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KR-20260066877-A - COIL ELECTRONIC COMPONENT

KR20260066877AKR 20260066877 AKR20260066877 AKR 20260066877AKR-20260066877-A

Abstract

A coil electronic component according to one embodiment comprises a body including a magnetic material, a coil embedded in the body and including a plating film, and an insulating member made of glass material covering the coil, wherein the plating film may include a first plating film and a second plating film covering the first plating film.

Inventors

  • 박정민
  • 김범석

Assignees

  • 삼성전기주식회사

Dates

Publication Date
20260512
Application Date
20241105

Claims (16)

  1. A body containing magnetic material, A coil embedded in the above body and comprising a plating film, and A glass insulating member covering the above coil Includes, The above plating film comprises a first plating film and a second plating film covering the first plating film. A coil electronic component including
  2. In paragraph 1, A coil electronic component, wherein a portion of the first plating film is in contact with the second plating film and the remainder is in contact with the insulating member.
  3. In paragraph 1, The above coil includes a first coil pattern and a second coil pattern, and The above insulating member comprises an inner insulating member disposed between the first coil pattern and the second coil pattern, forming a coil electronic component.
  4. In Paragraph 3, The above inner insulating member includes a first support surface and a second support surface facing each other, and The first coil pattern is disposed on the first support surface, and The above second coil pattern is a coil electronic component disposed on the above second support surface.
  5. In Paragraph 4, A coil electronic component further comprising a first via that penetrates the inner insulating member and connects the first coil pattern and the second coil pattern to each other.
  6. In paragraph 1, The above insulating member comprises an outer insulating member disposed between the coil and the body, forming a coil electronic component.
  7. In paragraph 6, The above-mentioned outer insulating member is a coil electronic component disposed on the outer surface of the coil.
  8. In paragraph 6, The above second plating film is a coil electronic component in contact with the above outer insulating member.
  9. In paragraph 1, The above body includes a first surface and a second surface facing each other in a first direction, and The above coil includes a plurality of turns wound around the winding axis of the first direction, and The above insulating member is a coil electronic component comprising an insulating partition disposed between turns of the coil.
  10. In paragraph 1, The above insulating member is a coil electronic component comprising photosensitive glass.
  11. In paragraph 1, The above insulating member comprises at least one of SiO2 - B2O3 - based glass, SiO2 - B2O3 - K2O - based glass, SiO2 - B2O3 - Li2O - CaO -based glass, SiO2 - B2O3 - Li2O -CaO- ZnO -based glass, and Bi2O3 - B2O3 -SiO2 - Al2O3 - based glass, a coil electronic component.
  12. In Paragraph 11, The above insulating member further comprises at least one of quartz, alumina, magnesia, silica, forsterite ( Mg₂SiO₄ ), steatite ( H₂Mg₃ ( SiO₃ ) ₄ ) and zirconia, forming a coil electronic component.
  13. In paragraph 1, The above body includes a first surface and a second surface facing each other in a first direction, and The above coil is wound around the winding axis of the first direction, and The above coil is a coil electronic component comprising a lead terminal exposed from the first surface or the second surface of the body.
  14. In Paragraph 13, A coil electronic component further comprising an external electrode disposed outside the body and connected to the lead terminal.
  15. In Paragraph 14, The above external electrode is a coil electronic component disposed on the first surface or the second surface of the body.
  16. In paragraph 1, A coil electronic component further comprising a surface insulating layer disposed on the outer surface of the above body.

Description

Coil Electronic Components The present disclosure relates to a coil electronic component. Recently, as the functions of mobile devices have become more diverse and power consumption has increased, low-loss and highly efficient coil electronic components are being adopted around power management integrated circuits (PMICs) to extend battery life within mobile devices. There is a growing demand for thin-wall power inductors to slim down products and increase the freedom of component placement. Among these, thin-film inductors can be manufactured by forming coils on a support member using sputtering or plating. However, the support member can be deformed by heat or pressure during the manufacturing process. If the support member is deformed, the alignment of the coils becomes disrupted, potentially leading to coil exposure or short circuits, which can degrade the reliability of the thin-film inductor. FIG. 1 is a perspective view schematically showing a coil electronic component according to one embodiment. Figure 2 is a schematic cross-sectional view taken along the line I-I' of Figure 1. Figure 3 is a schematic cross-sectional view taken along the line II-II' of Figure 1. Figure 4 is a cross-sectional view schematically showing the coil of Figure 1. FIGS. 5 to 19 are drawings sequentially illustrating a method for manufacturing a coil electronic component according to one embodiment. Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the invention. In order to clearly explain the invention in the drawings, parts unrelated to the explanation have been omitted, and the same reference numerals have been used for identical or similar components throughout the specification. Furthermore, in the attached drawings, some components may be exaggerated, omitted, or schematically depicted, and the size of each component does not entirely reflect its actual size. The attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings; it should be understood that all modifications, equivalents, and substitutions included within the concept and technical scope of the present invention are included. Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. Furthermore, when it is said that a part, such as a layer, membrane, region, or plate, is "on" or "on" another part, this includes not only the case where it is "directly above" the other part, but also the case where there is another part in between. Conversely, when it is said that a part is "directly above" another part, it means that there is no other part in between. Also, saying that a part is "on" or "on" a reference part means that it is located above or below the reference part, and does not necessarily mean that it is located "on" or "on" in the direction opposite to gravity. Throughout the specification, terms such as “comprising” or “having” are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. Accordingly, when a part is said to “comprising” a certain component, unless specifically stated otherwise, this means that it may include additional components rather than excluding other components. Additionally, throughout the specification, "planar" means when the subject part is viewed from above, and "cross-sectional" means when the cross-section obtained by vertically cutting the subject part is viewed from the side. Furthermore, throughout the specification, when the term "connected" is used, it does not mean only that two or more components are directly connected, but may also mean that two or more components are indirectly connected through other components, that they are connected not only physically but also electrically, or that they are a single unit although referred to by different names depending on their location or function. FIG. 1 is a perspective view schematically showing a coil electronic component according to one embodiment, FIG. 2 is a schematic cross-sectional view taken along the line I-I' of FIG. 1, and FIG. 3 is a schematic cross-sectional view taken along the line II-II' of FIG. 1. Referring to FIGS. 1, 2, and 3, the coil electronic component (1000) includes a body (100), a coil (200), an insulating member (300), a first external electrode (700), a second external electrode (800), and a surface insulating layer (900). The bo