Search

KR-20260066792-A - Sensor module

KR20260066792AKR 20260066792 AKR20260066792 AKR 20260066792AKR-20260066792-A

Abstract

The present invention relates to a sensor module for a contactless smart card equipped with a biometric function. The sensor module comprises a biometric sensor, e.g., a fingerprint sensor; a micro-controller configured to process a signal detected by the biometric sensor; a security chip configured to store data processed by the micro-controller; and a multilayer PCB substrate having a PCB area, wherein the micro-controller and the security chip are directly mounted on the biometric sensor, and the biometric sensor is mounted on the multilayer PCB substrate to form a stacked structure having a maximum area corresponding to the PCB area. In addition, the present invention relates to a biometric contactless smart card comprising the sensor module and to a method for forming the sensor module and the smart card.

Inventors

  • 리글러 다니엘
  • 닐란트 카르슈텐

Assignees

  • 랑셍 홀딩

Dates

Publication Date
20260512
Application Date
20231017

Claims (16)

  1. A sensor module (100) for a contactless smart card equipped with a biometric recognition function, wherein the sensor module (100) is: - For example, a biometric sensor (110) which is a fingerprint sensor; - A micro-controller (120) configured to process signals detected by the above biometric sensor (110); - A security chip (130) configured to store data processed by the above micro-controller (120); - Includes a multilayer printed circuit board (PCB) substrate (150) having a multilayer printed circuit board (PCB) area, A sensor module in which the micro-controller (120) and the security chip (130) are directly mounted on the biometric sensor (110), and the biometric sensor (110) is mounted on the multilayer PCB substrate (150) to form a stacked structure having a maximum area corresponding to the PCB area.
  2. In claim 1, the multilayer PCB substrate (150) comprises a first PCB (152) and a second PCB (154), forming a sensor module.
  3. In paragraph 2, the sensor module, wherein the second PCB (154) includes a cutting portion (156) for receiving the biometric sensor (110) mounted on the first PCB (152).
  4. In claim 2 or 3, the first PCB (152) comprises a first metal layer (152A), the second PCB (154) comprises a second metal layer (154A) and a third metal layer (154B) formed on opposite sides of the central layer (155), and the first metal layer (152A) is mechanically and/or electrically connected to the second metal layer (154A) of the second PCB (154), a sensor module.
  5. In paragraph 4, the sensor module is mechanically and/or electrically connected to the second metal layer (154A) by means of an adhesive layer (158), an anisotropic conductive film (ACF), stub bump connections and/or solder bump connections.
  6. A sensor module further comprising two antenna pads (140A, 140B) that enable electrical connection with the card antenna of the contactless smart card in any one of the preceding claims.
  7. A sensor module further comprising, in any one of claims 1 to 5, a coupling antenna (142) formed on the multilayer PCB (150) and configured to induce coupling between the biometric sensor (110) and the card antenna of the contactless smart card.
  8. In any one of paragraphs 2 to 7, the sensor module is made of colored PET, for example, any color such as black, red, or gold, and the first PCB (152) is made of colored PET.
  9. A sensor module further comprising, for example, a capacitor, a passive component (160) for antenna matching mounted on the biometric sensor (110) in any one of the prior claims.
  10. In any one of the prior claims, the multilayer PCB substrate (150) has a width (W) included in the range of 6 mm to 13.1 mm, preferably 12.6 mm, and/or a length (L) included in the range of 6 mm to 11.9 mm, preferably 11.4 mm, and has a width (W) and length (L) that comply with the ISO 8 PIN standard defined in, for example, ISO 7816, a sensor module.
  11. In any one of the prior claims, the micro-controller (120) and the security chip (130) are integrated into a single chip, a sensor module.
  12. A contactless smart card (1000) equipped with a biometric recognition function, wherein the contactless smart card is: - Sensor module (100) of any one of claims 1 to 11; - A contactless smart card comprising a card antenna (200) configured to be inductively coupled or electrically connected to the sensor module (100).
  13. A method for forming a sensor module (100) for a contactless smart card (1000) equipped with a biometric recognition function, wherein the method comprises: a) providing a multilayer printed circuit board (PCB) substrate (150) having a multilayer printed circuit board (PCB) region; b) A step of mounting a biometric sensor (110), such as a fingerprint sensor, on the side of the multilayer PCB substrate (150); c) a step of mounting a micro-controller (120) configured to process signals detected by the biometric sensor (110) on the side of the biometric sensor (100) opposite the multilayer PCB substrate (150); d) including the step of mounting a security chip (130) configured to store data processed by the micro-controller (120) on the side of the biometric sensor (100) opposite the multilayer PCB substrate (150), A method for forming a stacked structure having a maximum area corresponding to the above PCB area.
  14. In claim 13, the multilayer PCB substrate (150) comprises a first PCB (152) and a second PCB (154), and step b) is: b1) A step of mounting the above biometric sensor (110) on the first PCB (152); b2) A step of forming a cut portion (156) inside the second PCB (154); b3) A method comprising sub-steps, for example, attaching the second PCB (154) to the first PCB (152) by means of an adhesive layer (158), an anisotropic conductive film (ACF), stub bump connections and/or solder bump connections so that the biometric sensor (110) is placed in the cut portion (156).
  15. In paragraph 13 or 14, e) a method further comprising the step of covering the micro-controller (120) and the security chip (130) by filling the cut portion (156) of the second PCB (154) with underfill material or using gate transfer molding.
  16. A method for forming a contactless smart card (1000) equipped with a biometric recognition function, wherein the method comprises: f) a step of providing a card body (500) for a smart card (1000) - the card body (500) includes a card antenna for contactless communication -; g) A step of forming a cavity (510) in the card body (500); h) forming a sensor module (100) according to the method of any one of claims 13 to 15; i) a step of inserting the sensor module (100) into the cavity (510); j) A method comprising the step of connecting the above card antenna to the sensor module (100) by inductive coupling or galvanic connection.

Description

Sensor module The present invention relates to a sensor module, a method for forming a sensor module, a smart card including a sensor module, and a method for forming a smart card. Smart cards equipped with biometric sensors, such as fingerprint sensors, are commonly used in this field. Biometric sensors provide additional security features for smart cards. Given the widespread use of smart cards equipped with biometric sensors in the banking sector or for access authorization, there is a continuous need for optimizations, for example, to reduce production and manufacturing costs and to enhance reliability and security features. Document US 2021/0117743 A1 discloses, for example, a sensor device and a corresponding dual-interface smart card. The sensor device includes a fingerprint sensor and an antenna coupled to the fingerprint sensor to inductively couple the fingerprint sensor with a booster antenna of the smart card. However, the sensor device of U.S. Patent 2021/0117743 A1 has a complex and large structure, which requires special tools to be implanted into the final card body, and therefore the manufacturing process and the resulting sensor device and smart card are expensive. The present invention will be described in more detail with reference to the accompanying drawings. FIG. 1a schematically shows a plan view of the front portion of a sensor module according to an embodiment of the present invention. FIG. 1b schematically shows a plan view of the rear surface of a sensor module according to an embodiment of the present invention. FIG. 2 schematically shows a cross-sectional view of a sensor module according to an embodiment of the present invention. FIG. 3 schematically shows a detailed view of the base layer of a sensor module according to an embodiment of the present invention. FIG. 4 schematically shows a plan view of a smart card including a sensor module according to an embodiment of the present invention. The present invention is described below with reference to specific embodiments illustrated in the accompanying drawings. However, the present invention is not limited to the specific embodiments illustrated in the following detailed description and drawings. Rather, the described embodiments are merely illustrative of various features of the present invention, and the scope of the present invention is defined in the claims. Further modifications and variations of the present invention will be apparent to those skilled in the art. The sensor module 100 according to the present invention is an all-in-one sensor module for a contactless smart card having a biometric recognition function. FIG. 1a schematically shows a plan view of the front portion of a sensor module 100 according to an embodiment of the present invention. FIG. 1b schematically shows a plan view of the rear surface of a sensor module 100 according to an embodiment of the present invention. The sensor module 100 includes a biometric sensor 110, such as a fingerprint sensor, a micro-controller 120 configured to process a signal detected by the biometric sensor 110, and a security chip 130 configured to store data processed by the micro-controller 120. As shown in FIG. 1b, a biometric sensor 110, a microcontroller 120, and a security chip 130 are formed directly or indirectly on a multilayer PCB substrate 150. In particular, the biometric sensor 110 is formed on the multilayer PCB substrate 150, and the chips 120 and 130 are formed on the biometric sensor 110. Preferably, the biometric sensor 110 is mounted on the multilayer PCB substrate 150 using surface mount technology. Preferably, the microcontroller 120 and the security chip 130 are formed on the biometric sensor 110 using surface mount technology. In this manner, the multilayer PCB 150, the biometric sensor 110, the microcontroller 120, and the security chip 130 form a stacked structure. As can be seen in FIG. 1b, each component of the sensor module 100 has a predefined area. The multilayer PCB substrate 150 has a PCB area with width W and length L as shown in FIG. 1a. As can be seen in the drawings, the maximum area of the stacked structure of the sensor module 100 corresponds to the PCB area. Since biometric and electronic components are laminated on a multilayer PCB substrate 150 and the PCB area is small, the entire sensor module 100 can have a compact and small size. It is desirable to design the PCB area to comply with the ISO 8-pin standard defined in ISO 7816. In this manner, the entire sensor module 100 has an area that complies with the ISO 8-pin standard defined in ISO 7816. For example, as schematically illustrated in FIG. 1a and FIG. 4, the width of the multilayer PCB substrate 150 may be within the range of 6 mm to 13.1 mm, preferably 12.6 mm, and the length of the multilayer PCB substrate 150 may be within the range of 6 mm to 11.9 mm, preferably 11.4 mm. Accordingly, the width of the sensor module 100 may be within the range of 6 mm to 13.1 mm, preferably