KR-20260066764-A - Measuring device, measuring method, lithography device, and method of manufacturing an article

KR20260066764AKR 20260066764 AKR20260066764 AKR 20260066764AKR-20260066764-A

Abstract

A measuring device advantageous for realizing high measurement precision in measuring a mark using a binning function is provided. The measuring device has an imaging unit that captures a mark using an imaging element, and a control unit that determines the position of the mark based on the results of a first measurement using the imaging unit and a second measurement using the imaging unit performed after the first measurement. The control unit determines a first binning condition, which is a condition for binning processing in the first measurement, and a second binning condition, which is a condition for binning processing in the second measurement, based on design information of the mark (S301); sets the first binning condition (S303) to perform the first measurement (S304); and sets the second binning condition (S307) to perform the second measurement (S308).

Inventors

야마구치 와타루
나가사와 요시키
히라타 유야

Assignees

캐논 가부시끼가이샤

Dates

Publication Date: 20260512
Application Date: 20241031
Priority Date: 20231114

Claims (15)

As a measuring device for measuring the position of a mark installed on a substrate, An imaging unit that captures the above mark using an imaging element, and A control unit for determining the position of the mark based on the result of a first measurement using the above-mentioned imaging unit and a second measurement using the above-mentioned imaging unit performed after the first measurement, The above control unit is, Based on the design information of the above mark, a first binning condition, which is a condition for binning processing in the first measurement, and a second binning condition, which is a condition for binning processing in the second measurement, are determined, and The first measurement is performed by setting the first binning condition, and A measuring device characterized by performing the second measurement by setting the second binning condition.
In Article 1, The first measurement above is an approximate measurement of the relative positional misalignment of the substrate with respect to the imaging unit, and the second measurement is a precise measurement of the relative positional misalignment. Each of the above first binning condition and the above second binning condition includes a binning coefficient representing the number of adjacent pixels to be binning, and A measuring device characterized in that the control unit determines the first binning condition and the second binning condition such that the binning coefficient specified in the first binning condition becomes greater than the binning coefficient specified in the second binning condition.
In Article 2, The above mark is composed of a plurality of line elements extending in a first direction corresponding to the vertical transmission direction of the imaging element, and The above design information includes information on the line width of a line element, the pitch between line elements, and the length of the line element in the first direction. When the line width in the detection surface of the above-mentioned imaging element is L1, the pitch is P1, and the length is L2, the pixel size of the above-mentioned imaging element is Ps, and the binning coefficient is N, the control unit, wherein the binning coefficient specified in the first binning condition, N≤L1/Ps, N≤P1/Ps, and N≤L2/Ps A measuring device characterized by determining to satisfy
In Article 2, The above mark is composed of a plurality of line elements extending in a first direction corresponding to the vertical transmission direction of the imaging element, and The above design information includes information on the line width of a line element, the pitch between line elements, and the length of the line element in the first direction. The binning coefficient comprises a first binning coefficient representing the number of adjacent pixels binning in the first direction, and a second binning coefficient representing the number of adjacent pixels binning in the second direction corresponding to the horizontal transmission direction of the imaging element. In the detection surface of the above-mentioned imaging element, when the line width is L1, the pitch is P1, and the length is L2, and the pixel size of the above-mentioned imaging element is Ps, the first binning coefficient is Ny, and the second binning coefficient is Nx, the control unit, wherein the first binning coefficient and the second binning coefficient specified in the first binning condition, Nx≤L1/Ps, Nx≤P1/Ps, and Ny≤L2/Ps A measuring device characterized by determining to satisfy
In Paragraph 3, When Pi is the maximum detectable signal strength in the above-mentioned imaging element and Si is the signal strength that can be measured with the required precision of the mark, the control unit, wherein the binning coefficient specified in the first binning condition, N≤Pi/Si A measuring device characterized by determining to satisfy more.
In Article 1, A measuring device characterized in that the control unit sets the measurement parameters in the first measurement or the second measurement such that the signal strength detected by the imaging element in the first measurement in which the first binning condition is set and the signal strength detected by the imaging element in the second measurement in which the second binning condition is set both fall within a target range.
In Article 6, A measuring device characterized in that the above-mentioned measurement parameter is the accumulation time of the above-mentioned imaging element.
In Article 6, light source and, An illumination optical system that illuminates the substrate using light from the above light source, and The light intensity adjustment unit further adjusts the amount of light that illuminates the substrate by the above-mentioned illumination optical system, A measuring device characterized in that the above-mentioned measurement parameter is at least one of the accumulation time of the imaging element, the gain of the imaging element, the amount of light adjusted by the light amount adjustment unit, the output of the light source, and the optical magnification of the imaging unit.
In Article 1, A substrate stage that holds and moves the above substrate, further having A measuring device characterized in that the above-described control unit performs the first measurement in which the first binning condition is set, controls the substrate stage so that the position of the substrate is aligned with the imaging unit based on the result of the first measurement, and then performs the second measurement in which the second binning condition is set.
In Article 1, The above mark includes a first mark composed of a plurality of line elements extending in a first direction corresponding to the vertical transmission direction of the imaging element, and a second mark composed of a plurality of line elements extending in a second direction corresponding to the horizontal transmission direction of the imaging element. The first measurement above is the measurement of the first mark using the imaging unit, and the second measurement is the measurement of the second mark using the imaging unit, and A measuring device characterized in that the first binning condition includes a first binning coefficient representing the number of adjacent pixels binning in the first direction, and the second binning condition includes a second binning coefficient representing the number of adjacent pixels binning in the second direction.
In Article 1, The above mark includes a first plurality of line elements extending in a first direction corresponding to the vertical transmission direction of the imaging element, and a second plurality of line elements extending in a second direction corresponding to the horizontal transmission direction of the imaging element. The first measurement above is the measurement of the first plurality of line elements using the imaging unit, and the second measurement is the measurement of the second plurality of line elements using the imaging unit, and A measuring device characterized in that the first binning condition includes a first binning coefficient representing the number of adjacent pixels binning in the first direction, and the second binning condition includes a second binning coefficient representing the number of adjacent pixels binning in the second direction.
In Article 1, The above mark includes a first plurality of line elements extending in a first direction corresponding to the vertical transmission direction of the imaging element, and a second plurality of line elements extending in a second direction corresponding to the horizontal transmission direction of the imaging element. The above control unit is, A first measurement area for setting the first binning condition for the detection surface of the imaging element and a second measurement area for setting the second binning condition for the detection surface are set, As the first measurement above, the first plurality of line elements are measured using the first measurement area, and A measuring device characterized by performing measurement of a plurality of line elements of the second using the second measuring area as the second measurement.
A measurement method for measuring the position of a mark based on the result of a first measurement using an imaging unit that captures a mark installed on a substrate, and a second measurement using the imaging unit performed after the first measurement, A process for determining a first binning condition, which is a condition for binning treatment in the first measurement, and a second binning condition, which is a condition for binning treatment in the second measurement, based on the design information of the above mark; A process of performing the first measurement by setting the first binning conditions, and A measurement method characterized by having a process of performing the second measurement by setting the second binning conditions.
As a lithography device for forming a pattern on a substrate, A measuring device described in any one of claims 1 to 12 for measuring the position of a mark installed on the substrate, and A lithography apparatus characterized by having a positioning mechanism that determines the position of the substrate based on the position of the mark measured using the above measuring device.
A process of forming a pattern on a substrate using a lithography apparatus described in claim 14, and A process for processing the substrate on which the above pattern is formed, A method for manufacturing an article characterized by manufacturing an article from the above-mentioned processed substrate.

Description

Measuring device, measuring method, lithography device, and method for manufacturing an article The present invention relates to a measuring device, a measuring method, a lithography device, and a method for manufacturing an article. In lithography devices, such as exposure devices used in lithography processes, it is important to perform alignment between the shot area of a substrate and the original plate, or overlay between different layers on the substrate, at high speed and with high precision. In order to reduce measurement time during alignment, a technique has been proposed to measure the position of a mark by setting a binning process for an imaging element (see Patent Document 1). Patent Document 1 discloses a technique in which a binning process is set to detect a signal by combining several adjacent pixels among a plurality of pixels of an imaging element into one pixel, and sequentially images within a measurement area wider than the measurement field of view at predetermined intervals. The attached drawings are included in the specification, constitute a part thereof, illustrate embodiments of the invention, and are used to explain the principles of the invention together with the description thereof. [Fig. 1a] A diagram showing the configuration of a measuring device. [Fig. 1b] A diagram showing the configuration of the imaging unit. [Fig. 2] Flowchart of the measurement method in the first embodiment. [Fig. 3a] A diagram illustrating the binning process. [Fig. 3b] A diagram illustrating the binning process. [Fig. 3c] A diagram illustrating the binning process. [Fig. 4a] A drawing illustrating the measurement processing in the first embodiment. [Fig. 4b] A drawing illustrating the measurement processing in the first embodiment. [Fig. 4c] A drawing illustrating the measurement processing in the first embodiment. [Fig. 4d] A drawing illustrating the measurement processing in the first embodiment. [Fig. 5a] A diagram showing the relationship between binning conditions and signal intensity detected by the imaging element. [Fig. 5b] A diagram showing the relationship between binning conditions and signal intensity detected by the imaging element. [Fig. 6] Flowchart of the measurement method in the second embodiment. [Fig. 7a] A drawing illustrating the measurement processing in the second embodiment. [Fig. 7b] A drawing illustrating the measurement processing in the second embodiment. [Fig. 8] Flowchart of the measurement method in the third embodiment. [Fig. 9] A drawing illustrating the measurement processing in the third embodiment. [Fig. 10] Flowchart of the measurement method in the fourth embodiment. [Fig. 11] A drawing showing the configuration of an exposure device in the fifth embodiment. [Fig. 12] Flowchart of the exposure method in the fifth embodiment. Hereinafter, embodiments are described in detail with reference to the attached drawings. Furthermore, the following embodiments do not limit the invention according to the claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined at will. Moreover, in the attached drawings, the same reference number is assigned to identical or similar configurations, and redundant descriptions are omitted. <First Embodiment> FIG. 1a is a diagram showing the configuration of a measuring device (100) according to an embodiment. The measuring device (100) is configured to measure the position of a mark installed on a substrate (73). The measuring device (100) has a substrate stage WS that holds the substrate (73), an imaging unit (50), a control unit CU, and a user interface UI. Here, the substrate (73) is a substrate used to manufacture devices such as semiconductor devices or liquid crystal display devices, for example, and specifically, is a wafer, a glass substrate, or other substrate to be processed. A substrate stage WS holds a substrate (73) through a substrate chuck (not shown) and is connected to a stage driving mechanism (not shown). The stage driving mechanism includes a linear motor, etc. and is a positioning mechanism that determines the position of the substrate (73) held in the substrate stage WS by driving the substrate stage WS in the X-axis direction, Y-axis direction, Z-axis direction, and rotational direction with each axis as a rotation axis. The position of the substrate stage WS is monitored, for example, by a 6-axis laser interferometer IF, and the substrate stage WS is driven to a predetermined position under the control of a control unit CU. The control unit CU is composed of a computer (information processing device) including, for example, a CPU or memory, and comprehensively controls each part of the measurement device (100) according to a program stored in the memory unit, etc. The control unit CU also functions as a processing unit that performs various correction processing (calculation processing) on the measu