KR-20260066914-A - High Power?LED?Package and Manufacturing Method Thereof

Abstract

The present invention relates to a high-brightness and high-output light-emitting LED package using an LED element as a light source and a method for manufacturing the same. The invention comprises: a printed circuit board having an upper electrode having an insulating pattern with an uneven structure formed on the upper surface of a substrate, and an anode electrode, a cathode electrode, and a heat sink attached to the lower surface, which are insulated from each other by the insulating pattern, and electrode connection holes formed with a conductive plating film to electrically connect the upper electrode, the anode electrode, and the cathode electrode, respectively, and an LED cavity formed in a part of the portion coupled to the heat sink; a light-emitting chip mounted on the heat sink in the portion where the LED cavity is formed; and a wire electrically connecting the light-emitting chip and the upper electrode. A lens manufactured by transfer molding that covers the light-emitting chip of the printed circuit board, wherein the upper electrode of the printed circuit board is formed in an uneven pattern to prevent the lens from detaching, thereby enhancing the heat dissipation effect from the LED element during light emission and preventing the detachment of the mold resin.

Inventors

• 민승천

Assignees

• 민승천

Dates

Publication Date

20260512

Application Date

20241105

Claims (1)

1. A high-power LED package comprising: an upper electrode layer having an insulating pattern with an uneven structure formed on the upper surface of a substrate, an anode electrode, a cathode electrode, and a heat sink attached to the lower surface of the substrate, which are insulated from each other by the insulating pattern, an electrode connection hole formed with a conductive plating film to electrically connect the upper electrode, the anode electrode, and the cathode electrode, respectively, and an LED cavity formed in a part of the portion coupled to the heat sink; a light-emitting chip mounted on the heat sink in the portion where the LED cavity is formed; a wire electrically connecting the light-emitting chip and the upper electrode; and a lens manufactured by transfer molding that covers the light-emitting chip, wherein the upper electrode is formed with an uneven pattern to prevent the lens from detaching.

Description

High Power LED Package and Manufacturing Method Thereof High Power LED Package and Manufacturing Method Thereof The present invention relates to a high-brightness and high-output light-emitting LED package using an LED element as a light source and a method for manufacturing the same. More specifically, the invention relates to an LED package and a method for manufacturing the same that can enhance the heat dissipation effect from the LED element during light emission and prevent delamination of a lens made of molded resin. Conventional LED packages having LED elements as light sources operate by mounting the LED elements on a substrate, electrically connecting them to a power source, and then causing them to emit light. FIG. 1 is a cross-sectional view illustrating an LED package according to the present invention. FIG. 1 is a cross-sectional view illustrating an LED package according to the present invention, FIG. 2a to 2g are cross-sectional views sequentially illustrating a method for manufacturing a printed circuit board according to the present invention, and FIG. 3a to 3d are layers illustrating a printed circuit board according to the present invention.