KR-20260066747-A - Adhesive composition, laminate, and method for manufacturing a processed semiconductor substrate

Abstract

The present invention is an adhesive composition containing an adhesive component and a carbinol-modified polyorganosiloxane.

Inventors

• 사카구치 가나
• 야규 마사후미
• 신조 테츠야

Assignees

• 닛산 가가쿠 가부시키가이샤

Dates

Publication Date

20260512

Application Date

20240909

Priority Date

20230912

Claims (11)

1. An adhesive composition containing an adhesive component and a carbinol-modified polyorganosiloxane.
2. In Article 1, An adhesive composition in which the above-mentioned carbinol-modified polyorganosiloxane is a carbinol-modified polydimethylsiloxane.
3. In Article 1, An adhesive composition in which the above-mentioned carbinol-modified polyorganosiloxane has a hydroxyl group directly bonded to a carbon atom in its side chain.
4. In Article 1, An adhesive composition in which the above-mentioned carbinol-modified polyorganosiloxane has hydroxyl groups directly bonded to carbon atoms at both ends.
5. In Article 1, An adhesive composition in which the content of the carbinol-modified polyorganosiloxane in the non-volatile portion of the adhesive composition is 0.01 mass% to 30 mass%.
6. In Article 1, An adhesive composition in which the above adhesive component is a component that hardens by a hydrosilylation reaction.
7. In Article 6, The component hardened by the above hydrosilylation reaction, A component (A-1) having an alkenyl group having 2 to 40 carbon atoms bonded to a silicon atom, and A component (A-2) having Si-H groups, and Adhesive composition containing a platinum group metal catalyst (A-3).
8. In Article 7, An adhesive composition in which the above component (A-1) contains a polyorganosiloxane (a1) having an alkenyl group having 2 to 40 carbon atoms bonded to a silicon atom.
9. In Article 7, The above component (A-2) is an adhesive composition containing a polyorganosiloxane having Si-H groups.
10. A semiconductor substrate or electronic device layer, and, A light-transmitting support substrate, and having an adhesive layer installed between the semiconductor substrate or the electronic device layer and the support substrate, A laminate in which the adhesive layer is an adhesive layer formed from an adhesive composition described in any one of claims 1 to 9.
11. A method for manufacturing a processed semiconductor substrate or an electronic device layer, A 5A process in which the semiconductor substrate of the laminate described in claim 10 is processed, or a 5B process in which the electronic device layer of the laminate described in claim 10 is processed, and A method for manufacturing a processed semiconductor substrate or an electronic device layer, comprising a 6A process in which the semiconductor substrate processed by the 5A process and the support substrate are separated, or a 6B process in which the electronic device layer processed by the 5B process and the support substrate are separated.

Description

Adhesive composition, laminate, and method for manufacturing a processed semiconductor substrate The present invention relates to an adhesive composition, a laminate, and a method for manufacturing a processed semiconductor substrate. Semiconductor wafers, which have conventionally been integrated in a two-dimensional planar direction, require semiconductor integration technology that integrates (stacks) in a three-dimensional direction in addition to the planar direction for the purpose of further integration. This three-dimensional stacking is a technology that integrates multiple layers by connecting via through silicon vias (TSVs). When integrating multiple layers, each wafer to be integrated has its side opposite to the formed circuit surface (i.e., the back side) thinned by polishing, and the thinned semiconductor wafers are stacked. A semiconductor wafer (referred to simply as a wafer here) is bonded to a support in order to be polished by a polishing device. This bonding is called a temporary bond because it must be easily detached after polishing. This temporary bond must be easily detached from the support, and if a large force is applied during detachment, the thinned semiconductor wafer may be cut or deformed; therefore, it must be easily detached to prevent such occurrences. However, it is undesirable for the wafer to detach or become misaligned due to polishing stress during back-side polishing of the semiconductor wafer. Therefore, the performance required for the temporary bond is to withstand the stress during polishing and to be easily detached after polishing. As temporary adhesives used for such temporary bonding, adhesives containing polydimethylsiloxane (Patent Document 1), temporary adhesives containing epoxy-modified polysiloxane (Patent Document 2), etc. have been proposed. FIG. 1 is a schematic cross-sectional view of an example of a laminate in a first embodiment. FIG. 2 is a schematic cross-sectional view of another example of a laminate in the first embodiment. FIG. 3a is a schematic cross-sectional view for explaining a method for manufacturing a laminate showing an example in a first embodiment (the 1). FIG. 3b is a schematic cross-sectional view for explaining a method of manufacturing a laminate showing an example in the first embodiment (the 2). FIG. 4 is a schematic cross-sectional view of an example of a laminate in a second embodiment. FIG. 5 is a schematic cross-sectional view of another example of a laminate in the second embodiment. FIG. 6a is a schematic cross-sectional view for explaining a method for manufacturing a laminate showing an example in a second embodiment (the 1). FIG. 6b is a schematic cross-sectional view for explaining a method of manufacturing a laminate showing an example in a second embodiment (the 2). FIG. 6c is a schematic cross-sectional view for explaining a method of manufacturing a laminate showing an example in a second embodiment (Fig. 3). FIG. 7a is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in a first embodiment (the 1). FIG. 7b is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in the first embodiment (the 2). FIG. 7c is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in the first embodiment (Fig. 3). FIG. 7d is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in the first embodiment (Fig. 4). FIG. 8a is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in a second embodiment (the 1). FIG. 8b is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in a second embodiment (the 2). FIG. 8c is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in a second embodiment (Fig. 3). FIG. 8d is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in a second embodiment (the 4). FIG. 8e is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in a second embodiment (Fig. 5). FIG. 8f is a schematic cross-sectional view for explaining a method of processing a laminate showing an example in a second embodiment (Fig. 6). (Adhesive composition) The adhesive composition of the present invention contains an adhesive component and a carbinol-modified polyorganosiloxane. The adhesive composition may contain other components. Examples of adhesive compositions include polysiloxane-based adhesives, acrylic resin-based adhesives, epoxy resin-based adhesives, polyamide-based adhesives, polystyrene-based adhesives, polyimide adhesives, phenolic resin-based adhesives, etc., but are not limited to these. Among these, a polysiloxane-based adhesive is preferred as an adhesive composition because it exhibits suitable a