KR-20260066760-A - Substrate processing device

KR20260066760AKR 20260066760 AKR20260066760 AKR 20260066760AKR-20260066760-A

Abstract

A substrate processing device processes a substrate. The substrate processing device is equipped with a plurality of pipes. Each of the plurality of pipes has an inner surface and an outer surface. A fluid flows through the inner surface of each of the plurality of pipes. The plurality of pipes includes at least one virgin material pipe and one recycled material pipe. The virgin material pipe contains virgin material made of fluoropolymer resin. The recycled material pipe contains recycled material made of fluoropolymer resin. At least one of the virgin material pipe and the recycled material pipe is provided with at least one of marking and coloring to identify the virgin material pipe and the recycled material pipe.

Inventors

오카 쇼고
모리 료헤이
모리타 도모카즈
오사다 나오유키

Assignees

가부시키가이샤 스크린 홀딩스

Dates

Publication Date: 20260512
Application Date: 20240910
Priority Date: 20230922

Claims (14)

As a substrate processing device for processing substrates, It has an inner surface and an outer surface, and is equipped with a plurality of pipes through which fluid flows within the inner surface, and The above plurality of pipes are, At least one virgin material pipe containing a virgin material of fluoropolymer resin, and At least one recycled material pipe containing recycled fluoropolymer material Includes, A substrate processing apparatus in which at least one of the virgin material pipe and the recycled material pipe is provided with at least one of marking and coloring to identify the virgin material pipe and the recycled material pipe.
In claim 1, A substrate processing apparatus having at least one of the virgin material pipe and the recycled material pipe, having a marking portion between the inner surface and the outer surface for identifying the virgin material pipe and the recycled material pipe.
In claim 1 or claim 2, The apparatus further comprises a substrate processing unit that performs substrate processing on the above substrate, and The above substrate processing unit has a chamber for receiving the substrate, and The above at least one virgin material piping includes a piping disposed within the chamber, and A substrate processing apparatus comprising at least one regenerated material piping, wherein the piping is disposed outside the chamber.
In claim 3, The above at least one virgin material piping includes a liquid supply piping that supplies liquid to the substrate processing unit, and A substrate processing device in which a portion of the liquid supply piping is disposed within the chamber and another portion of the liquid supply piping is disposed outside the chamber.
In claim 3, Further comprising a fluid cabinet for receiving the liquid supplied to the substrate processing unit, The above at least one virgin material piping includes a recovery piping that distributes the liquid discharged from the substrate processing unit to the fluid cabinet, and A substrate processing device in which at least a portion of the above recovery piping is disposed outside the chamber.
In claim 3, The above-mentioned at least one recycled material pipe includes a drainage pipe through which liquid discharged from the substrate processing unit flows, and The above drainage pipe is a substrate processing device positioned outside the chamber.
In claim 3, The plurality of pipes above include a liquid supply pipe that supplies liquid to the substrate processing unit, and The above substrate processing device is, An opening and closing valve installed in the above liquid supply pipe to control the flow of the liquid through the above liquid supply pipe and the cessation of such flow, and A fluid box accommodating a part of the above liquid supply piping and the above opening and closing valve Further equipped with, The above-mentioned at least one regeneration pipe includes a gas pipe for circulating gas, and A substrate processing device in which a portion of the above gas piping is disposed within the above fluid box.
In claim 2, A substrate processing device, wherein the marking portion further indicates the type of fluid flowing through the virgin material piping or the recycled material piping.
In claim 2, A substrate processing device, wherein the above marking portion further indicates the location where the above virgin material piping or the above recycled material piping is placed.
In claim 2, A substrate processing device wherein the marking portion further indicates the direction in which the fluid flowing through the virgin material piping or the recycled material piping flows.
In claim 1, A substrate processing device in which the coloring is performed on the above virgin material piping.
In claim 1 or claim 11, A substrate processing device in which the black coloring is performed on at least one of the virgin material piping and the recycled material piping.
In claim 1 or claim 11, A substrate processing apparatus in which at least one of the virgin material piping and the recycled material piping comprises a translucent portion in which the coloring is performed.
In claim 13, A substrate processing device in which the above translucent portion is colored black.

Description

Substrate processing device The present invention relates to a substrate processing apparatus. A substrate processing device is equipped with pipes for circulating a processing liquid or pipes for circulating a gas. A fluoropolymer molded article is used for the pipes for circulating the processing liquid (see, for example, Patent Document 1). Among the pipes for circulating the gas, a fluoropolymer molded article is used for the pipes placed under a chemical liquid atmosphere. FIG. 1 is a schematic diagram of a substrate processing apparatus according to an embodiment of the present invention. FIGS. 2a to 2c are drawings showing a recycled material piping installed in a substrate processing device according to an embodiment of the present invention (Fig. 2a), a drawing showing a virgin material piping installed in a substrate processing device according to an embodiment of the present invention (Fig. 2b), and a drawing showing a cross-section of a recycled material piping installed in a substrate processing device according to an embodiment of the present invention (Fig. 2c). FIG. 3 is a cross-sectional view schematically showing the configuration of a substrate processing unit included in a substrate processing device according to an embodiment of the present invention. FIG. 4 is a drawing showing a part of the configuration of a substrate processing device according to an embodiment of the present invention. FIGS. 5A and FIGS. 5B are drawings showing one example of recycled material piping ( FIG. 5A) and another example of recycled material piping ( FIG. 5B). FIGS. 6a to 6c are drawings showing a first modified example of a marking part (Fig. 6a), a second modified example of a marking part (Fig. 6b), and a third modified example of a marking part (Fig. 6c). FIGS. 7a and 7b are drawings showing an example in which the entire recycled material pipe or virgin material pipe is colored and a marking portion is formed (Fig. 7a), and an example in which the entire recycled material pipe or virgin material pipe is colored and no marking portion is formed (Fig. 7b). Hereinafter, embodiments according to the substrate processing apparatus of the present invention will be described with reference to the drawings (Figs. 1 to 7b). However, the present invention is not limited to the embodiments described below, and can be implemented in various forms without departing from the gist thereof. Furthermore, descriptions of parts that are redundant may be appropriately omitted. Also, in the drawings, identical or substantial parts are given the same reference numerals so as not to repeat descriptions. In the substrate processing apparatus according to the present invention, the "substrate" to be processed can be various substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for Field Emission Displays (FEDs), substrates for optical discs, substrates for magnetic discs, and substrates for magneto-optical discs. Although embodiments of the present invention are described below primarily using the case where a disc-shaped semiconductor wafer is the target of substrate processing, the substrate processing apparatus according to the present invention can be applied in the same way to various substrates other than the semiconductor wafer mentioned above. Furthermore, regarding the shape of the substrate, it is not limited to a disc shape, and the substrate processing apparatus according to the present invention can be applied to substrates of various shapes. FIG. 1 is a schematic diagram of a substrate processing device (100) of the present embodiment. More specifically, FIG. 1 is a schematic plan view of a substrate processing device (100) of the present embodiment. The substrate processing device (100) processes a substrate (W). The substrate processing device (100) of the present embodiment is a single-wafer type device and processes the substrate (W) one by one using a processing liquid. The substrate processing device (100) is, for example, a cleaning device or an etching device. As shown in FIG. 1, the substrate processing device (100) comprises a plurality of substrate processing units (300), a fluid cabinet (410), a plurality of fluid boxes (420), a plurality of load ports (LP), an indexer robot (IR), a center robot (CR), and a control device (400). Each load port (LP) accommodates multiple substrates (W) stacked together. An indexer robot (IR) transports the substrates (W) between the load port (LP) and the center robot (CR). The center robot (CR) transports the substrates (W) between the indexer robot (IR) and the substrate processing unit (300). Additionally, a loading platform (pass) for temporarily loading the substrates (W) may be installed between the indexer robot (IR) and the center robot (CR), and the device may be configured to indirectly receive the substrates (W) through the loading platform be