be appropriately adopted depending on the production quantity. Furthermore, the Z direction shown in FIG. 1 is the vertical direction of the resin molding device (1), the arrangement direction of the resin supply module (2), the resin molding module (3), and the substrate supply module (4) is the X direction, and the direction perpendicular to the X direction and the Z direction (the depth direction of each module) is the Y direction. In the X, Y, and Z directions shown in Fig. 1, the direction in which the arrow points is the +X direction, +Y direction, and +Z direction, and the direction opposite to the direction in which the arrow points is the -X direction, -Y direction, and -Z direction. The control unit (5) includes a processor such as a CPU (Central Processing Unit) and a storage device such as RAM (Random Access Memory). The control unit (5) controls the operation of the resin molding device (1) by executing a control program stored in the storage device on the processor. Unless otherwise specified, the operation of the resin molding device (1) described below is performed based on the operation commands of the control unit (5). In the following description, the operation commands of the control unit (5) are, in principle, omitted from explanation, and the operation commands of the control unit (5) are explained as necessary. The substrate supply module (4) is provided with a pre-molding substrate supply unit (41) for supplying a pre-molding substrate (Sa) (an example of a molding target), a molding-completed substrate storage unit (42) for storing a molding-completed substrate (Sb) (an example of a resin molded product), a substrate loading unit (43) for transferring the pre-molding substrate (Sa) and the molding-completed substrate (Sb), and a substrate transfer mechanism (44) for tr